JPH0252353U - - Google Patents

Info

Publication number
JPH0252353U
JPH0252353U JP12881688U JP12881688U JPH0252353U JP H0252353 U JPH0252353 U JP H0252353U JP 12881688 U JP12881688 U JP 12881688U JP 12881688 U JP12881688 U JP 12881688U JP H0252353 U JPH0252353 U JP H0252353U
Authority
JP
Japan
Prior art keywords
guide frame
metal plate
heatsink
semiconductor element
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12881688U
Other languages
Japanese (ja)
Other versions
JPH0547474Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12881688U priority Critical patent/JPH0547474Y2/ja
Publication of JPH0252353U publication Critical patent/JPH0252353U/ja
Application granted granted Critical
Publication of JPH0547474Y2 publication Critical patent/JPH0547474Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1〜5図は本考案の第1実施例を示し、第1
図はその分解斜面図、第2図は放熱器本体に金属
板を組み込んだ状態の斜面図、第3図は放熱器本
体に金属板と半導体素子を組込んだ状態の正面図
、第4図はその中央断面図、第5図はその背面図
である。第6〜10図は本考案の第2実施例を示
し、第6図はその分解斜面図、第7図は放熱器本
体に金属板を組込んだ状態の斜面図、第8図は放
熱器本体に金属板と半導体素子を組込んだ状態の
正面図、第9図はその中央断面図、第10図はそ
の背面図である。 図中、1……放熱器本体、2……装着部、3,
3a……突出部、4……ガイド枠、5……溝、8
……金属板、10……切起片、11……半導体素
子。
1 to 5 show a first embodiment of the present invention.
The figure is an exploded perspective view, Figure 2 is a perspective view of the metal plate assembled into the heatsink body, Figure 3 is a front view of the metal plate and semiconductor element assembled into the heatsink body, and Figure 4 is a central sectional view thereof, and FIG. 5 is a rear view thereof. 6 to 10 show a second embodiment of the present invention, FIG. 6 is an exploded perspective view thereof, FIG. 7 is a perspective view of the radiator body with the metal plate assembled, and FIG. 8 is the radiator body. FIG. 9 is a front view of a state in which a metal plate and a semiconductor element are assembled into the main body, FIG. 9 is a central sectional view thereof, and FIG. 10 is a rear view thereof. In the figure, 1... Heatsink main body, 2... Mounting part, 3,
3a...Protrusion, 4...Guide frame, 5...Groove, 8
...Metal plate, 10... Cut and cut piece, 11... Semiconductor element.

Claims (1)

【実用新案登録請求の範囲】 1 放熱器本体にガイド枠を有する半導体素子の
装着部を構成し、該装着部の奥部に突出部を設け
ると共に前記のガイド枠に形成した溝に下方への
切起片を有する金属板を装着して成る半導体素子
用放熱器。 2 放熱器本体にガイド枠を有する半導体素子の
装着部を構成し、前記のガイド枠に形成した溝に
装着する金属板に下方への切起片と共にその奥部
下面に突出を設けて成る半導体素子用放熱器。
[Claims for Utility Model Registration] 1. A radiator body has a guide frame for mounting a semiconductor element, and a protrusion is provided in the inner part of the mounting part, and a groove formed in the guide frame is provided with a downwardly extending groove. A heatsink for semiconductor devices, which is equipped with a metal plate having cut and raised pieces. 2. A semiconductor device that constitutes a mounting part for a semiconductor element having a guide frame in a heatsink body, and a metal plate that is mounted in a groove formed in the guide frame, and a protrusion provided on the bottom surface of the back of the metal plate along with a downward cut-out piece. Heat sink for elements.
JP12881688U 1988-10-03 1988-10-03 Expired - Lifetime JPH0547474Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12881688U JPH0547474Y2 (en) 1988-10-03 1988-10-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12881688U JPH0547474Y2 (en) 1988-10-03 1988-10-03

Publications (2)

Publication Number Publication Date
JPH0252353U true JPH0252353U (en) 1990-04-16
JPH0547474Y2 JPH0547474Y2 (en) 1993-12-14

Family

ID=31382517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12881688U Expired - Lifetime JPH0547474Y2 (en) 1988-10-03 1988-10-03

Country Status (1)

Country Link
JP (1) JPH0547474Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0518038U (en) * 1991-08-07 1993-03-05 水谷電機工業株式会社 Heat sink for electronic parts
JPH07283351A (en) * 1994-04-15 1995-10-27 Riyoosan:Kk Heat sink for cooling semiconductor element
JP6223520B1 (en) * 2016-09-02 2017-11-01 三菱電機株式会社 Power converter

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0518038U (en) * 1991-08-07 1993-03-05 水谷電機工業株式会社 Heat sink for electronic parts
JPH07283351A (en) * 1994-04-15 1995-10-27 Riyoosan:Kk Heat sink for cooling semiconductor element
JP6223520B1 (en) * 2016-09-02 2017-11-01 三菱電機株式会社 Power converter

Also Published As

Publication number Publication date
JPH0547474Y2 (en) 1993-12-14

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