JPH01120392U - - Google Patents

Info

Publication number
JPH01120392U
JPH01120392U JP1988016490U JP1649088U JPH01120392U JP H01120392 U JPH01120392 U JP H01120392U JP 1988016490 U JP1988016490 U JP 1988016490U JP 1649088 U JP1649088 U JP 1649088U JP H01120392 U JPH01120392 U JP H01120392U
Authority
JP
Japan
Prior art keywords
protrusion
hole
electronic element
fixed
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988016490U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988016490U priority Critical patent/JPH01120392U/ja
Publication of JPH01120392U publication Critical patent/JPH01120392U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を説明するための図
、第２図及び第３図は夫々本考案の他の一実施例
を説明するための図である。 １……混成集積回路用基板、２……穴部、３…
…放熱器、３ａ……突起部、４……高熱伝導性接
着樹脂、５……発熱電子素子、６……半田、７…
…空隙。 FIG. 1 is a diagram for explaining one embodiment of the present invention, and FIGS. 2 and 3 are diagrams for explaining other embodiments of the present invention, respectively. 1... Substrate for hybrid integrated circuit, 2... Hole, 3...
...Radiator, 3a...Protrusion, 4...High thermal conductive adhesive resin, 5...Heating electronic element, 6...Solder, 7...
...Void.

Claims (1)

【実用新案登録請求の範囲】 (1) 穴の設けられている混成集積回路用基板と
、上記穴を塞ぐようにして、上記基板の一方の面
に固着されてなる発熱電子素子と、 上記基板の他方の面に配設され、上記穴を貫通
して上記発熱電子素子に固着された突起部を有す
る放熱器とからなることを特徴とする混成集積回
路。 (2) 突起部を有する放熱器が一方の面に固着さ
れ、他方の面から上記突起部に発熱電子素子を配
設し得るように、上記突起部が一方の面から他方
の面へ貫通していることを特徴とする混成集積回
路用基板。[Claims for Utility Model Registration] (1) A hybrid integrated circuit substrate provided with a hole, a heat generating electronic element fixed to one surface of the substrate so as to cover the hole, and the substrate and a radiator having a protrusion disposed on the other surface of the radiator, the protrusion passing through the hole and being fixed to the heat generating electronic element. (2) The protrusion penetrates from one surface to the other so that a heat sink having a protrusion is fixed to one surface and a heating electronic element can be disposed on the protrusion from the other surface. A hybrid integrated circuit board characterized by:
JP1988016490U 1988-02-10 1988-02-10 Pending JPH01120392U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988016490U JPH01120392U (en) 1988-02-10 1988-02-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988016490U JPH01120392U (en) 1988-02-10 1988-02-10

Publications (1)

Publication Number Publication Date
JPH01120392U true JPH01120392U (en) 1989-08-15

Family

ID=31229472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988016490U Pending JPH01120392U (en) 1988-02-10 1988-02-10

Country Status (1)

Country Link
JP (1) JPH01120392U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010141279A (en) * 2008-11-14 2010-06-24 Calsonic Kansei Corp Structure and method for radiating heat of element
JP2012227192A (en) * 2011-04-15 2012-11-15 Astom Co Ltd Substrate device
JP2016004977A (en) * 2014-06-19 2016-01-12 株式会社ジェイデバイス Semiconductor package and manufacturing method of the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53126276A (en) * 1977-04-11 1978-11-04 Nippon Telegr & Teleph Corp <Ntt> Heat dissipation construction of multichip mounting substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53126276A (en) * 1977-04-11 1978-11-04 Nippon Telegr & Teleph Corp <Ntt> Heat dissipation construction of multichip mounting substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010141279A (en) * 2008-11-14 2010-06-24 Calsonic Kansei Corp Structure and method for radiating heat of element
JP2012227192A (en) * 2011-04-15 2012-11-15 Astom Co Ltd Substrate device
JP2016004977A (en) * 2014-06-19 2016-01-12 株式会社ジェイデバイス Semiconductor package and manufacturing method of the same

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