JPS6316492U - - Google Patents

Info

Publication number
JPS6316492U
JPS6316492U JP1986109307U JP10930786U JPS6316492U JP S6316492 U JPS6316492 U JP S6316492U JP 1986109307 U JP1986109307 U JP 1986109307U JP 10930786 U JP10930786 U JP 10930786U JP S6316492 U JPS6316492 U JP S6316492U
Authority
JP
Japan
Prior art keywords
heat
generating electronic
utility
model registration
transfer block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986109307U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986109307U priority Critical patent/JPS6316492U/ja
Publication of JPS6316492U publication Critical patent/JPS6316492U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ないし第３図はそれぞれ本考案に係る電
子機器の実施例を示す断面図である。 １…筐体、２…本体、３…蓋体、４…回路基板
、５…発熱電子部品、６…伝熱ブロツク、７…伝
熱性コンパウンド、８…伝熱性接着剤。 1 to 3 are cross-sectional views showing embodiments of electronic equipment according to the present invention. DESCRIPTION OF SYMBOLS 1... Housing, 2... Main body, 3... Lid, 4... Circuit board, 5... Heat-generating electronic component, 6... Heat transfer block, 7... Heat conductive compound, 8... Heat conductive adhesive.

Claims (1)

【実用新案登録請求の範囲】 (1) 筐体内に発熱電子部品を内蔵した電子機器
において、上記筐体の少なくとも発熱電子部品と
対向する部分を金属製とし、その部分と発熱電子
部品との間に、その両者と熱伝導関係を有するよ
うに金属製の伝熱ブロツクを設けたことを特徴と
する電子機器。 (2) 実用新案登録請求の範囲第１項記載の電子
機器であつて、伝熱ブロツクは、筐体および発熱
電子部品の少なくとも一方に、粘性のある伝熱性
コンパウンドを介して熱的に結合されているもの
。 (3) 実用新案登録請求の範囲第２項記載の電子
機器であつて、伝熱ブロツクは、筐体と一体に形
成され、かつ発熱電子部品と粘性のある伝熱性コ
ンパウンドを介して熱的に結合されているもの。 (4) 実用新案登録請求の範囲第２項記載の電子
機器であつて、伝熱ブロツクは、筐体と粘性のあ
る伝熱性コンパウンドを介して熱的に結合され、
かつ発熱電子部品と伝熱性接着材を介して接着さ
れているもの。 (5) 実用新案登録請求の範囲第２項記載の電子
機器であつて、伝熱ブロツクは、筐体と伝熱性接
着材を介して接着され、かつ発熱電子部品と粘性
のある伝熱性コンパウンドを介して熱的に結合さ
れているもの。[Scope of Claim for Utility Model Registration] (1) In an electronic device with a heat-generating electronic component built into the housing, at least the part of the housing that faces the heat-generating electronic component is made of metal, and the gap between that part and the heat-generating electronic component is and a metal heat transfer block so as to have a heat conductive relationship with the two. (2) In the electronic device according to claim 1 of the utility model registration claim, the heat transfer block is thermally coupled to at least one of the housing and the heat-generating electronic component via a viscous heat-conductive compound. What you have. (3) In the electronic device according to claim 2 of the utility model registration claim, the heat transfer block is formed integrally with the casing and is thermally connected to the heat generating electronic component through a viscous heat conductive compound. what is connected. (4) The electronic device according to claim 2 of the utility model registration claim, wherein the heat transfer block is thermally coupled to the casing via a viscous heat transfer compound,
and those that are bonded to heat-generating electronic components via a heat-conductive adhesive. (5) The electronic device according to claim 2 of the utility model registration claim, wherein the heat transfer block is bonded to the casing via a heat conductive adhesive, and includes heat generating electronic components and a viscous heat conductive compound. thermally coupled via
JP1986109307U 1986-07-18 1986-07-18 Pending JPS6316492U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986109307U JPS6316492U (en) 1986-07-18 1986-07-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986109307U JPS6316492U (en) 1986-07-18 1986-07-18

Publications (1)

Publication Number Publication Date
JPS6316492U true JPS6316492U (en) 1988-02-03

Family

ID=30987281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986109307U Pending JPS6316492U (en) 1986-07-18 1986-07-18

Country Status (1)

Country Link
JP (1) JPS6316492U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01140171U (en) * 1988-03-18 1989-09-26
WO1992002117A1 (en) * 1990-07-26 1992-02-06 Fujitsu Limited Heat dissipating structure of semiconductor device
JP2002158318A (en) * 2000-11-22 2002-05-31 Mitsubishi Electric Corp Semiconductor device
JP2009152362A (en) * 2007-12-20 2009-07-09 Mitsubishi Heavy Ind Ltd Encapsulated type electronic instrument
WO2017187598A1 (en) * 2016-04-28 2017-11-02 日産自動車株式会社 In-vehicle power conversion device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5527905B2 (en) * 1972-04-03 1980-07-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5527905B2 (en) * 1972-04-03 1980-07-24

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01140171U (en) * 1988-03-18 1989-09-26
WO1992002117A1 (en) * 1990-07-26 1992-02-06 Fujitsu Limited Heat dissipating structure of semiconductor device
GB2252451A (en) * 1990-07-26 1992-08-05 Fujitsu Ltd Heat dissipating structure of semiconductor device
US5262922A (en) * 1990-07-26 1993-11-16 Fujitsu, Limited Heat radiation structure for semiconductor device
GB2252451B (en) * 1990-07-26 1995-01-04 Fujitsu Ltd Heat radiation structure for semiconductor device
JP2002158318A (en) * 2000-11-22 2002-05-31 Mitsubishi Electric Corp Semiconductor device
JP2009152362A (en) * 2007-12-20 2009-07-09 Mitsubishi Heavy Ind Ltd Encapsulated type electronic instrument
WO2017187598A1 (en) * 2016-04-28 2017-11-02 日産自動車株式会社 In-vehicle power conversion device
US10617044B2 (en) 2016-04-28 2020-04-07 Nissan Motor Co., Ltd. In-vehicle power conversion device

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