WO2017098703A1 - Heat radiating device for heat generating electronic component, manufacturing method thereof, and vehicle-mounted charger - Google Patents

Heat radiating device for heat generating electronic component, manufacturing method thereof, and vehicle-mounted charger Download PDF

Info

Publication number
WO2017098703A1
WO2017098703A1 PCT/JP2016/005018 JP2016005018W WO2017098703A1 WO 2017098703 A1 WO2017098703 A1 WO 2017098703A1 JP 2016005018 W JP2016005018 W JP 2016005018W WO 2017098703 A1 WO2017098703 A1 WO 2017098703A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
generating electronic
electronic component
transfer body
circuit board
Prior art date
Application number
PCT/JP2016/005018
Other languages
French (fr)
Japanese (ja)
Inventor
篤志 山島
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to CN201690001311.2U priority Critical patent/CN208690245U/en
Publication of WO2017098703A1 publication Critical patent/WO2017098703A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to a heat dissipation device for a heat generating electronic component, a manufacturing method thereof, and an in-vehicle charger.
  • a substrate or an electronic component is stored in a substantially rectangular parallelepiped casing formed of a heat dissipation member, and heat generated from the electronic component is radiated through the casing.
  • a manufacturing method of such a substantially rectangular parallelepiped housing structure a method in which a top surface and a side surface are integrally formed in a box shape and a housing having an open bottom surface is covered from above, and a bottom surface (bottom surface) and a side surface are box shapes.
  • Two methods are known in which a lid member (upper surface) is covered with a casing that is integrally molded with the upper surface and has an upper surface opened.
  • the connector when the connector is provided on the side surface, it is preferable to use a method in which the lower surface and the side surface are integrally formed in a box shape and a cover member (upper surface) is covered with a housing having an upper surface opened.
  • the lower surface and the side surface are integrally molded into a box shape and the cover member (upper surface) is covered with a casing having an upper surface opened
  • the lower surface and the side surface are integrally molded into the box shape. It is impossible to screw an electronic component, and it is necessary to perform screwing from the opened upper surface.
  • the heat dissipating surface of the heat generating electronic component is placed in direct contact with the bottom surface by bending the lead wire of the heat generating electronic component. It is conceivable that the elastic member is screwed from above so that the elastic member disclosed in (1) presses the surface opposite to the heat radiating surface.
  • the heat dissipating device for a heat generating electronic component includes a circuit board, a heat generating electronic component, a heat transfer body, and a heat dissipating component.
  • the heat generating electronic component self-heats when energized and has a lead wire connected to the circuit board.
  • the heat transfer member is in contact with the heat dissipation surface of the heat generating electronic component, and the heat generating electronic component is disposed.
  • the heat dissipating part has a first surface that is molded into a box shape and on which the heat transfer body is disposed, and a second surface that is opposed to the first surface and that has an opening. Dissipate the heat.
  • the heat generating electronic component is fixed to the surface of the heat transfer body that intersects the first surface.
  • the heat transfer body and the circuit board are arranged in the order of the heat transfer body and the circuit board from the first surface along the direction perpendicular to the first surface.
  • a method for manufacturing a heat dissipation device for a heat generating electronic component includes: heat transfer to a heat generating electronic component in a state where the heat generating surface of the heat generating electronic component having a lead wire is in contact with a heat transfer body.
  • the heat transfer body in which heat-generating electronic components are placed from one side of the heat-dissipating component that is integrally molded into a box shape and has an opening on only one surface is housed inside the heat-dissipating component, and the heat-dissipating component
  • the circuit board is housed inside the heat dissipation component and the lead wire of the heat generating electronic component is connected to the circuit board from one surface of the heat dissipation component.
  • heat dissipation of the heat generating electronic component can be performed while suppressing an increase in size.
  • FIG. 1 is a perspective view illustrating an example of a heat dissipation device for heat-generating electronic components according to an embodiment of the present disclosure.
  • FIG. 2 is a front perspective view illustrating an example of a heat dissipation device for heat-generating electronic components according to an embodiment of the present disclosure.
  • FIG. 3 is a perspective view seen from a side surface showing an example of a heat dissipation device for a heat generating electronic component according to an embodiment of the present disclosure.
  • FIG. 4 is a top perspective view illustrating an example of a heat dissipation device for a heat generating electronic component according to an embodiment of the present disclosure.
  • FIG. 1 is a perspective view illustrating an example of a heat dissipation device for heat-generating electronic components according to an embodiment of the present disclosure.
  • FIG. 2 is a front perspective view illustrating an example of a heat dissipation device for heat-generating electronic components according to an embodiment of the present disclosure.
  • FIG. 3 is a perspective view
  • FIG. 5 is a top perspective view illustrating a configuration example of the heat dissipation device for heat generating electronic components according to the first modification example of the present disclosure.
  • FIG. 6 is a top perspective view illustrating a configuration example of a heat dissipation device for heat generating electronic components according to a second modification of the present disclosure.
  • the present disclosure discloses a heat dissipation device for a heat generating electronic component capable of supporting heat dissipation of a heat generating electronic component while suppressing an increase in size when using a heat dissipation component molded into a box shape and having an opening on only one surface, and A manufacturing method thereof is provided.
  • FIG. 1 is a perspective view showing an example of a heat dissipation device 1 for a heat generating electronic component.
  • FIG. 2 is a perspective view seen from the front showing an example of the heat dissipation device 1 for heat-generating electronic components.
  • FIG. 3 is a perspective view seen from the side, showing an example of the heat dissipation device 1 for heat-generating electronic components.
  • FIG. 4 is a top perspective view showing an example of the heat dissipation device 1 for heat-generating electronic components. 1 and 2, the illustration of the front portion of the heat sink 2 is omitted, and the illustration of the side portion of the heat sink 2 is omitted in FIG. In FIG. 4, the circuit board 9 shown in FIGS. 1 to 3 is not shown.
  • the heat dissipating device 1 for heat generating electronic parts is used for, for example, a charger or an inverter mounted on a vehicle.
  • a heat dissipation device 1 for a heat generating electronic component includes a heat sink 2, an aluminum block 3, electronic components 5 a and 5 b, and a circuit board 9.
  • the heat sink 2 (an example of a heat radiating component) is integrally formed in a box shape, and an opening is provided only on one surface.
  • F1 is an opening surface (an example of the second surface), and F2 is a bottom surface (an example of the first surface) that faces the opening surface F1.
  • Supports 2a, 2b, 2c, and 2d are provided at four corners of the bottom surface F2 of the heat sink 2 along a direction D perpendicular to the bottom surface F2 (hereinafter, simply referred to as “vertical direction”, an example of “first direction”). ing.
  • Each of the pillars 2a to 2d is formed with a screw hole (not shown), and a circuit board 9 to be described later is screwed.
  • the aluminum block 3 (an example of a heat transfer body) is a substantially rectangular parallelepiped member made of aluminum.
  • the aluminum block 3 is disposed inside the heat sink 2 so that the longitudinal direction thereof is along the vertical direction D.
  • the aluminum block 3 has a substantially rectangular parallelepiped fastening portion 3a at its lower part.
  • the fastening portion 3a is screwed to the bottom surface F2 by screws 4a and 4b (an example of a fixing member). Thereby, the aluminum block 3 contacts and is fixed to the bottom face F2.
  • the electronic components 5a and 5b are electronic components that generate heat when energized, and are, for example, discrete components, FETs (Field Effect Transistors), and the like.
  • the electronic components 5a and 5b have lead wires 6a and 6b, respectively.
  • the electronic parts 5a and 5b are attached to the aluminum block 3 so that the respective heat radiating surfaces are in contact with the side surfaces of the aluminum block 3. That is, the electronic components 5a and 5b are fixed to the surface of the aluminum block 3 that intersects the bottom surface F2.
  • the electronic components 5 a and 5 b are pressed from the surface facing the heat dissipation surface by springs 7 a and 7 b (an example of a holding member), and are fixed and held on the side surface of the aluminum block 3.
  • the springs 7a and 7b are screwed to the side surface of the aluminum block 3 by screws 8a and 8b, respectively.
  • the electronic components 5a and 5b fixed to the aluminum block 3 are in an upright state along the vertical direction D. That is, the electronic components 5 a and 5 b are arranged so that the longitudinal direction thereof is parallel to the vertical direction D. Further, the electronic components 5 a and 5 b fixed to the aluminum block 3 do not contact the heat sink 2.
  • the heat generated from the electronic components 5 a and 5 b fixed to the aluminum block 3 is transferred to the heat sink 2 through the aluminum block 3. Thereby, heat dissipation of the electronic components 5a and 5b is realized.
  • two electronic parts are fixed to the aluminum block 3 as an example, but may be one, or may be three or more. Further, the plurality of electronic components may be fixed not only to one surface of the aluminum block 3 but also to a plurality of surfaces.
  • the circuit board 9 is a printed board on which a pattern is formed and a predetermined semiconductor element (not shown) is mounted.
  • the circuit board 9 is placed on the above-mentioned support columns 2a to 2d.
  • the circuit board 9 is screwed to the columns 2a to 2d by screws 10a, 10b, 10c, and 10d. As a result, the circuit board 9 is fixed to the columns 2a to 2d.
  • the circuit board 9 is connected to the lead wire 6a of the electronic component 5a and the lead wire 6b of the electronic component 5b by, for example, soldering.
  • the aluminum block 3 and the circuit board 9 are arranged along the vertical direction D in the order of the aluminum block 3 and the circuit board 9 from the bottom surface F2.
  • the aluminum block 3 and the circuit board 9 are bonded and fixed to each other by bonds 11a and 11b (an example of an adhesive member).
  • bonds 11a and 11b an example of an adhesive member.
  • the bonds 11a and 11b have at least one of insulating property and heat dissipation property.
  • the bonds 11a and 11b have insulating properties, a pattern can be formed or a semiconductor element can be mounted on a portion of the circuit board 9 corresponding to the bonds 11a and 11b. Further, when the bonds 11a and 11b have heat dissipation properties, heat generated in the circuit board 9 can be transferred to the aluminum block 3 through the bonds 11a and 11b.
  • a cover for closing the opening surface F1 may be provided above the circuit board 9.
  • the heat dissipating device 1 for the heat generating electronic component is disposed so that the heat dissipating surfaces of the electronic components 5a and 5b are in contact with the aluminum block 3 disposed in contact with the heat sink 2.
  • the heat dissipating surfaces of the electronic components 5a and 5b are arranged in contact with the bottom surface F2 of the heat sink 2, it is possible to cope with the heat dissipating of the electronic components while suppressing an increase in size.
  • the electronic components 5a and 5b are fixed and bonded to the aluminum block 3 using the springs 7a and 7b and the screws 8a and 8b. At this time, the heat dissipation surfaces of the electronic components 5a and 5b are brought into contact with the aluminum block 3. If the electronic components 5a and 5b are of a type that requires insulation, it is preferable to provide a heat dissipation insulating sheet (not shown) between the heat dissipation surfaces of the electronic components 5a and 5b and the aluminum block 3.
  • the aluminum block 3 to which the electronic components 5a and 5b are fixed is accommodated in the heat sink 2 from the opening surface F1 of the heat sink 2, and the aluminum block 3 is disposed on the bottom surface F2. Then, the fastening portion 3a is screwed to the bottom surface F2 using the screws 4a and 4b.
  • the circuit board 9 is accommodated in the heat sink 2 from the opening surface of the heat sink 2 and placed on the support columns 2a to 2d. At this time, the lead wires 6 a and 6 b are soldered to the circuit board 9. Then, the circuit board 9 is screwed to the pillars 2a to 2d using the screws 10a to 10d.
  • the heat dissipating device 1 for heat generating electronic components shown in FIGS. 1 to 4 is manufactured.
  • a cover (not shown) for closing the opening surface F1 may be provided above the circuit board 9 after the circuit board 9 is screwed.
  • FIG. 5 is a top perspective view showing an example of the heat dissipation device 1 for heat-generating electronic components according to this modification.
  • the same components as those in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof is omitted.
  • the circuit board 9 shown in FIGS. 1 to 3 is not shown.
  • FIG. 5 is different from FIGS. 1 to 4 in that the heat sink 2 includes an aluminum block 30 and an electronic component 32 as shown in FIG.
  • the aluminum block 30 has a substantially rectangular parallelepiped fastening portion 30a at its lower part.
  • FIG. 5 only the fastening portion 30a between the support post 2a and the support post 2b is illustrated. Similarly, the fastening portion 30a also exists between the support post 2d and the support post 2c.
  • the fastening portion 30a is screwed to the bottom surface F2 with a screw 31. Thereby, the aluminum block 30 contacts and is fixed to the bottom face F2.
  • the aluminum block 30 has a housing portion 30b provided with a substantially rectangular parallelepiped space.
  • An electronic component 32 (for example, a reactor component, an example of a high-profile component) is accommodated in the space of the accommodating portion 30b.
  • the bottom surface of the electronic component 32 is fixed in contact with the bottom surface F ⁇ b> 2 of the heat sink 2.
  • the potting material is filled between the electronic component 32 and the accommodating part 30b.
  • the electronic component 32 is arranged upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) so that the longitudinal direction of the electronic component 32 is along the vertical direction D (see FIGS. 1 to 3).
  • the Further, the length in the vertical direction D of the electronic component 32 (the length in the longitudinal direction of the electronic component 32) is the length in the vertical direction D of the electronic components 5a and 5b (the length in the longitudinal direction of the electronic components 5a and 5b). Longer than.
  • the heat dissipating device 1 for heat generating electronic components is not increased in size in the height direction (vertical direction D).
  • the electronic component 32 arranged on the bottom surface F2 of the heat sink 2 can be fixed (measures against vibration). Further, when the potting material is a heat dissipating potting material, the electronic component 32 can be fixed (measures against vibration) and heat can be dissipated.
  • FIG. 6 is a top perspective view showing an example of the heat dissipation device 1 for heat-generating electronic components according to this modification.
  • the same components as those in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof is omitted.
  • the circuit board 9 shown in FIGS. 1 to 3 is not shown.
  • FIG. 6 is different from FIGS. 1 to 4 in that the heat sink 2 includes electronic components 33 and 34 as shown in FIG.
  • the electronic parts 33 and 34 (for example, reactor parts, examples of high-profile parts) are fixed in contact with the bottom surface F2 of the heat sink 2, respectively.
  • the electronic components 33 and 34 are upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) so that the longitudinal direction of the electronic components 33 and 34 is along the vertical direction D (see FIGS. 1 to 3). Arranged.
  • the length of the electronic components 33 and 34 in the vertical direction D (the length in the longitudinal direction of the electronic components 33 and 34) is the length of the electronic components 5a and 5b in the vertical direction D (the longitudinal direction of the electronic components 5a and 5b). Longer than).
  • the heat dissipating device 1 for heat generating electronic components is not increased in size in the height direction (vertical direction D).
  • the heat dissipation of the electronic components 33 and 34 disposed on the bottom surface F2 of the heat sink 2 can also be performed.
  • the aluminum block 3 and the circuit board 9 have been described by taking as an example the case where the aluminum block 3 and the circuit board 9 are bonded and fixed to each other by bonds 11a and 11b (an example of an adhesive member), but grease, gap filler (an example of a heat dissipation member), and the like.
  • a heat radiating member having no adhesiveness may be provided between the aluminum block 3 and the circuit board 9. Thereby, the heat generated in the circuit board 9 can be transferred to the aluminum block 3 through grease, gap filler, or the like.
  • the grease or gap filler has an insulating property, a pattern can be formed or a semiconductor element can be mounted at a location corresponding to the grease or gap filler in the circuit board 9.
  • the present disclosure is useful for a heat dissipating device for a heat generating electronic component and a manufacturing method thereof.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

This heat radiating device for a heat generating electronic component has a circuit board, a heat generating electronic component, a heat transfer body, and a heat radiating component. The heat generating electronic component self-heats by energization, and has a lead wire connected to the circuit board. The heat transfer body is contacted with a heat radiating surface of the heat generating electronic component, and the heat generating electronic component is arranged thereon. The heat radiating component is molded into a box shape, has a first surface on which the heat transfer body is arranged as well as a second surface that faces the first surface, and radiates heat from the heat transfer body. The heat generating electronic component is fixed on a surface of the heat transfer body which intersects the first surface. The heat transfer body and the circuit board are sequentially arranged in the order of the heat transfer body to the circuit board from the first surface along a vertical direction.

Description

発熱電子部品の放熱装置、およびその製造方法、並びに車載充電器Heat dissipating device for heat generating electronic component, manufacturing method thereof, and in-vehicle charger
　本開示は、発熱電子部品の放熱装置、およびその製造方法、並びに車載充電器に関する。 The present disclosure relates to a heat dissipation device for a heat generating electronic component, a manufacturing method thereof, and an in-vehicle charger.
　従来、放熱部材で形成された略直方体の筐体内に基板や電子部品を格納し、電子部品から発生する熱を、筐体を介して放熱することが知られている。このような略直方体の筐体の構造の製造方法として、上面と側面が箱型に一体成型されるとともに下面が開口された筐体を上方から被せる方法と、下面（底面）と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法の２通りが知られている。 Conventionally, it is known that a substrate or an electronic component is stored in a substantially rectangular parallelepiped casing formed of a heat dissipation member, and heat generated from the electronic component is radiated through the casing. As a manufacturing method of such a substantially rectangular parallelepiped housing structure, a method in which a top surface and a side surface are integrally formed in a box shape and a housing having an open bottom surface is covered from above, and a bottom surface (bottom surface) and a side surface are box shapes. Two methods are known in which a lid member (upper surface) is covered with a casing that is integrally molded with the upper surface and has an upper surface opened.
　上面と側面が箱型に一体成型されるとともに下面が開口された筐体を上方から被せる方法を用いる場合、下面に基板や電子部品を取り付ける際には側面が存在しないため、側方から電子部品をネジ留めすることが可能であるが、一方、筐体内に格納した電子部品を筐体外の電子部品と電気的に接続するための端子（コネクタ）の配置に制約が生じる。 When using a method in which the top and side surfaces are integrally molded into a box shape and the casing with the bottom surface opened is covered from above, there is no side surface when attaching a substrate or electronic component to the bottom surface, so the electronic component from the side However, there is a restriction on the arrangement of terminals (connectors) for electrically connecting the electronic components stored in the housing to the electronic components outside the housing.
　一般的に、コネクタを側面に設ける場合には、下面と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法を用いることが好ましい。 Generally, when the connector is provided on the side surface, it is preferable to use a method in which the lower surface and the side surface are integrally formed in a box shape and a cover member (upper surface) is covered with a housing having an upper surface opened.
　しかしながら、下面と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法においては、下面と側面が箱型に一体成型されているため、側方から電子部品をネジ留めすることが不可能であり、開口された上面からネジ留めを行う必要がある。 However, in the method in which the lower surface and the side surface are integrally molded into a box shape and the cover member (upper surface) is covered with a casing having an upper surface opened, the lower surface and the side surface are integrally molded into the box shape. It is impossible to screw an electronic component, and it is necessary to perform screwing from the opened upper surface.
　開口された上面から電子部品を固定するためのネジ留めを行う方法として、発熱電子部品のリード線を折り曲げることで発熱電子部品の放熱面を底面に直接接触させて配置し、例えば、特許文献１に開示されている弾性部材が放熱面の反対側の面を押さえつけるように弾性部材を上方からネジ留めすることが考えられる。 As a method for screwing in order to fix the electronic component from the opened upper surface, the heat dissipating surface of the heat generating electronic component is placed in direct contact with the bottom surface by bending the lead wire of the heat generating electronic component. It is conceivable that the elastic member is screwed from above so that the elastic member disclosed in (1) presses the surface opposite to the heat radiating surface.
特開２００２－２１７３４３号公報JP 2002-217343 A
　本開示の一態様に係る発熱電子部品の放熱装置は、回路基板と、発熱電子部品と、伝熱体と、放熱部品と、を有している。発熱電子部品は、通電によって自己発熱し、回路基板と接続されるリード線を有する。伝熱体は、発熱電子部品の放熱面が接触し、発熱電子部品が配置される。放熱部品は、箱型に成型され、伝熱体が配置される第１の面と、第１の面に対向し、開口部が設けられた第２の面とを有し、伝熱体からの熱を放熱する。発熱電子部品は、第１の面と交差する伝熱体の面に固定される。伝熱体および回路基板は、第１の面に対する垂直方向に沿って、第１の面から伝熱体、回路基板の順に配置されている。 The heat dissipating device for a heat generating electronic component according to an aspect of the present disclosure includes a circuit board, a heat generating electronic component, a heat transfer body, and a heat dissipating component. The heat generating electronic component self-heats when energized and has a lead wire connected to the circuit board. The heat transfer member is in contact with the heat dissipation surface of the heat generating electronic component, and the heat generating electronic component is disposed. The heat dissipating part has a first surface that is molded into a box shape and on which the heat transfer body is disposed, and a second surface that is opposed to the first surface and that has an opening. Dissipate the heat. The heat generating electronic component is fixed to the surface of the heat transfer body that intersects the first surface. The heat transfer body and the circuit board are arranged in the order of the heat transfer body and the circuit board from the first surface along the direction perpendicular to the first surface.
　本開示の一態様に係る発熱電子部品の放熱装置の製造方法は、通電によって自己発熱し、リード線を有する発熱電子部品の放熱面を伝熱体に接触させた状態で発熱電子部品を伝熱体に配置すること、箱型に一体成型され、一面のみに開口部が設けられた放熱部品の一面から、発熱電子部品が配置された伝熱体を、放熱部品の内部に収容し、放熱部品の一面に対向する面に配置すること、放熱部品の一面から、回路基板を放熱部品の内部に収容し、発熱電子部品のリード線を回路基板に接続すること、を有している。 A method for manufacturing a heat dissipation device for a heat generating electronic component according to an aspect of the present disclosure includes: heat transfer to a heat generating electronic component in a state where the heat generating surface of the heat generating electronic component having a lead wire is in contact with a heat transfer body. The heat transfer body in which heat-generating electronic components are placed from one side of the heat-dissipating component that is integrally molded into a box shape and has an opening on only one surface is housed inside the heat-dissipating component, and the heat-dissipating component The circuit board is housed inside the heat dissipation component and the lead wire of the heat generating electronic component is connected to the circuit board from one surface of the heat dissipation component.
　本開示によれば、箱型に成型され、一面のみに開口部が設けられた放熱部品を用いた場合に、大型化を抑制しつつ、発熱電子部品の放熱を行うことができる。 According to the present disclosure, when a heat dissipation component molded into a box shape and provided with an opening on only one surface is used, heat dissipation of the heat generating electronic component can be performed while suppressing an increase in size.
図１は、本開示の実施の形態に係る発熱電子部品の放熱装置の一例を示す斜視図である。FIG. 1 is a perspective view illustrating an example of a heat dissipation device for heat-generating electronic components according to an embodiment of the present disclosure. 図２は、本開示の実施の形態に係る発熱電子部品の放熱装置の一例を示す正面から見た斜視図である。FIG. 2 is a front perspective view illustrating an example of a heat dissipation device for heat-generating electronic components according to an embodiment of the present disclosure. 図３は、本開示の実施の形態に係る発熱電子部品の放熱装置の一例を示す側面から見た斜視図である。FIG. 3 is a perspective view seen from a side surface showing an example of a heat dissipation device for a heat generating electronic component according to an embodiment of the present disclosure. 図４は、本開示の実施の形態に係る発熱電子部品の放熱装置の一例を示す上面斜視図である。FIG. 4 is a top perspective view illustrating an example of a heat dissipation device for a heat generating electronic component according to an embodiment of the present disclosure. 図５は、本開示の第１の変形例に係る発熱電子部品の放熱装置の構成例を示す上面斜視図である。FIG. 5 is a top perspective view illustrating a configuration example of the heat dissipation device for heat generating electronic components according to the first modification example of the present disclosure. 図６は、本開示の第２の変形例に係る発熱電子部品の放熱装置の構成例を示す上面斜視図である。FIG. 6 is a top perspective view illustrating a configuration example of a heat dissipation device for heat generating electronic components according to a second modification of the present disclosure.
　本開示の実施の形態の説明に先立ち、従来の配線板における問題点を簡単に説明する。特許文献１に開示された放熱部品の底面に発熱電子部品を配置する方法では、放熱効果を確保するために、放熱部品の底面において発熱電子部品の放熱面が接触する部分の面積および弾性部材が設置される部分の面積が必要となり、底面積の大型化、ひいては装置全体が大型化してしまうおそれがある。 Prior to the description of the embodiment of the present disclosure, problems in the conventional wiring board will be briefly described. In the method of disposing the heat generating electronic component on the bottom surface of the heat dissipation component disclosed in Patent Document 1, in order to ensure the heat dissipation effect, the area of the portion where the heat dissipation surface of the heat generating electronic component contacts with the bottom surface of the heat dissipation component and the elastic member The area of the part to be installed is required, and there is a concern that the bottom area may be increased, and the entire apparatus may be increased.
　本開示は、箱型に成型され、一面のみに開口部が設けられた放熱部品を用いた場合に、大型化を抑制しつつ、発熱電子部品の放熱に対応できる発熱電子部品の放熱装置、およびその製造方法を提供する。 The present disclosure discloses a heat dissipation device for a heat generating electronic component capable of supporting heat dissipation of a heat generating electronic component while suppressing an increase in size when using a heat dissipation component molded into a box shape and having an opening on only one surface, and A manufacturing method thereof is provided.
　（実施の形態）
　以下、本開示の実施の形態について、図面を参照して説明する。 (Embodiment)
Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.
　まず、図１～４を用いて、本実施の形態に係る発熱電子部品の放熱装置１の構成例について説明する。図１は、発熱電子部品の放熱装置１の一例を示す斜視図である。図２は、発熱電子部品の放熱装置１の一例を示す正面から見た斜視図である。図３は、発熱電子部品の放熱装置１の一例を示す側面から見た斜視図である。図４は、発熱電子部品の放熱装置１の一例を示す上面斜視図である。なお、図１、図２では、ヒートシンク２の前面部分の図示を省略しており、図３では、ヒートシンク２の側面部分の図示を省略している。また、図４では、図１～図３に示す回路基板９の図示を省略している。 First, a configuration example of the heat dissipation device 1 for heat generating electronic components according to the present embodiment will be described with reference to FIGS. FIG. 1 is a perspective view showing an example of a heat dissipation device 1 for a heat generating electronic component. FIG. 2 is a perspective view seen from the front showing an example of the heat dissipation device 1 for heat-generating electronic components. FIG. 3 is a perspective view seen from the side, showing an example of the heat dissipation device 1 for heat-generating electronic components. FIG. 4 is a top perspective view showing an example of the heat dissipation device 1 for heat-generating electronic components. 1 and 2, the illustration of the front portion of the heat sink 2 is omitted, and the illustration of the side portion of the heat sink 2 is omitted in FIG. In FIG. 4, the circuit board 9 shown in FIGS. 1 to 3 is not shown.
　発熱電子部品の放熱装置１は、例えば、車両に搭載される充電器やインバータ等に用いられる。発熱電子部品の放熱装置１は、ヒートシンク２、アルミブロック３、電子部品５ａ、５ｂ、回路基板９を備える。 The heat dissipating device 1 for heat generating electronic parts is used for, for example, a charger or an inverter mounted on a vehicle. A heat dissipation device 1 for a heat generating electronic component includes a heat sink 2, an aluminum block 3, electronic components 5 a and 5 b, and a circuit board 9.
　ヒートシンク２（放熱部品の一例）は、箱型に一体成型され、一面のみに開口部が設けられている。Ｆ１は、開口面（第２の面の一例）であり、Ｆ２は、開口面Ｆ１に対向する底面（第１の面の一例）である。 The heat sink 2 (an example of a heat radiating component) is integrally formed in a box shape, and an opening is provided only on one surface. F1 is an opening surface (an example of the second surface), and F2 is a bottom surface (an example of the first surface) that faces the opening surface F1.
　ヒートシンク２の底面Ｆ２の四隅には、底面Ｆ２に対する垂直方向Ｄ（以下、単に「垂直方向」という。「第１の方向」の一例）に沿って、支柱２ａ、２ｂ、２ｃ、２ｄが設けられている。支柱２ａ～２ｄには、それぞれ、ネジ穴（図示略）が形成されており、後述する回路基板９がネジ留めされる。 Supports 2a, 2b, 2c, and 2d are provided at four corners of the bottom surface F2 of the heat sink 2 along a direction D perpendicular to the bottom surface F2 (hereinafter, simply referred to as “vertical direction”, an example of “first direction”). ing. Each of the pillars 2a to 2d is formed with a screw hole (not shown), and a circuit board 9 to be described later is screwed.
　アルミブロック３（伝熱体の一例）は、アルミで形成された略直方体の部材である。アルミブロック３は、その長手方向が垂直方向Ｄに沿うようにヒートシンク２の内部に配置されている。 The aluminum block 3 (an example of a heat transfer body) is a substantially rectangular parallelepiped member made of aluminum. The aluminum block 3 is disposed inside the heat sink 2 so that the longitudinal direction thereof is along the vertical direction D.
　アルミブロック３は、その下部に略直方体の締結部３ａを有している。この締結部３ａは、ネジ４ａ、４ｂ（固定部材の一例）により底面Ｆ２にネジ留めされる。これにより、アルミブロック３は、底面Ｆ２に接触して固定される。 The aluminum block 3 has a substantially rectangular parallelepiped fastening portion 3a at its lower part. The fastening portion 3a is screwed to the bottom surface F2 by screws 4a and 4b (an example of a fixing member). Thereby, the aluminum block 3 contacts and is fixed to the bottom face F2.
　電子部品５ａ、５ｂ（発熱電子部品の一例）は、通電によって自己発熱する電子部品であり、例えば、ディスクリート部品、ＦＥＴ（Ｆｉｅｌｄ　Ｅｆｆｅｃｔ　Ｔｒａｎｓｉｓｔｏｒ）等である。電子部品５ａ、５ｂは、それぞれ、リード線６ａ、６ｂを有する。 The electronic components 5a and 5b (an example of a heat generating electronic component) are electronic components that generate heat when energized, and are, for example, discrete components, FETs (Field Effect Transistors), and the like. The electronic components 5a and 5b have lead wires 6a and 6b, respectively.
　電子部品５ａ、５ｂは、それぞれの放熱面がアルミブロック３の側面に接触するように、アルミブロック３に取り付けられる。すなわち、電子部品５ａ、５ｂは、底面Ｆ２と交差するアルミブロック３の面に固定される。例えば、電子部品５ａ、５ｂは、それぞれ、バネ７ａ、７ｂ（保持部材の一例）により、放熱面に対向する面から押さえ付けられ、アルミブロック３の側面に固着して保持される。バネ７ａ、７ｂは、それぞれ、ネジ８ａ、８ｂによりアルミブロック３の側面にネジ留めされる。 The electronic parts 5a and 5b are attached to the aluminum block 3 so that the respective heat radiating surfaces are in contact with the side surfaces of the aluminum block 3. That is, the electronic components 5a and 5b are fixed to the surface of the aluminum block 3 that intersects the bottom surface F2. For example, the electronic components 5 a and 5 b are pressed from the surface facing the heat dissipation surface by springs 7 a and 7 b (an example of a holding member), and are fixed and held on the side surface of the aluminum block 3. The springs 7a and 7b are screwed to the side surface of the aluminum block 3 by screws 8a and 8b, respectively.
　アルミブロック３に固着した電子部品５ａ、５ｂは、垂直方向Ｄに沿って直立した状態となる。すなわち、電子部品５ａ、５ｂの長手方向が、垂直方向Ｄと平行になるように配置される。また、アルミブロック３に固着した電子部品５ａ、５ｂは、ヒートシンク２に接触しない。 The electronic components 5a and 5b fixed to the aluminum block 3 are in an upright state along the vertical direction D. That is, the electronic components 5 a and 5 b are arranged so that the longitudinal direction thereof is parallel to the vertical direction D. Further, the electronic components 5 a and 5 b fixed to the aluminum block 3 do not contact the heat sink 2.
　以上のようにアルミブロック３に固着した電子部品５ａ、５ｂから発生する熱は、アルミブロック３を介して、ヒートシンク２へ伝熱される。これにより、電子部品５ａ、５ｂの放熱が実現される。 As described above, the heat generated from the electronic components 5 a and 5 b fixed to the aluminum block 3 is transferred to the heat sink 2 through the aluminum block 3. Thereby, heat dissipation of the electronic components 5a and 5b is realized.
　なお、図１～図４では、例として、アルミブロック３に固着する電子部品を２つとしたが、１つであってもよいし、３つ以上であってもよい。また、複数の電子部品は、アルミブロック３の一面のみならず複数の面に固着されてもよい。 In FIG. 1 to FIG. 4, two electronic parts are fixed to the aluminum block 3 as an example, but may be one, or may be three or more. Further, the plurality of electronic components may be fixed not only to one surface of the aluminum block 3 but also to a plurality of surfaces.
　回路基板９は、パターンが形成されたり、所定の半導体素子（図示略）が実装されたりするプリント基板である。回路基板９は、上述した支柱２ａ～２ｄに載置される。そして、回路基板９は、ネジ１０ａ、１０ｂ、１０ｃ、１０ｄにより支柱２ａ～２ｄにネジ留めされる。これにより、回路基板９は、支柱２ａ～２ｄに固定される。 The circuit board 9 is a printed board on which a pattern is formed and a predetermined semiconductor element (not shown) is mounted. The circuit board 9 is placed on the above-mentioned support columns 2a to 2d. The circuit board 9 is screwed to the columns 2a to 2d by screws 10a, 10b, 10c, and 10d. As a result, the circuit board 9 is fixed to the columns 2a to 2d.
　また、回路基板９は、例えば半田付けにより、電子部品５ａのリード線６ａおよび電子部品５ｂのリード線６ｂと接続する。 The circuit board 9 is connected to the lead wire 6a of the electronic component 5a and the lead wire 6b of the electronic component 5b by, for example, soldering.
　アルミブロック３および回路基板９は、垂直方向Ｄに沿って、底面Ｆ２からアルミブロック３、回路基板９の順に配置される。 The aluminum block 3 and the circuit board 9 are arranged along the vertical direction D in the order of the aluminum block 3 and the circuit board 9 from the bottom surface F2.
　また、アルミブロック３と回路基板９は、ボンド１１ａ、１１ｂ（接着部材の一例）により互いに接着して固定される。これにより、回路基板９における固定点が多くなり、リード線６ａ、６ｂの折れを防止できる。特に支柱２ａ～２ｄが高く、振動が多く生じる場合に効果を奏する。 The aluminum block 3 and the circuit board 9 are bonded and fixed to each other by bonds 11a and 11b (an example of an adhesive member). As a result, the number of fixing points on the circuit board 9 increases, and the lead wires 6a and 6b can be prevented from being broken. This is particularly effective when the struts 2a to 2d are high and a lot of vibration occurs.
　また、ボンド１１ａ、１１ｂは、絶縁性または放熱性の少なくとも一方を有することが好ましい。ボンド１１ａ、１１ｂが絶縁性を有する場合、回路基板９においてボンド１１ａ、１１ｂに対応する箇所に、パターンを形成したり、半導体素子を実装したりできる。また、ボンド１１ａ、１１ｂが放熱性を有する場合、回路基板９で発生した熱を、ボンド１１ａ、１１ｂを介してアルミブロック３へ伝熱できる。 Moreover, it is preferable that the bonds 11a and 11b have at least one of insulating property and heat dissipation property. When the bonds 11a and 11b have insulating properties, a pattern can be formed or a semiconductor element can be mounted on a portion of the circuit board 9 corresponding to the bonds 11a and 11b. Further, when the bonds 11a and 11b have heat dissipation properties, heat generated in the circuit board 9 can be transferred to the aluminum block 3 through the bonds 11a and 11b.
　なお、図１～図４では、図示を省略しているが、回路基板９の上方に、開口面Ｆ１を閉塞するカバーが設けられてもよい。 Although not shown in FIGS. 1 to 4, a cover for closing the opening surface F1 may be provided above the circuit board 9.
　以上説明したように、本実施の形態の発熱電子部品の放熱装置１は、ヒートシンク２に接触して配置されたアルミブロック３に対して電子部品５ａ、５ｂの放熱面を接触させて配置するため、電子部品５ａ、５ｂの放熱面をヒートシンク２の底面Ｆ２に接触させて配置する場合に比べて、大型化を抑制しつつ、電子部品の放熱に対応することができる。 As described above, the heat dissipating device 1 for the heat generating electronic component according to the present embodiment is disposed so that the heat dissipating surfaces of the electronic components 5a and 5b are in contact with the aluminum block 3 disposed in contact with the heat sink 2. Compared with the case where the heat dissipating surfaces of the electronic components 5a and 5b are arranged in contact with the bottom surface F2 of the heat sink 2, it is possible to cope with the heat dissipating of the electronic components while suppressing an increase in size.
　以上、発熱電子部品の放熱装置１の構成例について説明した。 The configuration example of the heat dissipation device 1 for heat generating electronic components has been described above.
　次に、発熱電子部品の放熱装置１の製造方法について、図１～図４を用いて説明する。 Next, a method for manufacturing the heat dissipating device 1 for heat generating electronic components will be described with reference to FIGS.
　まず、バネ７ａ、７ｂおよびネジ８ａ、８ｂを用いて、電子部品５ａ、５ｂをアルミブロック３に固定して接着させる。このとき、電子部品５ａ、５ｂの放熱面をアルミブロック３に接触させる。なお、電子部品５ａ、５ｂが、絶縁が必要なタイプの場合であれば、電子部品５ａ、５ｂの放熱面とアルミブロック３の間に放熱絶縁シート（図示略）を設けることが好ましい。 First, the electronic components 5a and 5b are fixed and bonded to the aluminum block 3 using the springs 7a and 7b and the screws 8a and 8b. At this time, the heat dissipation surfaces of the electronic components 5a and 5b are brought into contact with the aluminum block 3. If the electronic components 5a and 5b are of a type that requires insulation, it is preferable to provide a heat dissipation insulating sheet (not shown) between the heat dissipation surfaces of the electronic components 5a and 5b and the aluminum block 3.
　次に、電子部品５ａ、５ｂが固着したアルミブロック３を、ヒートシンク２の開口面Ｆ１からヒートシンク２の内部に収容し、アルミブロック３を底面Ｆ２に配置する。そして、ネジ４ａ、４ｂを用いて締結部３ａを底面Ｆ２にネジ留めする。 Next, the aluminum block 3 to which the electronic components 5a and 5b are fixed is accommodated in the heat sink 2 from the opening surface F1 of the heat sink 2, and the aluminum block 3 is disposed on the bottom surface F2. Then, the fastening portion 3a is screwed to the bottom surface F2 using the screws 4a and 4b.
　次に、回路基板９を、ヒートシンク２の開口面からヒートシンク２の内部に収容し、支柱２ａ～２ｄに配置する。このとき、リード線６ａ、６ｂを回路基板９に対して半田付けする。そして、ネジ１０ａ～１０ｄを用いて回路基板９を支柱２ａ～２ｄにネジ留めする。 Next, the circuit board 9 is accommodated in the heat sink 2 from the opening surface of the heat sink 2 and placed on the support columns 2a to 2d. At this time, the lead wires 6 a and 6 b are soldered to the circuit board 9. Then, the circuit board 9 is screwed to the pillars 2a to 2d using the screws 10a to 10d.
　以上の製造方法により、図１～図４に示した発熱電子部品の放熱装置１が製造される。 With the above manufacturing method, the heat dissipating device 1 for heat generating electronic components shown in FIGS. 1 to 4 is manufactured.
　なお、回路基板９のネジ留めの後で、回路基板９の上方に、開口面Ｆ１を閉塞するカバー（図示略）を設けてもよい。 It should be noted that a cover (not shown) for closing the opening surface F1 may be provided above the circuit board 9 after the circuit board 9 is screwed.
　以上、本開示の実施の形態について説明したが、本開示は上記実施の形態に限定されず、種々の変形が可能である。以下、変形例について説明する。 As mentioned above, although embodiment of this indication was described, this indication is not limited to the above-mentioned embodiment, and various modifications are possible. Hereinafter, modified examples will be described.
　（第１の変形例）
　本変形例に係る発熱電子部品の放熱装置１について、図５を用いて説明する。図５は、本変形例に係る発熱電子部品の放熱装置１の一例を示す上面斜視図である。なお、図５において、図１～図４と同じ構成要素には同一符号を付し、その説明は省略する。また、図５では、図１～図３に示した回路基板９の図示を省略している。 (First modification)
A heat dissipating device 1 for a heat generating electronic component according to this modification will be described with reference to FIG. FIG. 5 is a top perspective view showing an example of the heat dissipation device 1 for heat-generating electronic components according to this modification. In FIG. 5, the same components as those in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof is omitted. In FIG. 5, the circuit board 9 shown in FIGS. 1 to 3 is not shown.
　本変形例では、図５に示すように、ヒートシンク２において、アルミブロック３０および電子部品３２を備える点が図１～図４と異なる。 5 is different from FIGS. 1 to 4 in that the heat sink 2 includes an aluminum block 30 and an electronic component 32 as shown in FIG.
　アルミブロック３０は、その下部に略直方体の締結部３０ａを有している。なお、図５では、支柱２ａと支柱２ｂとの間にある締結部３０ａのみを図示しているが、これと同様に支柱２ｄと支柱２ｃの間にも締結部３０ａが存在する。 The aluminum block 30 has a substantially rectangular parallelepiped fastening portion 30a at its lower part. In FIG. 5, only the fastening portion 30a between the support post 2a and the support post 2b is illustrated. Similarly, the fastening portion 30a also exists between the support post 2d and the support post 2c.
　締結部３０ａは、ネジ３１により底面Ｆ２にネジ留めされる。これにより、アルミブロック３０は、底面Ｆ２に接触して固定される。 The fastening portion 30a is screwed to the bottom surface F2 with a screw 31. Thereby, the aluminum block 30 contacts and is fixed to the bottom face F2.
　また、アルミブロック３０は、略直方体状の空間が設けられた収容部３０ｂを有する。この収容部３０ｂの空間には、電子部品３２（例えば、リアクトル部品。高背部品の一例）が収容される。電子部品３２の底面は、ヒートシンク２の底面Ｆ２に接触して固定される。なお、図示は省略しているが、電子部品３２と収容部３０ｂとの間には、ポッティング材が充填されている。 Further, the aluminum block 30 has a housing portion 30b provided with a substantially rectangular parallelepiped space. An electronic component 32 (for example, a reactor component, an example of a high-profile component) is accommodated in the space of the accommodating portion 30b. The bottom surface of the electronic component 32 is fixed in contact with the bottom surface F <b> 2 of the heat sink 2. In addition, although illustration is abbreviate | omitted, the potting material is filled between the electronic component 32 and the accommodating part 30b.
　電子部品３２は、底面Ｆ２と回路基板９（図１～図３参照）の間において、電子部品３２の長手方向が垂直方向Ｄ（図１～図３参照）に沿うように直立して配置される。また、電子部品３２の垂直方向Ｄの長さ（電子部品３２の長手方向の長さ）は、電子部品５ａ、５ｂの垂直方向Ｄの長さ（電子部品５ａ、５ｂの長手方向の長さ）よりも長い。 The electronic component 32 is arranged upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) so that the longitudinal direction of the electronic component 32 is along the vertical direction D (see FIGS. 1 to 3). The Further, the length in the vertical direction D of the electronic component 32 (the length in the longitudinal direction of the electronic component 32) is the length in the vertical direction D of the electronic components 5a and 5b (the length in the longitudinal direction of the electronic components 5a and 5b). Longer than.
　このように、電子部品３２を底面Ｆ２に配置することにより、回路基板９と底面Ｆ２との間に空間が設けられ、その空間にアルミブロック３を配置できる。よって、発熱電子部品の放熱装置１がその高さ方向（垂直方向Ｄ）に大型化することはない。 Thus, by disposing the electronic component 32 on the bottom surface F2, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be disposed in the space. Therefore, the heat dissipating device 1 for heat generating electronic components is not increased in size in the height direction (vertical direction D).
　本変形例によれば、実施の形態１で述べた効果に加え、ヒートシンク２の底面Ｆ２に配置された電子部品３２の固定（振動対策）も行うことができる。また、ポッティング材が放熱性のポッティング材である場合には、電子部品３２の固定（振動対策）と放熱も行うことができる。 According to this modification, in addition to the effects described in the first embodiment, the electronic component 32 arranged on the bottom surface F2 of the heat sink 2 can be fixed (measures against vibration). Further, when the potting material is a heat dissipating potting material, the electronic component 32 can be fixed (measures against vibration) and heat can be dissipated.
　（第２の変形例）
　本変形例に係る発熱電子部品の放熱装置１について、図６を用いて説明する。図６は、本変形例に係る発熱電子部品の放熱装置１の一例を示す上面斜視図である。なお、図６において、図１～図４と同じ構成要素には同一符号を付し、その説明は省略する。また、図６では、図１～図３に示した回路基板９の図示を省略している。 (Second modification)
A heat dissipation device 1 for a heat generating electronic component according to this modification will be described with reference to FIG. FIG. 6 is a top perspective view showing an example of the heat dissipation device 1 for heat-generating electronic components according to this modification. In FIG. 6, the same components as those in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof is omitted. In FIG. 6, the circuit board 9 shown in FIGS. 1 to 3 is not shown.
　本変形例では、図６に示すように、ヒートシンク２において、電子部品３３、３４を備える点が図１～図４と異なる。 6 is different from FIGS. 1 to 4 in that the heat sink 2 includes electronic components 33 and 34 as shown in FIG.
　電子部品３３、３４（例えば、リアクトル部品。高背部品の一例）は、それぞれ、ヒートシンク２の底面Ｆ２に接触して固定される。 The electronic parts 33 and 34 (for example, reactor parts, examples of high-profile parts) are fixed in contact with the bottom surface F2 of the heat sink 2, respectively.
　電子部品３３、３４は、底面Ｆ２と回路基板９（図１～図３参照）の間において、電子部品３３、３４の長手方向が垂直方向Ｄ（図１～図３参照）に沿うように直立して配置される。また、電子部品３３、３４の垂直方向Ｄの長さ（電子部品３３、３４の長手方向の長さ）は、電子部品５ａ、５ｂの垂直方向Ｄの長さ（電子部品５ａ、５ｂの長手方向の長さ）よりも長い。 The electronic components 33 and 34 are upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) so that the longitudinal direction of the electronic components 33 and 34 is along the vertical direction D (see FIGS. 1 to 3). Arranged. The length of the electronic components 33 and 34 in the vertical direction D (the length in the longitudinal direction of the electronic components 33 and 34) is the length of the electronic components 5a and 5b in the vertical direction D (the longitudinal direction of the electronic components 5a and 5b). Longer than).
　このように、電子部品３３、３４を底面Ｆ２に配置することにより、回路基板９と底面Ｆ２との間に空間が設けられ、その空間にアルミブロック３を配置できる。よって、発熱電子部品の放熱装置１がその高さ方向（垂直方向Ｄ）に大型化することはない。 Thus, by arranging the electronic components 33 and 34 on the bottom surface F2, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be disposed in the space. Therefore, the heat dissipating device 1 for heat generating electronic components is not increased in size in the height direction (vertical direction D).
　本変形例では、実施の形態１で述べた効果に加え、ヒートシンク２の底面Ｆ２に配置された電子部品３３、３４の放熱も行うことができる。 In this modification, in addition to the effects described in the first embodiment, the heat dissipation of the electronic components 33 and 34 disposed on the bottom surface F2 of the heat sink 2 can also be performed.
　（第３の変形例）
　実施の形態では、ヒートシンク２を用いて空冷を行う場合を例に挙げて説明したが、空冷の代わりに、水冷を適用してもよい。 (Third Modification)
In the embodiment, the case where air cooling is performed using the heat sink 2 has been described as an example, but water cooling may be applied instead of air cooling.
　（第４の変形例）
　実施の形態では、アルミブロック３の底面Ｆ２への締結、バネ７ａ、７ｂのアルミブロック３への締結、回路基板９の支柱２ａ～２ｄへの締結にネジを用いる場合を例に挙げて説明したが、ネジの代わりに、ボンドを用いてもよい。また、実施の形態では、電子部品５ａ、５ｂのアルミブロック３への固着にバネを用いる場合を例に挙げて説明したが、バネの代わりに、ネジを用いてもよい。 (Fourth modification)
In the embodiment, the case where screws are used for fastening the aluminum block 3 to the bottom surface F2, fastening the springs 7a and 7b to the aluminum block 3, and fastening the circuit board 9 to the columns 2a to 2d has been described as an example. However, a bond may be used instead of the screw. In the embodiment, the case where a spring is used for fixing the electronic components 5a and 5b to the aluminum block 3 has been described as an example. However, a screw may be used instead of the spring.
　（第５の変形例）
　また、アルミブロック３と回路基板９は、ボンド１１ａ、１１ｂ（接着部材の一例）により互いに接着して固定される場合を例に挙げて説明したが、グリスやギャップフィラー（放熱部材の一例）等の接着性を有しない放熱性部材をアルミブロック３と回路基板９の間に設けてもよい。これにより、回路基板９で発生した熱を、グリスやギャップフィラー等を介してアルミブロック３へ伝熱できる。また、グリスやギャップフィラーが絶縁性を有する場合、回路基板９においてグリスやギャップフィラーに対応する箇所に、パターンを形成したり、半導体素子を実装したりできる。 (Fifth modification)
In addition, the aluminum block 3 and the circuit board 9 have been described by taking as an example the case where the aluminum block 3 and the circuit board 9 are bonded and fixed to each other by bonds 11a and 11b (an example of an adhesive member), but grease, gap filler (an example of a heat dissipation member), and the like. A heat radiating member having no adhesiveness may be provided between the aluminum block 3 and the circuit board 9. Thereby, the heat generated in the circuit board 9 can be transferred to the aluminum block 3 through grease, gap filler, or the like. Further, when the grease or gap filler has an insulating property, a pattern can be formed or a semiconductor element can be mounted at a location corresponding to the grease or gap filler in the circuit board 9.
　本開示は、発熱電子部品の放熱装置、およびその製造方法に有用である。 The present disclosure is useful for a heat dissipating device for a heat generating electronic component and a manufacturing method thereof.
　１　発熱電子部品の放熱装置
　２　ヒートシンク
　２ａ，２ｂ，２ｃ，２ｄ　支柱
　３，３０　アルミブロック
　３ａ，３０ａ　締結部
　４ａ，４ｂ，８ａ，８ｂ，１０ａ，１０ｂ，１０ｃ，１０ｄ，３１　ネジ
　５ａ，５ｂ　電子部品
　６ａ，６ｂ　リード線
　７ａ，７ｂ　バネ
　９　回路基板
　３０ｂ　収容部
　３２，３３，３４　電子部品 DESCRIPTION OF SYMBOLS 1 Heat dissipation device of heat-generating electronic component 2 Heat sink 2a, 2b, 2c, 2d Post 3,30 Aluminum block 3a, 30a Fastening portion 4a, 4b, 8a, 8b, 10a, 10b, 10c, 10d, 31 Screw 5a, 5b Electronic component 6a, 6b Lead wire 7a, 7b Spring 9 Circuit board 30b Housing part 32, 33, 34 Electronic component

Claims (10)

  1. 　回路基板と、
    　通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、
    　前記発熱電子部品の放熱面が接触し、前記発熱電子部品が配置される伝熱体と、
    　箱型に成型され、前記伝熱体が配置される第１の面と、前記第１の面に対向し、開口部が設けられた第２の面とを有し、前記伝熱体からの熱を放熱する放熱部品と、を有し、
    　前記発熱電子部品は、前記第１の面と交差する前記伝熱体の面に固定され、
    　前記伝熱体および前記回路基板は、前記第１の面に対して垂直な第１の方向に沿って、前記第１の面から前記伝熱体、前記回路基板の順に配置されている、
    　発熱電子部品の放熱装置。     A circuit board;
    A heat-generating electronic component having a lead wire that is self-heated by energization and connected to the circuit board;
    A heat transfer body in which the heat-radiating surface of the heat-generating electronic component is in contact and the heat-generating electronic component is disposed;
    A first surface that is molded into a box shape and on which the heat transfer body is disposed; and a second surface that is opposed to the first surface and that is provided with an opening. And a heat dissipating component that dissipates heat,
    The heat generating electronic component is fixed to a surface of the heat transfer body that intersects the first surface,
    The heat transfer body and the circuit board are arranged in the order of the heat transfer body and the circuit board from the first face along a first direction perpendicular to the first face.
    Heat dissipation device for heat generating electronic components.
  2. 　前記発熱電子部品は、
    　前記発熱電子部品の長手方向が前記第１の方向に平行となる状態、かつ、前記放熱部品に接触しない状態で、前記伝熱体に固定される、
    　請求項１に記載の発熱電子部品の放熱装置。     The heat generating electronic component is
    In a state where the longitudinal direction of the heat generating electronic component is parallel to the first direction and in a state where the heat generating electronic component is not in contact with the heat dissipation component, the heat transfer electronic component is fixed to the heat transfer body.
    The heat dissipating device for heat-generating electronic components according to claim 1.
  3. 　前記伝熱体は、
    　接着部材により前記回路基板に接着して固定される、
    　請求項１または２に記載の発熱電子部品の放熱装置。     The heat transfer body is
    Glued and fixed to the circuit board by an adhesive member,
    The heat-radiating device for heat-generating electronic components according to claim 1 or 2.
  4. 　前記接着部材は、
    　絶縁性または放熱性の少なくとも一方を有する、
    　請求項３に記載の発熱電子部品の放熱装置。     The adhesive member is
    Having at least one of insulation or heat dissipation,
    The heat dissipating device for heat-generating electronic components according to claim 3.
  5. 　前記伝熱体と前記回路基板の間に放熱部材が配置される、
    　請求項１または２に記載の発熱電子部品の放熱装置。     A heat dissipation member is disposed between the heat transfer body and the circuit board.
    The heat-radiating device for heat-generating electronic components according to claim 1 or 2.
  6. 　前記放熱部品の底面と前記回路基板との間に、高背部品をさらに有し、
    　前記高背部品の前記第１の方向の長さは、前記発熱電子部品の前記第１の方向の長さよりも長い、
    　請求項１または２に記載の発熱電子部品の放熱装置。     Between the bottom surface of the heat dissipating component and the circuit board, further includes a high-profile component,
    The length of the high-profile component in the first direction is longer than the length of the heat generating electronic component in the first direction.
    The heat-radiating device for heat-generating electronic components according to claim 1 or 2.
  7. 　前記伝熱体は、
    　前記放熱部品の前記第１の面に接触するように固定される、
    　請求項１または２に記載の発熱電子部品の放熱装置。     The heat transfer body is
    It is fixed so as to contact the first surface of the heat dissipation component.
    The heat-radiating device for heat-generating electronic components according to claim 1 or 2.
  8. 　通電によって自己発熱し、リード線を有する発熱電子部品の放熱面を伝熱体に接触させた状態で前記発熱電子部品を前記伝熱体に配置すること、
    　箱型に一体成型され、一面のみに開口部が設けられた放熱部品の前記一面から、前記発熱電子部品が配置された前記伝熱体を、前記放熱部品の内部に収容し、前記放熱部品の前記一面に対向する面に配置すること、
    　前記放熱部品の前記一面から、回路基板を前記放熱部品の内部に収容し、前記発熱電子部品の前記リード線を前記回路基板に接続すること、を備える、
    　発熱電子部品の放熱装置の製造方法。     Disposing the heat generating electronic component on the heat transfer body in a state of self-heating by energization and contacting the heat transfer surface of the heat generating electronic component having a lead wire with the heat transfer body;
    The heat transfer body in which the heat generating electronic component is disposed from the one surface of the heat dissipation component that is integrally molded in a box shape and provided with an opening on only one surface is accommodated inside the heat dissipation component, Disposing on a surface facing the one surface;
    The circuit board is accommodated inside the heat dissipation component from the one surface of the heat dissipation component, and the lead wire of the heat generating electronic component is connected to the circuit board.
    A method of manufacturing a heat dissipation device for heat-generating electronic components.
  9. 　前記発熱電子部品を、前記一面に対する垂直方向以外の方向から前記伝熱体に固定した後、前記伝熱体を、前記一面から前記放熱部品の内部に収容し、
    　前記伝熱体を、前記伝熱体が前記一面に対向する面に接触するように前記一面に対する垂直方向から固定する、
    　請求項８に記載の発熱電子部品の放熱装置の製造方法。     After fixing the heat generating electronic component to the heat transfer body from a direction other than the direction perpendicular to the one surface, the heat transfer member is housed in the heat dissipation component from the one surface,
    Fixing the heat transfer body from a direction perpendicular to the one surface so that the heat transfer body contacts a surface facing the one surface;
    A method for manufacturing a heat dissipation device for heat-generating electronic components according to claim 8.
  10. 　回路基板と、
    　通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、
    　前記発熱電子部品の放熱面が接触し、前記発熱電子部品が配置される伝熱体と、
    　箱型に成型され、前記伝熱体が配置される第１の面と、前記第１の面に対向し、開口部が設けられた第２の面とを有し、前記伝熱体からの熱を放熱する放熱部品と、を有し、
    　前記発熱電子部品は、前記第１の面と交差する前記伝熱体の面に固定され、
    　前記伝熱体および前記回路基板は、前記第１の面に対して垂直な第１の方向に沿って、前記第１の面から前記伝熱体、前記回路基板の順に配置されている、
    　車載充電器。     A circuit board;
    A heat-generating electronic component having a lead wire that is self-heated by energization and connected to the circuit board;
    A heat transfer body in which the heat-radiating surface of the heat-generating electronic component is in contact and the heat-generating electronic component is disposed;
    A first surface that is molded into a box shape and on which the heat transfer body is disposed; and a second surface that is opposed to the first surface and that is provided with an opening. And a heat dissipating component that dissipates heat,
    The heat generating electronic component is fixed to a surface of the heat transfer body that intersects the first surface,
    The heat transfer body and the circuit board are arranged in the order of the heat transfer body and the circuit board from the first face along a first direction perpendicular to the first face.
    Car charger.
PCT/JP2016/005018 2015-12-10 2016-11-30 Heat radiating device for heat generating electronic component, manufacturing method thereof, and vehicle-mounted charger WO2017098703A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201690001311.2U CN208690245U (en) 2015-12-10 2016-11-30 The radiator and onboard charger of heat-generating electronic part

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015241074A JP6726862B2 (en) 2015-12-10 2015-12-10 Heat dissipation device for heat-generating electronic components and in-vehicle charger
JP2015-241074 2015-12-10

Publications (1)

Publication Number Publication Date
WO2017098703A1 true WO2017098703A1 (en) 2017-06-15

Family

ID=59013845

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/005018 WO2017098703A1 (en) 2015-12-10 2016-11-30 Heat radiating device for heat generating electronic component, manufacturing method thereof, and vehicle-mounted charger

Country Status (3)

Country Link
JP (1) JP6726862B2 (en)
CN (1) CN208690245U (en)
WO (1) WO2017098703A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112075129A (en) * 2018-05-22 2020-12-11 株式会社自动网络技术研究所 Circuit arrangement

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112019002133B4 (en) 2018-04-25 2024-02-15 Panasonic Intellectual Property Management Co., Ltd. Power supply device
JP7304540B2 (en) * 2019-12-12 2023-07-07 パナソニックＩｐマネジメント株式会社 POWER CONVERSION DEVICE AND METHOD FOR MANUFACTURING POWER CONVERSION DEVICE

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247199U (en) * 1985-09-12 1987-03-23
JPS6367256U (en) * 1986-10-23 1988-05-06
JPH0538980U (en) * 1991-10-18 1993-05-25 株式会社ケンウツド Radiator
JPH06196885A (en) * 1992-12-25 1994-07-15 Sony Corp Heat sink
JP2002271068A (en) * 2001-03-14 2002-09-20 Denso Corp Electronic device
JP2009026780A (en) * 2007-07-17 2009-02-05 Hitachi Ltd Electronic control device
JP2009088048A (en) * 2007-09-28 2009-04-23 Hitachi Ltd Electronic control device using lc module structure
JP2014225630A (en) * 2013-04-22 2014-12-04 株式会社デンソー Electronic control device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247199U (en) * 1985-09-12 1987-03-23
JPS6367256U (en) * 1986-10-23 1988-05-06
JPH0538980U (en) * 1991-10-18 1993-05-25 株式会社ケンウツド Radiator
JPH06196885A (en) * 1992-12-25 1994-07-15 Sony Corp Heat sink
JP2002271068A (en) * 2001-03-14 2002-09-20 Denso Corp Electronic device
JP2009026780A (en) * 2007-07-17 2009-02-05 Hitachi Ltd Electronic control device
JP2009088048A (en) * 2007-09-28 2009-04-23 Hitachi Ltd Electronic control device using lc module structure
JP2014225630A (en) * 2013-04-22 2014-12-04 株式会社デンソー Electronic control device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112075129A (en) * 2018-05-22 2020-12-11 株式会社自动网络技术研究所 Circuit arrangement

Also Published As

Publication number Publication date
JP6726862B2 (en) 2020-07-22
JP2017108007A (en) 2017-06-15
CN208690245U (en) 2019-04-02

Similar Documents

Publication Publication Date Title
JP4300371B2 (en) Semiconductor device
CN110915312B (en) Circuit structure and electrical connection box
KR20130121402A (en) Semiconductor package module
CN110383612B (en) Electric connection box
US10271419B2 (en) Heat dissipating structure and electronic device
WO2017098703A1 (en) Heat radiating device for heat generating electronic component, manufacturing method thereof, and vehicle-mounted charger
WO2015029629A1 (en) Vehicular electronic control device
US20140252583A1 (en) Power Semiconductor Assembly and Module
JP2005142379A (en) Electronic equipment device
JP2020047765A (en) Electrical device and radiator
JP2021093485A (en) Electric power conversion equipment, and manufacturing method for electric power conversion equipment
JP2017108007A5 (en) Heat dissipating device for heat generating electronic component, manufacturing method thereof, and in-vehicle charger
JP7262012B2 (en) Onboard charger and inverter
JP6982776B2 (en) Heat dissipation devices for heat-generating electronic components, in-vehicle chargers, and vehicles
JP2019169638A (en) Heating component mounting structure
JP2014183719A (en) Member for holding distance between substrates, and inverter device
JP2011082344A (en) Method for locking electronic component and electronic apparatus
JP2009238923A (en) Electronic equipment
JP2020053649A (en) Electronic apparatus
JP5777175B2 (en) Electronic circuit board and its assembly method
JP2009188192A (en) Circuit device
WO2021075360A1 (en) Electronic control device
WO2019216366A1 (en) Circuit structure
JP2019075415A (en) Semiconductor device
JP2015056521A (en) Electronic system

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16872605

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16872605

Country of ref document: EP

Kind code of ref document: A1