JPS58130365U - Configuration of wiring board connector - Google Patents
Configuration of wiring board connectorInfo
- Publication number
- JPS58130365U JPS58130365U JP1982027089U JP2708982U JPS58130365U JP S58130365 U JPS58130365 U JP S58130365U JP 1982027089 U JP1982027089 U JP 1982027089U JP 2708982 U JP2708982 U JP 2708982U JP S58130365 U JPS58130365 U JP S58130365U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- configuration
- board connector
- plating layer
- solder plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の配線基板コネクター構成を示す断面図、
第２図は同構成の説明に供する断面図、第３図は本考案
による配線基板コネクター構成の一実施例を示す縦断面
図、第４図は同コネクター構成の横断面図、第５図は同
コネクター構成の一応用例を示す断面図である。
１：薄膜導体配線基板、４：フレキシブル配線基板、５
：導体回路、７：はんだメッキ層、８′二表面絶縁層（
オーバーコート）。Figure 1 is a cross-sectional view showing the configuration of a conventional wiring board connector.
FIG. 2 is a cross-sectional view for explaining the same configuration, FIG. 3 is a vertical cross-sectional view showing one embodiment of the wiring board connector configuration according to the present invention, FIG. 4 is a cross-sectional view of the same connector configuration, and FIG. FIG. 3 is a sectional view showing an example of application of the same connector configuration. 1: Thin film conductor wiring board, 4: Flexible wiring board, 5
: Conductor circuit, 7: Solder plating layer, 8' double surface insulation layer (
overcoat).
Claims (1)
板をはんだ付けにて接続するものに於て、上記フレニジ
プル配線基板に、プリント導体回路と、この導体回路上
の所定部分に形成され、かつ上記薄膜配線導体と電気的
に接続されるはんだメッキ層と、このはんだメッキ層以
外の所定部分を被覆し、かつ上記はんだメッキ層を上記
基板間で一定間隔に保持するための表面絶縁層を設けた
ことを特徴とする配線基板コネクターの構成。In the case where a flexible wiring board is connected by soldering to an insulating board on which thin film conductor wiring is applied, a printed conductor circuit is formed on the flexible wiring board and a predetermined portion on the conductor circuit, and the thin film is formed on the flexible wiring board. A solder plating layer that is electrically connected to the wiring conductor, and a surface insulating layer that covers a predetermined portion other than the solder plating layer and maintains the solder plating layer at a constant interval between the boards. A configuration of a wiring board connector characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982027089U JPS58130365U (en) | 1982-02-25 | 1982-02-25 | Configuration of wiring board connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982027089U JPS58130365U (en) | 1982-02-25 | 1982-02-25 | Configuration of wiring board connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58130365U true JPS58130365U (en) | 1983-09-03 |
Family
ID=30039008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982027089U Pending JPS58130365U (en) | 1982-02-25 | 1982-02-25 | Configuration of wiring board connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58130365U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5517467A (en) * | 1978-07-25 | 1980-02-06 | Mitsubishi Electric Corp | Dust concentration meter |
-
1982
- 1982-02-25 JP JP1982027089U patent/JPS58130365U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5517467A (en) * | 1978-07-25 | 1980-02-06 | Mitsubishi Electric Corp | Dust concentration meter |
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