JPS5258468A - Production of ceramic package - Google Patents

Production of ceramic package

Info

Publication number
JPS5258468A
JPS5258468A JP13405775A JP13405775A JPS5258468A JP S5258468 A JPS5258468 A JP S5258468A JP 13405775 A JP13405775 A JP 13405775A JP 13405775 A JP13405775 A JP 13405775A JP S5258468 A JPS5258468 A JP S5258468A
Authority
JP
Japan
Prior art keywords
production
ceramic package
holes
hotpressing
metallizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13405775A
Other languages
Japanese (ja)
Inventor
Michiaki Furukawa
Masao Sekihashi
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13405775A priority Critical patent/JPS5258468A/en
Publication of JPS5258468A publication Critical patent/JPS5258468A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To facilitate the formation of layers and improve the conduction on lateral faces by forming through-holes along the scribing lines of laminated ceramic substrates, applying a hole-metallizing material within the holes and hotpressing the substrate in a laminate state.
COPYRIGHT: (C)1977,JPO&Japio
JP13405775A 1975-11-10 1975-11-10 Production of ceramic package Pending JPS5258468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13405775A JPS5258468A (en) 1975-11-10 1975-11-10 Production of ceramic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13405775A JPS5258468A (en) 1975-11-10 1975-11-10 Production of ceramic package

Publications (1)

Publication Number Publication Date
JPS5258468A true JPS5258468A (en) 1977-05-13

Family

ID=15119346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13405775A Pending JPS5258468A (en) 1975-11-10 1975-11-10 Production of ceramic package

Country Status (1)

Country Link
JP (1) JPS5258468A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5561050A (en) * 1978-10-31 1980-05-08 Sony Corp Manufacture of electronic parts
JPS5834772U (en) * 1981-08-31 1983-03-07
JPS60227449A (en) * 1984-01-23 1985-11-12 Jieido Corp Za Microminiature circuit board and method of producing same
US4598308A (en) * 1984-04-02 1986-07-01 Burroughs Corporation Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
JPH0328740U (en) * 1989-07-28 1991-03-22
US5146308A (en) * 1990-10-05 1992-09-08 Micron Technology, Inc. Semiconductor package utilizing edge connected semiconductor dice
US5455385A (en) * 1993-06-28 1995-10-03 Harris Corporation Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses
US5861670A (en) * 1979-10-04 1999-01-19 Fujitsu Limited Semiconductor device package
US7303932B2 (en) 2003-10-30 2007-12-04 Nichia Corporation Support body for semiconductor element, method for manufacturing the same and semiconductor device
JP2012084920A (en) * 2012-01-16 2012-04-26 Kyocera Corp Input/output terminal and package for packaging optical semiconductor device, and optical semiconductor device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5561050A (en) * 1978-10-31 1980-05-08 Sony Corp Manufacture of electronic parts
US5861670A (en) * 1979-10-04 1999-01-19 Fujitsu Limited Semiconductor device package
JPS5834772U (en) * 1981-08-31 1983-03-07
JPS60227449A (en) * 1984-01-23 1985-11-12 Jieido Corp Za Microminiature circuit board and method of producing same
US4598308A (en) * 1984-04-02 1986-07-01 Burroughs Corporation Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
JPH0328740U (en) * 1989-07-28 1991-03-22
US5146308A (en) * 1990-10-05 1992-09-08 Micron Technology, Inc. Semiconductor package utilizing edge connected semiconductor dice
US5455385A (en) * 1993-06-28 1995-10-03 Harris Corporation Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses
US7303932B2 (en) 2003-10-30 2007-12-04 Nichia Corporation Support body for semiconductor element, method for manufacturing the same and semiconductor device
US7795624B2 (en) 2003-10-30 2010-09-14 Nichia Corporation Support body for semiconductor element, method for manufacturing the same and semiconductor device
JP2012084920A (en) * 2012-01-16 2012-04-26 Kyocera Corp Input/output terminal and package for packaging optical semiconductor device, and optical semiconductor device

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