JPS5895650U - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPS5895650U
JPS5895650U JP19158281U JP19158281U JPS5895650U JP S5895650 U JPS5895650 U JP S5895650U JP 19158281 U JP19158281 U JP 19158281U JP 19158281 U JP19158281 U JP 19158281U JP S5895650 U JPS5895650 U JP S5895650U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
heat sink
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19158281U
Other languages
Japanese (ja)
Inventor
六川 嘉信
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP19158281U priority Critical patent/JPS5895650U/en
Publication of JPS5895650U publication Critical patent/JPS5895650U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図〜第3図は本考案の実施例による混成集積回路装
置の側面図を示す。 図において1は基板、2は部品、3は放熱板、4は樹脂
コーティング、5は端子、6はプリント板、7は金属板
、8はキャップを示す。
1 to 3 show side views of a hybrid integrated circuit device according to an embodiment of the present invention. In the figure, 1 is a board, 2 is a component, 3 is a heat sink, 4 is a resin coating, 5 is a terminal, 6 is a printed board, 7 is a metal plate, and 8 is a cap.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板の一方の面に部品を実施し、他面に放熱板を固着し
た事を特徴とする混成集積回路装置。
A hybrid integrated circuit device characterized by having components mounted on one side of a substrate and a heat sink fixed to the other side.
JP19158281U 1981-12-22 1981-12-22 Hybrid integrated circuit device Pending JPS5895650U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19158281U JPS5895650U (en) 1981-12-22 1981-12-22 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19158281U JPS5895650U (en) 1981-12-22 1981-12-22 Hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5895650U true JPS5895650U (en) 1983-06-29

Family

ID=30105034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19158281U Pending JPS5895650U (en) 1981-12-22 1981-12-22 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5895650U (en)

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