JPS63172194U - - Google Patents
Info
- Publication number
- JPS63172194U JPS63172194U JP6586987U JP6586987U JPS63172194U JP S63172194 U JPS63172194 U JP S63172194U JP 6586987 U JP6586987 U JP 6586987U JP 6586987 U JP6586987 U JP 6586987U JP S63172194 U JPS63172194 U JP S63172194U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat generating
- generating component
- attached
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図〜第４図はこの考案の一実施例を示すも
のであつて、第１図は全体断面図、第２図は発熱
部品と放熱部材との組み付け状態を示す分解斜視
図、第３図は基板と発熱部品との組み付け状態を
示す一部を切り欠いた斜視図、第４図は基板と放
熱部材との組み付け状態を示す要部底面図、第５
図は従来例を示す正面図である。
１，５……回路基板（基板）、２，６……電子
部品、３，７……発熱部品、４，１２……放熱部
材、Ｓ……空隙。
1 to 4 show an embodiment of this invention, in which FIG. 1 is an overall sectional view, FIG. 2 is an exploded perspective view showing the assembled state of a heat generating component and a heat radiating member, and FIG. The figure is a partially cutaway perspective view showing the assembled state of the board and the heat-generating component, FIG. 4 is a bottom view of essential parts showing the assembled state of the board and heat dissipation member, and
The figure is a front view showing a conventional example. 1, 5... Circuit board (substrate), 2, 6... Electronic component, 3, 7... Heat generating component, 4, 12... Heat dissipation member, S... Gap.
Claims (1)
る発熱部品と、この発熱部品の下方で前記基板に
取り付ける電子部品と、前記発熱部品に熱伝導可
能に接触する放熱部材とを有することを特徴とす
る発熱部品の放熱構造。 It is characterized by having a heat generating component that is attached to the substrate with a gap therebetween, an electronic component that is attached to the substrate below the heat generating component, and a heat radiating member that contacts the heat generating component in a heat conductive manner. Heat dissipation structure for heat generating parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6586987U JPS63172194U (en) | 1987-04-30 | 1987-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6586987U JPS63172194U (en) | 1987-04-30 | 1987-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172194U true JPS63172194U (en) | 1988-11-09 |
Family
ID=30903343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6586987U Pending JPS63172194U (en) | 1987-04-30 | 1987-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172194U (en) |
-
1987
- 1987-04-30 JP JP6586987U patent/JPS63172194U/ja active Pending