JPH0142333Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a solid state composite circuit component based on a ceramic base with a built-in capacitor function and having means for attaching diodes, coils, other capacitors, etc.

A conventional printed wiring board consists of an insulating substrate with a conductive pattern printed on it, and various elements must be fixed and soldered to predetermined locations one by one. The object of the present invention is to provide a solid-state composite circuit component with a built-in capacitor function that can be easily soldered to a printed circuit board as a unit having a unit circuit function. The circuit component of the present invention is made of a ceramic substrate on which wiring is carried out using space on the front and/or back surfaces, various elements are baked or attached, and a capacitor function is built inside. In order to print wiring conductors on such ceramic substrates and attach small electronic devices, it is necessary to position and solder the electronic devices to appropriate parts of the conductor, but it is difficult to correctly position small chip-shaped components. .

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a composite electronic component with a built-in capacitor function, which has mounting means convenient for mounting chip-type electronic elements, particularly chip-type diodes.

Briefly stated, the present invention forms a fitting hole in a part of the surface of a ceramic substrate with a built-in capacitor that matches the external shape of a chip-type electronic component, and by fitting the electronic component into the hole, the chip-type electronic component Accurate positioning, ease of assembly, and ease of soldering or electrical connection.

The invention will now be described in detail with reference to the illustrated embodiments.

1 to 3 show the manufacturing method and structure of a ceramic base portion with a built-in multilayer capacitor in a composite circuit component. As shown in Figure 1, BaTiO ₃ , TiO ₂
Alternatively, a paste of metal powder such as Ag-Pd or Pd is printed on sheet 1 (unfired sheet) made of another ceramic powder base to form capacitor electrodes.
Forms C ₁ and C ₂ . These electrodes can have a number and area depending on the design, but for convenience of explanation, two
Limited to individuals. Next, as shown in FIG. 2, a second ceramic sheet 2 (made of the same material as the sheet 1) is superimposed on this, and electrode layers C ₁ ' and C ₂ ' are printed thereon. The electrode layers C ₁ and C ₂ are exposed on the lower side of the sheet 1,
It should also be noted that the electrode layers C ₁ ′ and C ₂ ′ are designed to overlap with C ₁ and C ₂ and to be exposed on the upper side of the stack. By repeating the steps shown in FIGS. 1 and 2 a necessary number of times, two capacitors having predetermined capacitance values can be constructed. Finally, as shown in FIG. 3, a ceramic layer 3 similar to the first layer is laminated to obtain a base portion A. This layer 3 is necessary to prevent the electrode lead-out portion of the multilayer capacitor from interfering with the lead-out terminal of the diode.

Next, FIG. 4 shows the structure of a second base part B which is superimposed on the base part A shown in FIG. The base part B is made of a ceramic sheet 4 (unfired) made of the same or different ceramic material used for the base part A, and has a rectangular through hole 5 in its surface. The ceramic sheet 4 has a thickness comparable to or thinner than that of the chip-type electronic component, and has holes 5.
is made by punching, and its outline is made to approximately match the external shape of a chip-type electronic component (described later). The through holes 5 are formed on both sides of the capacitor of the base portion A so as not to interfere with the capacitor in terms of capacitance.

Next, the first base part A and the second base part B are aligned and stacked vertically as shown in FIG. 5, and the minimum pressure required for joining is applied. Next, this superimposed body is placed in a firing furnace and fired at a predetermined high temperature to form an integral sintered body. After the firing is completed, the necessary prints, such as conductor patterns 6 to 6, are printed as shown in Figure 6.
9, terminal electrodes 10, 11, 11', 12, 12',
Then, print and bake the resistive layers R ₁ and R ₂ .

Since the circuit component of the present invention has the above-described configuration, a chip-type electronic component (FIG. 7) having an outer shape matching the shape of the hole 5 can be easily attached. That is, as shown in FIG. 7, the chip type electronic component has external terminals 16, 1 at both ends of rectangular diodes D ₁ and D ₂ .
6'. Therefore, when these chip diodes D ₁ , D ₂ are fitted into the holes 5, 5 of the ceramic base of FIG. 6, positioning can be achieved automatically. Furthermore, external terminals 16, 16'
Since these are close to or in contact with the terminal electrodes 11, 11' and 12, 12', the circuit is completed by applying solder or conductive resin there. FIG. 8 shows the circuit configuration of the composite circuit component thus obtained.

As described above, according to the present invention, a composite circuit component that is excellent in various aspects can be obtained. Note that this circuit component can be attached to the specified location on the printed circuit board as it is,
Connections are made by soldering using external conductive patterns and edges 6-10.

[Brief explanation of the drawing]

Figures 1 to 3 show the first circuit components of the present invention.
Fig. 4 is a plan view showing the structure of the second base part, Fig. 5 is a perspective view showing the two laminated base parts, and Fig. 6 is the finished product. FIG. 7 is a perspective view of a chip type diode attached to the circuit component of the present invention, and FIG. 8 is a circuit diagram of the assembled composite circuit component. The main parts in the diagram are as follows. 1, 2, 3, 4: ceramic sheet, 5: hole,
A: first base part, B: second base part, C:
Chip type diode.

Claims (1)

[Scope of utility model registration request] A first ceramic base portion whose surface is covered with a ceramic layer of a laminate made of a plurality of laminated ceramic sheets each having two or more sets of capacitor electrodes printed approximately in the center thereof, and integrally superimposed on the first ceramic base portion. and has a through hole for receiving a diode on both sides of the capacitor electrode.
a ceramic base, a diode fitted into the through hole, a plurality of resistance layers formed on the surface of the second ceramic base, and both ends of the through hole formed on the surface of the second ceramic base. and a printed wiring conductor having a lead-out portion from both ends of the resistor.