JPS59101428U - thick film capacitor - Google Patents

thick film capacitor

Info

Publication number
JPS59101428U
JPS59101428U JP20178982U JP20178982U JPS59101428U JP S59101428 U JPS59101428 U JP S59101428U JP 20178982 U JP20178982 U JP 20178982U JP 20178982 U JP20178982 U JP 20178982U JP S59101428 U JPS59101428 U JP S59101428U
Authority
JP
Japan
Prior art keywords
thick film
film capacitor
firing
printing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20178982U
Other languages
Japanese (ja)
Inventor
棚橋 万起
八段 英明
純夫 堀池
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to JP20178982U priority Critical patent/JPS59101428U/en
Publication of JPS59101428U publication Critical patent/JPS59101428U/en
Pending legal-status Critical Current

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の厚膜コンデンサの断面図である。 第2図A、 Bはこの考案の実施例である厚膜コンデン
サの平面図、A−A断面図であるリド・・セラミック基
板、2・・・下部電極、3・・・誘電体層、4・・・、
上部電極、5.5′・・・エツジ部、−6・・・配線パ
ターン、7・・・ワイヤ。
FIG. 1 is a cross-sectional view of a conventional thick film capacitor. Figures 2A and 2B are plan views and AA cross-sectional views of a thick film capacitor that is an embodiment of this invention. ...,
Upper electrode, 5.5'... Edge portion, -6... Wiring pattern, 7... Wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に導電体ペーストを印刷、焼成して形成□した下
部電極と、この上に誘電体ペーストを印刷、焼成して形
成した誘電体層と、さらにこの上に導電体ペーストを印
刷、焼成して形成した上部電極とで構成される積層構造
の厚膜コンデンサにおいて、前記上部電極と基板上の配
線パターンとをワイヤボンディングにより接続したこと
を特徴とする厚膜コンデンサ。
A lower electrode is formed by printing and firing a conductive paste on the substrate, a dielectric layer is formed by printing and firing a dielectric paste on top of this, and a dielectric layer is formed by printing and firing a conductive paste on top of this. What is claimed is: 1. A thick film capacitor having a laminated structure comprising an upper electrode formed using a laminate, wherein the upper electrode and a wiring pattern on a substrate are connected by wire bonding.
JP20178982U 1982-12-24 1982-12-24 thick film capacitor Pending JPS59101428U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20178982U JPS59101428U (en) 1982-12-24 1982-12-24 thick film capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20178982U JPS59101428U (en) 1982-12-24 1982-12-24 thick film capacitor

Publications (1)

Publication Number Publication Date
JPS59101428U true JPS59101428U (en) 1984-07-09

Family

ID=30427277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20178982U Pending JPS59101428U (en) 1982-12-24 1982-12-24 thick film capacitor

Country Status (1)

Country Link
JP (1) JPS59101428U (en)

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