JPS6063969U - thick film integrated circuit - Google Patents
thick film integrated circuitInfo
- Publication number
- JPS6063969U JPS6063969U JP15376383U JP15376383U JPS6063969U JP S6063969 U JPS6063969 U JP S6063969U JP 15376383 U JP15376383 U JP 15376383U JP 15376383 U JP15376383 U JP 15376383U JP S6063969 U JPS6063969 U JP S6063969U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- thick film
- film integrated
- parts
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａは、従来の厚膜集積回路で、狭い間隔で並んだ
多数の端子を有する面付は部品を、絶縁基板上の引出し
導体に、前記端子を夫々半田付けして接続した状態を示
す上面図、第１図すはその側断面図、第２図ａは本考案
−実施例の上面図、第２図すはその側断面図である。
１・・・・・・絶縁基板、２・・・・・・面付は部品、
３ａ、３ｂ・・・・・・引出し導体、４ａ、４ｂ・・・
・・・樹脂被覆、５・・・・・・半田、６・・・・・・
面付は部品の端子、７ａｖ７ｂ・・・・・・非晶質透明
ガラスの被覆。Figure 1a shows a conventional thick film integrated circuit in which a face-mounted component having a large number of terminals lined up at narrow intervals is connected to a lead-out conductor on an insulating substrate by soldering each of the terminals. FIG. 1 is a top view, FIG. 1 is a side sectional view, and FIG. 2A is a top view of an embodiment of the present invention, and FIG. 1... Insulated board, 2... Surface mounted parts,
3a, 3b...drawer conductor, 4a, 4b...
...Resin coating, 5...Solder, 6...
Surface mounting is the terminal of the component, 7av7b...Amorphous transparent glass coating.
Claims (1)
数の端子を夫々半田付けして接続する、他部分との接続
用に絶縁基板上に配設した引出し用導体を、半田付は位
置から互いに平行させて直線的に引出し、かつ、半田付
は位置番除き、そこから所定の長さにわたり、非晶質透
明ガラスで被覆したことを特徴とする厚膜集積回路。A large number of terminals arranged in parallel around the parts to be mounted by surface mounting are connected by soldering to each other, and lead-out conductors arranged on an insulating board for connection with other parts are connected to each other from the position. 1. A thick film integrated circuit, which is drawn out in parallel in a straight line, and is covered with amorphous transparent glass over a predetermined length except for the soldering position number.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15376383U JPS6063969U (en) | 1983-10-05 | 1983-10-05 | thick film integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15376383U JPS6063969U (en) | 1983-10-05 | 1983-10-05 | thick film integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6063969U true JPS6063969U (en) | 1985-05-07 |
Family
ID=30340097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15376383U Pending JPS6063969U (en) | 1983-10-05 | 1983-10-05 | thick film integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6063969U (en) |
-
1983
- 1983-10-05 JP JP15376383U patent/JPS6063969U/en active Pending
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