JPS6031243Y2 - composite parts - Google Patents

composite parts

Info

Publication number
JPS6031243Y2
JPS6031243Y2 JP1980115095U JP11509580U JPS6031243Y2 JP S6031243 Y2 JPS6031243 Y2 JP S6031243Y2 JP 1980115095 U JP1980115095 U JP 1980115095U JP 11509580 U JP11509580 U JP 11509580U JP S6031243 Y2 JPS6031243 Y2 JP S6031243Y2
Authority
JP
Japan
Prior art keywords
layer
composite component
present
laminate
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980115095U
Other languages
Japanese (ja)
Other versions
JPS5739427U (en
Inventor
哲生 高橋
稔 高谷
次男 池田
Original Assignee
ティーディーケイ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ティーディーケイ株式会社 filed Critical ティーディーケイ株式会社
Priority to JP1980115095U priority Critical patent/JPS6031243Y2/en
Publication of JPS5739427U publication Critical patent/JPS5739427U/ja
Application granted granted Critical
Publication of JPS6031243Y2 publication Critical patent/JPS6031243Y2/en
Expired legal-status Critical Current

Links

Description

【考案の詳細な説明】 本考案は複合部品、特に独立した機能を有する少くとも
2つの受動素子を合体させた複合部品に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite component, particularly a composite component that combines at least two passive elements with independent functions.

本考案者等は印刷積層技術を応用してり、 C。The present inventors applied printing lamination technology, and C.

Rの2つ以上の機能を結合した積層複合部品を種々提案
した。
We have proposed various laminated composite parts that combine two or more functions of R.

しかしながら、これらはいずれも一定の回路機能を全体
として持たせたものであるからその用途が限定される。
However, since all of these devices have a certain circuit function as a whole, their applications are limited.

本考案は同じ積層技術を利用して独立した回路機能、特
にり、 Cを備えたチップ型積複合部品を提供する。
The present invention utilizes the same stacking technology to provide a chip-type multilayer composite component with independent circuit functions, especially C.

本考案の複合部品は、電気絶縁性の素体、特に絶縁体層
の積層体中に少くとも2個の受動素子比又はLRを理込
み或いは合体させて一体化し、それらの引出部を素体の
外周面の孤立した個所に引出すと共に外部端子被膜を同
じく孤立的に被着したものから成る。
The composite component of the present invention has at least two passive element ratios or LR integrated into an electrically insulating element body, especially a laminate of insulating layers, and their lead-out portions are integrated into the element body. The terminal is drawn out at an isolated location on the outer circumferential surface of the terminal, and the external terminal coating is similarly applied in an isolated location.

より具体的にはLC又はLR(以下比のみについて述べ
る)複合部品は複数の磁性体層と線状導体とを導体が全
体として一本の渦巻パターンとなるように交互積層した
第1の積層体、及び誘電体(場合により磁性体も可)と
電極とを交互積層した第2の積層体を重量合体させ、導
体の両末端及び電極の引出端を積層体の周辺に露出させ
てそこに各々の外部端子層を被着させたものである。
More specifically, the LC or LR (only the ratio will be described below) composite component is a first laminate in which a plurality of magnetic layers and a linear conductor are alternately laminated so that the conductors form a single spiral pattern as a whole. , and a second laminate in which a dielectric material (or a magnetic material is also possible in some cases) and an electrode are stacked together by weight, and both ends of the conductor and the lead-out end of the electrode are exposed around the laminate and each is placed there. The external terminal layer is coated with the external terminal layer.

従って、互に独立したC及びLが単一のチップ型複合部
品に一体的に組込まれ、しかもそれらが別々に外部回路
へ接続できる。
Therefore, mutually independent C and L are integrated into a single chip-type composite component, and yet they can be separately connected to external circuits.

製鉄工程上は印刷及び積層技術により一貫した工程で本
部品は製造でき、また並列的に多数の部品を同時生産す
ることで生産性も上げられるし、さらに完成した本部品
は機械的に強く、取扱いに便利で、外部端子を利用して
プリント配線基板へ直づけができるなどの多くの利益が
提供できる。
In the steel manufacturing process, this part can be manufactured in a consistent process using printing and lamination technology, and productivity can be increased by simultaneously producing many parts in parallel.Furthermore, the completed part is mechanically strong, It offers many benefits, such as convenient handling and the ability to be directly attached to a printed wiring board using external terminals.

なお、さらにもう一つの積層体(抵抗、コイル又はコン
デンサ)を複合させることも本考案に含まれる。
Note that the present invention also includes combining yet another laminate (resistor, coil, or capacitor).

以下図面を参照して本考案を詳しく説明する。The present invention will be described in detail below with reference to the drawings.

説明はLC複合部品に限定されるが、これは1例と考え
るべきである。
Although the description is limited to LC composite parts, this should be considered as an example.

以下の説明で磁性体層及び誘電体層(場合により磁性体
で構成してその誘電率を利用する)は磁性フェライト粉
末及び誘電体(TiO2,BaTiO3等)をそれぞれ
バインダーを用いてペースト化したものから印刷して、
または延ばしてシート化して得るものとする。
In the following explanation, the magnetic layer and the dielectric layer (sometimes made of a magnetic material to utilize its dielectric constant) are made by pasting magnetic ferrite powder and dielectric material (TiO2, BaTiO3, etc.) using a binder, respectively. Print from
Or it can be obtained by rolling it out and making it into a sheet.

導体及び電極はPd、 Ag−Pd等の金属粉末を適宜
のバインダーでペースト化したものを磁性体層または誘
電体層上へ印刷して得るものとする。
The conductors and electrodes are obtained by printing a paste of metal powder such as Pd or Ag-Pd with a suitable binder onto the magnetic layer or dielectric layer.

そして積層が終った後にこれらは一緒に所定温度で焼成
されて一体化されるものとする。
After the lamination is completed, they are fired together at a predetermined temperature to be integrated.

また外部端子はAg。Cu、 Ni、或いは他の導体粉
末のペーストを塗布し焼付けて形成するものとする。
Also, the external terminal is Ag. It is assumed that it is formed by applying and baking a paste of Cu, Ni, or other conductor powder.

さて、L部分を製造する工程を示す第1〜6図を参照す
る。
Now, reference is made to FIGS. 1 to 6 showing the process of manufacturing the L section.

先ず第1図のように磁性体層1を長方形に形成し、次に
第2図のように導体2を磁性体層1の上辺に片寄らせて
線状に印刷し、その際に一端a′を磁性体層1の左辺に
露出させる。
First, as shown in FIG. 1, the magnetic layer 1 is formed into a rectangular shape, and then, as shown in FIG. is exposed on the left side of the magnetic layer 1.

第3図の工程に移り、導体2の右端を露出させたまま磁
性体層1の左側全面に磁性体層3を形成し、第4図の工
程において導体4を導体2に接続するようにほぼL字形
に印刷し、さらに第5図のように導体4の左端を露出さ
せたまま積層体の右側部分の全面に磁性体層5を積層し
、その際に右端b′を積層体の右辺に露出させる。
3, the magnetic layer 3 is formed on the entire left side of the magnetic layer 1 while leaving the right end of the conductor 2 exposed, and in the step of FIG. 4, the conductor 4 is almost connected to the conductor 2. The magnetic material layer 5 is printed on the entire right side of the laminate while leaving the left end of the conductor 4 exposed as shown in Fig. 5, and at this time, the right end b' is placed on the right side of the laminate. expose.

なお積層は必要なだけ反復することができる。Note that the lamination can be repeated as many times as necessary.

次に第7〜11図はC部分の製造工程を示し、第6図の
工程に続いて誘電体層7(または磁性体層)を積層体の
全面に形成しミその上に第8図のように引出端C′を積
層体上辺に露出するようにして電極8を印刷し、さらに
その上に誘電体層9を全面に形成する。
Next, FIGS. 7 to 11 show the manufacturing process of part C. Following the process in FIG. 6, a dielectric layer 7 (or magnetic layer) is formed on the entire surface of the laminate, and then The electrode 8 is printed so that the lead end C' is exposed on the upper side of the laminate, and the dielectric layer 9 is further formed on the entire surface.

第10図の工程に移って誘電体層9の上に第2の電極1
0を印刷し、その際に引出端d′を積層体の下辺に引出
し、最後に第1′1図のように誘電体層11を全面に積
層する。
10, the second electrode 1 is placed on the dielectric layer 9.
0 is printed, and at this time, the lead-out end d' is drawn out to the lower side of the laminate, and finally, the dielectric layer 11 is laminated on the entire surface as shown in FIG. 1'1.

なお上記の工程の実用的な実施は層1.3.5. 7゜
9.11を広い面積のシートを用いて並列的に行い、第
11図の工程の後に単位の大きさにカットすることにな
る。
Note that the practical implementation of the above steps is layer 1.3.5. 7°9.11 is performed in parallel using sheets with a wide area, and after the process shown in FIG. 11, they are cut into unit sizes.

次で焼成炉内で必要な焼成を行って一体化した焼成体を
得る。
Next, necessary firing is performed in a firing furnace to obtain an integrated fired body.

次で第12図のように周縁に露出する引出−′、b′、
c′、d′にそれぞれ接続する外部端子被膜a、 b、
c、 dを塗布し焼付ける。
Next, as shown in Fig. 12, the drawers exposed on the periphery -', b',
external terminal coatings a, b, connected to c', d', respectively;
Apply c and d and bake.

こうして得られた積層部品の等他回路は第13図に示す
回路構成を有する。
The circuit of the laminated component thus obtained has the circuit configuration shown in FIG.

このに複合部品は相互に独立しているから、単一の部品
で数多くの回路を構成するために使用できる。
Because composite components are mutually independent, a single component can be used to construct numerous circuits.

例えば、プリント基板の配線を利用してLCを直列、並
列のいずれにもできるし、他の回路へ任意の態様で接続
することもでき、バイパス、ローパスフィルターや、プ
レイライン等色々な応用が可能となる。
For example, LCs can be connected in series or parallel using printed circuit board wiring, and can be connected to other circuits in any manner, allowing for various applications such as bypass, low-pass filters, play lines, etc. becomes.

第14図に示すようにプリント基板12に図示のパター
ンのプリント配線を行い、これに4個の本例複合部品を
半田づけすると、第15図に示したバンドパスフィルタ
ーが構成できる。
As shown in FIG. 14, by printing wiring in the pattern shown on the printed circuit board 12 and soldering the four composite parts of this example, the bandpass filter shown in FIG. 15 can be constructed.

なおA、 B、 Cは第14図、第15図の対応端子を
示す。
Note that A, B, and C indicate corresponding terminals in FIGS. 14 and 15.

第16図は上記例の変形例を示す平面図で、上側におい
て第11図の工程後にL値調整用のトリミング孔14を
複合部品中央に形成し、或いはさらにここに磁気コアを
挿入することができる。
FIG. 16 is a plan view showing a modification of the above example, in which a trimming hole 14 for adjusting the L value is formed in the center of the composite part after the process shown in FIG. 11 on the upper side, or a magnetic core is further inserted here. can.

本例によれば複合部品の応用範囲が非常に広くなる。According to this example, the range of applications of composite parts is greatly expanded.

第17図は第1〜13図に示した例の他の変形例を示す
FIG. 17 shows another modification of the example shown in FIGS. 1-13.

本例では第11図の工程後にさらにもう1つの電極15
を印刷する。
In this example, one more electrode 15 is added after the process shown in FIG.
print.

この電極15には鋸歯状部が形成されており、この部分
を削り取ることによりC値の調整を行うことができる。
This electrode 15 has a serrated portion, and by scraping off this portion, the C value can be adjusted.

第18図は、本考案の更に他の実施例によるm複合部品
の斜視図である。
FIG. 18 is a perspective view of an m-composite component according to still another embodiment of the present invention.

本例の複合部品の製造土程は第1〜12図に関して示し
たものと実質的に同一であるがJただ第8図及び第10
図の工程に対応する本例の工程では、電極の引出部を積
層体の上下辺の代りに左下隅及び右下隅に設けた点がち
がう。
The manufacturing process for the composite part of this example is substantially the same as that shown with respect to Figures 1-12, except for Figures 8 and 10.
The process of this example, which corresponds to the process shown in the figure, is different in that the lead-out portions of the electrodes are provided at the lower left corner and the lower right corner instead of at the upper and lower sides of the laminate.

そして第18図に示すように互に孤立した外部端子a、
b、C,dは積層体の隅部に設けられる。
As shown in FIG. 18, external terminals a, which are isolated from each other,
b, C, and d are provided at the corners of the laminate.

なおat by ct aは第12図の記号に対
応する。
Note that at by ct a corresponds to the symbols in FIG.

第19図は本考案の更に他の実施例によるに複合部品を
示す平面図である。
FIG. 19 is a plan view showing a composite part according to still another embodiment of the present invention.

同図は第18図の例で内部の導体及び電極に達しない切
込み17を設けることにより、プリント基板への取付時
の位置規制に便利なようにしたものである。
This figure shows the example of FIG. 18, in which notches 17 that do not reach the internal conductors and electrodes are provided to conveniently regulate the position when mounting on a printed circuit board.

以上のように、本考案は実施例について説明した主要な
作用効果の他に、さらにチップ型複合部品であるが故の
種々の利益を提供することは既に述べた通りである。
As mentioned above, in addition to the main effects described in the embodiments, the present invention provides various benefits due to being a chip-type composite component.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図、第3図、第4図、第5図、第6図、第
7図、第8図、第9図、第10図及び第11図はそれぞ
れ本考案のLC複合部品の製造工程の各段階における平
面図、第12図は本考案の圧複合部品の斜視図、第13
図は同回路図、第14図は本考案のLC複合部品をプリ
ント基板に取付けた平面図、第15図は同回路図、第1
6図は本考案の他の実施例によるLC複合部品の平面図
、及び第17図は本考案のさらに他の実施例の平面図、
第18図は本考案の値の実施例の比複合部品の斜視図、
及び第19図は本考案のさらに他の実施例例によるLC
複合部品の平面図である。 図中主な部分は次の通りである。1、3.5・・・・・
・磁性体層、?、 9. 11・曲・誘電体層、2.
4. 6・・・・・・コイル用導体、8,1゜・・・・
・・コンデンサ用電極、a、 b、 C9d・・・・・
・外部端子。
Figures 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, and 11 are the LC composites of the present invention, respectively. Fig. 12 is a perspective view of the pressure composite part of the present invention; Fig. 13 is a plan view at each stage of the manufacturing process of the part;
The figure is the same circuit diagram, Figure 14 is a plan view of the LC composite component of the present invention attached to a printed circuit board, Figure 15 is the same circuit diagram,
FIG. 6 is a plan view of an LC composite component according to another embodiment of the present invention, and FIG. 17 is a plan view of still another embodiment of the present invention.
FIG. 18 is a perspective view of a composite component according to an embodiment of the present invention;
and FIG. 19 shows an LC according to still another embodiment of the present invention.
FIG. 3 is a plan view of the composite component. The main parts in the figure are as follows. 1, 3.5...
・Magnetic layer? , 9. 11. Curved dielectric layer, 2.
4. 6... Coil conductor, 8,1°...
...Capacitor electrode, a, b, C9d...
・External terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁性磁性体層と線状印刷導体との交互積層体を前記導
体が前記磁性体の縁部を介してそれらの層間から他の層
間へと垂直なほぼ筒状面内を渦巻き状に延びるように形
成したものと、誘電体層と印刷電極との交互積層体を該
極間に容量が形相されるように形成したものとを一体的
に重畳し、前記導体及び電極の引出部に接続するそれぞ
れ別個の外部端子を前記重畳体の外面に被着して成る複
合部品。
A stack of alternately laminated insulating magnetic layers and linear printed conductors is formed such that the conductors spirally extend from one layer to another in a perpendicular substantially cylindrical plane via the edge of the magnetic material. and a layer formed by alternately laminating dielectric layers and printed electrodes so that a capacitance is formed between the electrodes are integrally superimposed and connected to the lead-out portions of the conductor and electrode. A composite component comprising separate external terminals attached to the outer surface of the stacked body.
JP1980115095U 1980-08-15 1980-08-15 composite parts Expired JPS6031243Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980115095U JPS6031243Y2 (en) 1980-08-15 1980-08-15 composite parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980115095U JPS6031243Y2 (en) 1980-08-15 1980-08-15 composite parts

Publications (2)

Publication Number Publication Date
JPS5739427U JPS5739427U (en) 1982-03-03
JPS6031243Y2 true JPS6031243Y2 (en) 1985-09-18

Family

ID=29476043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980115095U Expired JPS6031243Y2 (en) 1980-08-15 1980-08-15 composite parts

Country Status (1)

Country Link
JP (1) JPS6031243Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2819643B2 (en) * 1989-08-10 1998-10-30 株式会社村田製作所 Resonator and bandpass filter

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010566A (en) * 1973-05-25 1975-02-03
JPS50109465A (en) * 1974-02-04 1975-08-28
JPS5583221A (en) * 1978-12-20 1980-06-23 Tdk Electronics Co Ltd Composite component
JPS5591103A (en) * 1978-12-28 1980-07-10 Tdk Corp Laminated inductor

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4893347U (en) * 1972-02-15 1973-11-08
JPS5568309U (en) * 1978-11-06 1980-05-10
JPS5919367Y2 (en) * 1978-12-18 1984-06-05 株式会社ニコン sliding resistor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010566A (en) * 1973-05-25 1975-02-03
JPS50109465A (en) * 1974-02-04 1975-08-28
JPS5583221A (en) * 1978-12-20 1980-06-23 Tdk Electronics Co Ltd Composite component
JPS5591103A (en) * 1978-12-28 1980-07-10 Tdk Corp Laminated inductor

Also Published As

Publication number Publication date
JPS5739427U (en) 1982-03-03

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