JPS5834772U - electrical circuit equipment - Google Patents
electrical circuit equipmentInfo
- Publication number
- JPS5834772U JPS5834772U JP12896081U JP12896081U JPS5834772U JP S5834772 U JPS5834772 U JP S5834772U JP 12896081 U JP12896081 U JP 12896081U JP 12896081 U JP12896081 U JP 12896081U JP S5834772 U JPS5834772 U JP S5834772U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- brazing material
- circuit
- circuit boards
- electrical circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の回路装置の一部を説明的に示す斜視図で
ある。第２図〜第８図は本考案の実施例に係わる回路装
置の一部を説明的に示すものであり、第２図は分割前の
基板を示す平面図、第３図は第２図の基板の底面図、第
４図は基板に回路素子及びリード部材を結合した状態を
示す平面図、第５図は第１及び第２の回路基板を分割し
て積層した状態を示す平面図、第６図は第５図のＶＩ−
ＶＩ線断面図、第７図は第５図の積層体に半田を被着さ
せた状態を示す平面図、第８図は第７図の積層体を説明
的に示す斜視図である。
尚図面に用いられている符号に於いて、１１は第１の回
路基板、１２は第２の回路基板、１３は貫通孔、１３ａ
は上の溝、１３ｂは下の溝、１４はスリット、１７は第
１の回路導体、１８は第２の回路導体、１９は導体被膜
、２４は接着材、２５は半田である。
第６図
１２
第７図
３１２５FIG. 1 is a perspective view illustrating a part of a conventional circuit device. 2 to 8 are explanatory diagrams of a part of the circuit device according to the embodiment of the present invention. FIG. 2 is a plan view showing the board before division, and FIG. FIG. 4 is a bottom view of the board; FIG. 4 is a plan view showing a state in which circuit elements and lead members are coupled to the board; FIG. 5 is a plan view showing a state in which the first and second circuit boards are separated and stacked; Figure 6 shows VI- of Figure 5.
7 is a plan view showing a state in which the laminate shown in FIG. 5 is coated with solder; and FIG. 8 is a perspective view illustrating the laminate shown in FIG. 7. In the symbols used in the drawings, 11 is the first circuit board, 12 is the second circuit board, 13 is the through hole, 13a
13b is an upper groove, 13b is a lower groove, 14 is a slit, 17 is a first circuit conductor, 18 is a second circuit conductor, 19 is a conductive film, 24 is an adhesive, and 25 is a solder. Figure 6 12 Figure 7 3125
Claims (2)
基板の端部に前記複数の回路基板を連通ずる溝が設けら
れ、前記溝の壁面に後記のろう材を付着させることが可
能な導体被膜が形成され、前記回路基板の主面に設けら
れた回路導体が前記溝の前記導体被膜に接続され、前記
溝の前記導体被膜にろう材が被着され、前記ろう材によ
り前記複数の回路基板の相互間の電気的接続がなされて
いることを特徴とする電気回路装置。(1) A plurality of circuit boards are laminated and bonded, a groove is provided at the end of the plurality of circuit boards to communicate the plurality of circuit boards, and a brazing material described below can be attached to the wall surface of the groove. A conductive coating is formed, a circuit conductor provided on the main surface of the circuit board is connected to the conductive coating in the groove, a brazing material is applied to the conductive coating in the groove, and the brazing material connects the plurality of An electric circuit device characterized in that circuit boards are electrically connected to each other.
第１項記載の電気回路装置。(2) The electric circuit device according to claim 1, wherein the brazing material is solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12896081U JPS5834772U (en) | 1981-08-31 | 1981-08-31 | electrical circuit equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12896081U JPS5834772U (en) | 1981-08-31 | 1981-08-31 | electrical circuit equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5834772U true JPS5834772U (en) | 1983-03-07 |
Family
ID=29922639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12896081U Pending JPS5834772U (en) | 1981-08-31 | 1981-08-31 | electrical circuit equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5834772U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6046090A (en) * | 1983-08-24 | 1985-03-12 | シヤ−プ株式会社 | Electronic circuit board |
| JPS6454364U (en) * | 1987-09-30 | 1989-04-04 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494156A (en) * | 1972-05-01 | 1974-01-14 | ||
| JPS5258468A (en) * | 1975-11-10 | 1977-05-13 | Hitachi Ltd | Production of ceramic package |
-
1981
- 1981-08-31 JP JP12896081U patent/JPS5834772U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494156A (en) * | 1972-05-01 | 1974-01-14 | ||
| JPS5258468A (en) * | 1975-11-10 | 1977-05-13 | Hitachi Ltd | Production of ceramic package |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6046090A (en) * | 1983-08-24 | 1985-03-12 | シヤ−プ株式会社 | Electronic circuit board |
| JPS6454364U (en) * | 1987-09-30 | 1989-04-04 |
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