JPH0252353U - - Google Patents
Info
- Publication number
- JPH0252353U JPH0252353U JP12881688U JP12881688U JPH0252353U JP H0252353 U JPH0252353 U JP H0252353U JP 12881688 U JP12881688 U JP 12881688U JP 12881688 U JP12881688 U JP 12881688U JP H0252353 U JPH0252353 U JP H0252353U
- Authority
- JP
- Japan
- Prior art keywords
- guide frame
- metal plate
- heatsink
- semiconductor element
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 7
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1〜5図は本考案の第1実施例を示し、第1
図はその分解斜面図、第2図は放熱器本体に金属
板を組み込んだ状態の斜面図、第3図は放熱器本
体に金属板と半導体素子を組込んだ状態の正面図
、第4図はその中央断面図、第5図はその背面図
である。第6〜10図は本考案の第2実施例を示
し、第6図はその分解斜面図、第7図は放熱器本
体に金属板を組込んだ状態の斜面図、第8図は放
熱器本体に金属板と半導体素子を組込んだ状態の
正面図、第9図はその中央断面図、第10図はそ
の背面図である。
図中、1……放熱器本体、2……装着部、3,
3a……突出部、4……ガイド枠、5……溝、8
……金属板、10……切起片、11……半導体素
子。
1 to 5 show a first embodiment of the present invention.
The figure is an exploded perspective view, Figure 2 is a perspective view of the metal plate assembled into the heatsink body, Figure 3 is a front view of the metal plate and semiconductor element assembled into the heatsink body, and Figure 4 is a central sectional view thereof, and FIG. 5 is a rear view thereof. 6 to 10 show a second embodiment of the present invention, FIG. 6 is an exploded perspective view thereof, FIG. 7 is a perspective view of the radiator body with the metal plate assembled, and FIG. 8 is the radiator body. FIG. 9 is a front view of a state in which a metal plate and a semiconductor element are assembled into the main body, FIG. 9 is a central sectional view thereof, and FIG. 10 is a rear view thereof. In the figure, 1... Heatsink main body, 2... Mounting part, 3,
3a...Protrusion, 4...Guide frame, 5...Groove, 8
...Metal plate, 10... Cut and cut piece, 11... Semiconductor element.
Claims (1)
装着部を構成し、該装着部の奥部に突出部を設け
ると共に前記のガイド枠に形成した溝に下方への
切起片を有する金属板を装着して成る半導体素子
用放熱器。 2 放熱器本体にガイド枠を有する半導体素子の
装着部を構成し、前記のガイド枠に形成した溝に
装着する金属板に下方への切起片と共にその奥部
下面に突出を設けて成る半導体素子用放熱器。[Claims for Utility Model Registration] 1. A radiator body has a guide frame for mounting a semiconductor element, and a protrusion is provided in the inner part of the mounting part, and a groove formed in the guide frame is provided with a downwardly extending groove. A heatsink for semiconductor devices, which is equipped with a metal plate having cut and raised pieces. 2. A semiconductor device that constitutes a mounting part for a semiconductor element having a guide frame in a heatsink body, and a metal plate that is mounted in a groove formed in the guide frame, and a protrusion provided on the bottom surface of the back of the metal plate along with a downward cut-out piece. Heat sink for elements.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12881688U JPH0547474Y2 (en) | 1988-10-03 | 1988-10-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12881688U JPH0547474Y2 (en) | 1988-10-03 | 1988-10-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0252353U true JPH0252353U (en) | 1990-04-16 |
JPH0547474Y2 JPH0547474Y2 (en) | 1993-12-14 |
Family
ID=31382517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12881688U Expired - Lifetime JPH0547474Y2 (en) | 1988-10-03 | 1988-10-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0547474Y2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0518038U (en) * | 1991-08-07 | 1993-03-05 | 水谷電機工業株式会社 | Heat sink for electronic parts |
JPH07283351A (en) * | 1994-04-15 | 1995-10-27 | Riyoosan:Kk | Heat sink for cooling semiconductor element |
JP6223520B1 (en) * | 2016-09-02 | 2017-11-01 | 三菱電機株式会社 | Power converter |
-
1988
- 1988-10-03 JP JP12881688U patent/JPH0547474Y2/ja not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0518038U (en) * | 1991-08-07 | 1993-03-05 | 水谷電機工業株式会社 | Heat sink for electronic parts |
JPH07283351A (en) * | 1994-04-15 | 1995-10-27 | Riyoosan:Kk | Heat sink for cooling semiconductor element |
JP6223520B1 (en) * | 2016-09-02 | 2017-11-01 | 三菱電機株式会社 | Power converter |
Also Published As
Publication number | Publication date |
---|---|
JPH0547474Y2 (en) | 1993-12-14 |