JPH01127231U - - Google Patents

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Publication number
JPH01127231U
JPH01127231U JP2282988U JP2282988U JPH01127231U JP H01127231 U JPH01127231 U JP H01127231U JP 2282988 U JP2282988 U JP 2282988U JP 2282988 U JP2282988 U JP 2282988U JP H01127231 U JPH01127231 U JP H01127231U
Authority
JP
Japan
Prior art keywords
layer
metal plate
oxide film
dielectric oxide
capacitor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2282988U
Other languages
Japanese (ja)
Other versions
JPH0614465Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2282988U priority Critical patent/JPH0614465Y2/en
Publication of JPH01127231U publication Critical patent/JPH01127231U/ja
Application granted granted Critical
Publication of JPH0614465Y2 publication Critical patent/JPH0614465Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る固体電解コンデンサのコ
ンデンサ素子部の構成を示す図で、同図aは一部
切断斜視図、同図bはコンデンサ素子板の一部断
面図、第2図は本考案の固体電解コンデンサのコ
ンデンサ素子の外観斜視図、第3図は本考案に係
る他の固体電解コンデンサのコンデンサ素子の断
面図で、第4図及び第5図はコンデンサ素子板の
製造工程を説明するための図、第6図はコンデン
サ素子板の製造方法を説明するための図である。 図中、10……コンデンサ素子板、11……化
成箔、12……絶縁帯層、13……ポリピルール
層、14……グラフアイト層、15……銀ペース
ト層、16……積層体、17,18……電極端子
、20……コンデンサ素子板、21……化成箔、
22……絶縁帯層、23……ポリピルール層、2
4……グラフアイト層、25……銀ペースト層、
26……絶縁層、27,28……電極端子。
Fig. 1 is a diagram showing the structure of a capacitor element part of a solid electrolytic capacitor according to the present invention, in which Fig. 1a is a partially cutaway perspective view, Fig. 2b is a partially sectional view of a capacitor element plate, and Fig. 2 is a main Fig. 3 is a cross-sectional view of a capacitor element of another solid electrolytic capacitor according to the invention, and Figs. 4 and 5 explain the manufacturing process of the capacitor element plate. FIG. 6 is a diagram for explaining a method of manufacturing a capacitor element plate. In the figure, 10... Capacitor element plate, 11... Chemically formed foil, 12... Insulating band layer, 13... Polypyrule layer, 14... Graphite layer, 15... Silver paste layer, 16... Laminate, 17 , 18... Electrode terminal, 20... Capacitor element plate, 21... Chemically formed foil,
22... Insulating band layer, 23... Polypyrule layer, 2
4...graphite layer, 25...silver paste layer,
26... Insulating layer, 27, 28... Electrode terminal.

Claims (1)

【実用新案登録請求の範囲】 (1) 誘電体酸化皮膜が形成できる金属板の片面
に該金属板とは異なる種類の異種金属板を張り付
けると共にその他面に誘電体酸化皮膜層を形成し
、該誘電体酸化皮膜層を形成した面の周縁部に所
定幅の絶縁帯層を形成し、該絶縁帯層で囲まれた
部分に複素環式化合物のポリマー層、導電体層を
順次形成してコンデンサ素子板を形成し、該コン
デンサ素子板を前記異種金属板面と絶縁帯層で囲
まれた導電体層面とを接合させて複数枚積層し、
該積層体の前記導電体層と異種金属板とに電極端
子を取付けてなるコンデンサ素子を具備すること
を特徴とする固体電解コンデンサ。 (2) 前記金属板の表面に形成される前記誘電体
酸化皮膜層は絶縁帯層で囲まれた部分の金属板の
表面に形成されたことを特徴とする請求項(1)記
載の固体電解コンデンサ。 (3) 誘電体酸化皮膜が形成できる金属板の表面
に誘電体酸化皮膜層を形成すると共に、所定位置
の表面に絶縁帯層を形成して金属板の表面を2つ
に区分し、該区分した一方に複素環式化合物のポ
リマー層、導電体層を順次形成し、更に該導電体
層の一面を除いた他の面に絶縁層を形成し、前記
絶縁帯層で区分された他方の金属板表面に該金属
板とは異なる種類の異種金属板を張り付けてコン
デンサ素子板を形成し、該コンデンサ素子板の複
数枚を互いにその絶縁層が形成されない導電体層
と絶縁層面とを接合させると共に前記異種金属板
面と導電体層面とを接合させて複数枚積層し、該
積層体の前記異種金属板と導電体層に電極端子を
取付けてなるコンデンサ素子を具備することを特
徴とする固体電解コンデンサ。 (4) 前記金属板の表面に形成される前記誘電体
酸化皮膜層は絶縁帯層で区分された一方の部分の
金属板の表面に形成されたことを特徴とする請求
項(3)記載の固体電解コンデンサ。
[Claims for Utility Model Registration] (1) A dissimilar metal plate of a different type from the metal plate is pasted on one side of a metal plate on which a dielectric oxide film can be formed, and a dielectric oxide film layer is formed on the other side, An insulating band layer of a predetermined width is formed on the peripheral edge of the surface on which the dielectric oxide film layer is formed, and a polymer layer of a heterocyclic compound and a conductive layer are sequentially formed in the area surrounded by the insulating band layer. forming a capacitor element plate, stacking a plurality of capacitor element plates by joining the dissimilar metal plate surface and the conductor layer surface surrounded by the insulating band layer;
A solid electrolytic capacitor comprising a capacitor element in which electrode terminals are attached to the conductor layer and a dissimilar metal plate of the laminate. (2) The solid electrolyte according to claim 1, wherein the dielectric oxide film layer formed on the surface of the metal plate is formed on the surface of the metal plate in a portion surrounded by an insulating band layer. capacitor. (3) A dielectric oxide film layer is formed on the surface of the metal plate on which the dielectric oxide film can be formed, and an insulating band layer is formed on the surface of the metal plate at a predetermined position to divide the surface of the metal plate into two, and the surface of the metal plate is divided into two parts. A polymer layer of a heterocyclic compound and a conductor layer are sequentially formed on one side of the conductor layer, and an insulating layer is further formed on other surfaces except for one side of the conductor layer, and the other metal layer is separated by the insulating band layer. A capacitor element plate is formed by pasting a different kind of metal plate than the metal plate on the plate surface, and a plurality of the capacitor element plates are bonded to each other with the conductive layer and the insulating layer surface on which the insulating layer is not formed. A solid electrolytic device comprising a capacitor element formed by laminating a plurality of sheets by bonding the dissimilar metal plate surface and the conductor layer surface, and attaching electrode terminals to the dissimilar metal plate and the conductor layer of the laminate. capacitor. (4) The dielectric oxide film layer formed on the surface of the metal plate is formed on the surface of the metal plate in one portion separated by an insulating band layer. Solid electrolytic capacitor.
JP2282988U 1988-02-23 1988-02-23 Solid electrolytic capacitor Expired - Lifetime JPH0614465Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2282988U JPH0614465Y2 (en) 1988-02-23 1988-02-23 Solid electrolytic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2282988U JPH0614465Y2 (en) 1988-02-23 1988-02-23 Solid electrolytic capacitor

Publications (2)

Publication Number Publication Date
JPH01127231U true JPH01127231U (en) 1989-08-31
JPH0614465Y2 JPH0614465Y2 (en) 1994-04-13

Family

ID=31241290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2282988U Expired - Lifetime JPH0614465Y2 (en) 1988-02-23 1988-02-23 Solid electrolytic capacitor

Country Status (1)

Country Link
JP (1) JPH0614465Y2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009182273A (en) * 2008-01-31 2009-08-13 Nippon Chemicon Corp Solid-state electrolytic capacitor and method of manufacturing the same
JP2009246234A (en) * 2008-03-31 2009-10-22 Nippon Chemicon Corp Solid electrolytic capacitor, and method for manufacturing the same
JP2009246236A (en) * 2008-03-31 2009-10-22 Nippon Chemicon Corp Solid electrolytic capacitor, and method for manufacturing the same
JP2010520647A (en) * 2007-03-07 2010-06-10 ケメット エレクトロニクス コーポレーション Thin solid electrolytic capacitor that can be embedded in a substrate
JP2012033544A (en) * 2010-07-28 2012-02-16 Rubycon Carlit Co Ltd Device including plural capacitor elements
WO2012144316A1 (en) * 2011-04-20 2012-10-26 株式会社村田製作所 Solid-state electrolyte capacitor manufacturing method and solid-state electrolyte capacitor
WO2017026233A1 (en) * 2015-08-10 2017-02-16 株式会社村田製作所 Capacitor
WO2019156120A1 (en) * 2018-02-08 2019-08-15 株式会社村田製作所 Electrolytic capacitor

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013243392A (en) * 2007-03-07 2013-12-05 Kemet Electronics Corp Method for forming electric device including thin solid electrolytic capacitor embeddable in substrate
JP2010520647A (en) * 2007-03-07 2010-06-10 ケメット エレクトロニクス コーポレーション Thin solid electrolytic capacitor that can be embedded in a substrate
JP2009182273A (en) * 2008-01-31 2009-08-13 Nippon Chemicon Corp Solid-state electrolytic capacitor and method of manufacturing the same
JP2009246234A (en) * 2008-03-31 2009-10-22 Nippon Chemicon Corp Solid electrolytic capacitor, and method for manufacturing the same
JP2009246236A (en) * 2008-03-31 2009-10-22 Nippon Chemicon Corp Solid electrolytic capacitor, and method for manufacturing the same
JP2012033544A (en) * 2010-07-28 2012-02-16 Rubycon Carlit Co Ltd Device including plural capacitor elements
WO2012144316A1 (en) * 2011-04-20 2012-10-26 株式会社村田製作所 Solid-state electrolyte capacitor manufacturing method and solid-state electrolyte capacitor
JP5534106B2 (en) * 2011-04-20 2014-06-25 株式会社村田製作所 Solid electrolytic capacitor manufacturing method and solid electrolytic capacitor
US9552928B2 (en) 2011-04-20 2017-01-24 Murata Manufacturing Co., Ltd. Solid-state electrolytic capacitor manufacturing method and solid-state electrolytic capacitor
US10032567B2 (en) 2011-04-20 2018-07-24 Murata Manufacturing Co., Ltd. Solid-state electrolytic capacitor manufacturing method and solid-state electrolytic capacitor
JPWO2017026233A1 (en) * 2015-08-10 2018-05-24 株式会社村田製作所 Capacitor
WO2017026233A1 (en) * 2015-08-10 2017-02-16 株式会社村田製作所 Capacitor
WO2019156120A1 (en) * 2018-02-08 2019-08-15 株式会社村田製作所 Electrolytic capacitor
JPWO2019156120A1 (en) * 2018-02-08 2020-12-03 株式会社村田製作所 Electrolytic capacitor

Also Published As

Publication number Publication date
JPH0614465Y2 (en) 1994-04-13

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