JPS5258468A - Production of ceramic package - Google Patents
Production of ceramic packageInfo
- Publication number
- JPS5258468A JPS5258468A JP13405775A JP13405775A JPS5258468A JP S5258468 A JPS5258468 A JP S5258468A JP 13405775 A JP13405775 A JP 13405775A JP 13405775 A JP13405775 A JP 13405775A JP S5258468 A JPS5258468 A JP S5258468A
- Authority
- JP
- Japan
- Prior art keywords
- production
- ceramic package
- holes
- hotpressing
- conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To facilitate the formation of layers and improve the conduction on lateral faces by forming through-holes along the scribing lines of laminated ceramic substrates, applying a hole-metallizing material within the holes and hotpressing the substrate in a laminate state.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13405775A JPS5258468A (en) | 1975-11-10 | 1975-11-10 | Production of ceramic package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13405775A JPS5258468A (en) | 1975-11-10 | 1975-11-10 | Production of ceramic package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5258468A true JPS5258468A (en) | 1977-05-13 |
Family
ID=15119346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13405775A Pending JPS5258468A (en) | 1975-11-10 | 1975-11-10 | Production of ceramic package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5258468A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5561050A (en) * | 1978-10-31 | 1980-05-08 | Sony Corp | Manufacture of electronic parts |
JPS5834772U (en) * | 1981-08-31 | 1983-03-07 | 太陽誘電株式会社 | electrical circuit equipment |
JPS60227449A (en) * | 1984-01-23 | 1985-11-12 | ザ・ジエイド・コ−ポレイシヨン | Microminiature circuit board and method of producing same |
US4598308A (en) * | 1984-04-02 | 1986-07-01 | Burroughs Corporation | Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die |
JPH0328740U (en) * | 1989-07-28 | 1991-03-22 | ||
US5146308A (en) * | 1990-10-05 | 1992-09-08 | Micron Technology, Inc. | Semiconductor package utilizing edge connected semiconductor dice |
US5455385A (en) * | 1993-06-28 | 1995-10-03 | Harris Corporation | Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses |
US5861670A (en) * | 1979-10-04 | 1999-01-19 | Fujitsu Limited | Semiconductor device package |
US7303932B2 (en) | 2003-10-30 | 2007-12-04 | Nichia Corporation | Support body for semiconductor element, method for manufacturing the same and semiconductor device |
JP2012084920A (en) * | 2012-01-16 | 2012-04-26 | Kyocera Corp | Input/output terminal and package for packaging optical semiconductor device, and optical semiconductor device |
-
1975
- 1975-11-10 JP JP13405775A patent/JPS5258468A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5561050A (en) * | 1978-10-31 | 1980-05-08 | Sony Corp | Manufacture of electronic parts |
US5861670A (en) * | 1979-10-04 | 1999-01-19 | Fujitsu Limited | Semiconductor device package |
JPS5834772U (en) * | 1981-08-31 | 1983-03-07 | 太陽誘電株式会社 | electrical circuit equipment |
JPS60227449A (en) * | 1984-01-23 | 1985-11-12 | ザ・ジエイド・コ−ポレイシヨン | Microminiature circuit board and method of producing same |
US4598308A (en) * | 1984-04-02 | 1986-07-01 | Burroughs Corporation | Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die |
JPH0328740U (en) * | 1989-07-28 | 1991-03-22 | ||
US5146308A (en) * | 1990-10-05 | 1992-09-08 | Micron Technology, Inc. | Semiconductor package utilizing edge connected semiconductor dice |
US5455385A (en) * | 1993-06-28 | 1995-10-03 | Harris Corporation | Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses |
US7303932B2 (en) | 2003-10-30 | 2007-12-04 | Nichia Corporation | Support body for semiconductor element, method for manufacturing the same and semiconductor device |
US7795624B2 (en) | 2003-10-30 | 2010-09-14 | Nichia Corporation | Support body for semiconductor element, method for manufacturing the same and semiconductor device |
JP2012084920A (en) * | 2012-01-16 | 2012-04-26 | Kyocera Corp | Input/output terminal and package for packaging optical semiconductor device, and optical semiconductor device |
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