JPS60106368U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS60106368U JPS60106368U JP19797883U JP19797883U JPS60106368U JP S60106368 U JPS60106368 U JP S60106368U JP 19797883 U JP19797883 U JP 19797883U JP 19797883 U JP19797883 U JP 19797883U JP S60106368 U JPS60106368 U JP S60106368U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- foil pattern
- side copper
- back side
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図aは従来のプリント基板の平面図、第1図すは第
1図aの正面図、第1図Cは第1図aの右側面図、第1
図d1第1図eはそれぞれ同上プリント基板における端
子の半田付は工程を説明するための図、第2図aはこの
考案のプリント基板の一実施例の平面図、第2図すは第
2図aの正面図、第2図Cは第2図aの右側面図、第2
図d1第2図eはそれぞれこの考案のプリント基板の半
田付は工程を説明するための図、第3図aはこの考案の
プリント基板の他の実施例の平面図、第3図すは第3図
aの正面図、第3図Cは第3図aの右側面図である。
1・・・積層板、2・・・表側銅箔パターン、3・・・
裏側銅箔パターン、5・・・半田、6・・・無限大抵抗
、7・・・抵抗。Figure 1a is a plan view of a conventional printed circuit board, Figure 1S is a front view of Figure 1a, Figure 1C is a right side view of Figure 1a,
Figures d1 and 1e are diagrams for explaining the process of soldering the terminals on the same printed circuit board, Figure 2a is a plan view of an embodiment of the printed circuit board of this invention, and Figure 2 is Figure 2C is the right side view of Figure 2A, Figure 2C is the right side view of Figure 2A,
Figures d1 and 2e are diagrams for explaining the soldering process of the printed circuit board of this invention, Figure 3a is a plan view of another embodiment of the printed circuit board of this invention, and Figure 3a is a plan view of another embodiment of the printed circuit board of this invention. 3a is a front view, and FIG. 3C is a right side view of FIG. 3a. 1... Laminated board, 2... Front side copper foil pattern, 3...
Back side copper foil pattern, 5...Solder, 6...Infinite resistance, 7...Resistor.
Claims (1)
面に裏側銅箔パターンを形成し、少なくとも2本以上の
リード線を有しそのうちの少なくとも任意の2本のリー
ド線間が絶縁されているかまたは実用上支障のないイン
ピーダンスを有する電気部品により上記表側銅箔パター
ンと裏側銅箔パターンを導通させることを特徴とするプ
リント基板。A front side copper foil pattern is formed on the surface of the laminate, and a back side copper foil pattern is formed on the back side, and there are at least two or more lead wires, and at least any two of the lead wires are insulated, or A printed circuit board characterized in that the front side copper foil pattern and the back side copper foil pattern are electrically connected to each other by an electric component having an impedance that does not cause any practical problems.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19797883U JPS60106368U (en) | 1983-12-22 | 1983-12-22 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19797883U JPS60106368U (en) | 1983-12-22 | 1983-12-22 | Printed board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60106368U true JPS60106368U (en) | 1985-07-19 |
JPH0227573Y2 JPH0227573Y2 (en) | 1990-07-25 |
Family
ID=30756580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19797883U Granted JPS60106368U (en) | 1983-12-22 | 1983-12-22 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60106368U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4846865A (en) * | 1971-10-15 | 1973-07-04 |
-
1983
- 1983-12-22 JP JP19797883U patent/JPS60106368U/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4846865A (en) * | 1971-10-15 | 1973-07-04 |
Also Published As
Publication number | Publication date |
---|---|
JPH0227573Y2 (en) | 1990-07-25 |
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