JPS6426848U - - Google Patents
Info
- Publication number
- JPS6426848U JPS6426848U JP5434687U JP5434687U JPS6426848U JP S6426848 U JPS6426848 U JP S6426848U JP 5434687 U JP5434687 U JP 5434687U JP 5434687 U JP5434687 U JP 5434687U JP S6426848 U JPS6426848 U JP S6426848U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- heat dissipating
- mounting board
- board
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ〜ｃは本考案の第１の実施例の正面図
、Ａ―Ａ′線断面図及び背面図、第２図ａ〜ｃは
第１の放熱基板の正面図、Ｂ―Ｂ′線断面図及び
背面図、第３図ａ〜ｃは本考案の第２の実施例の
正面図、Ｃ―Ｃ′線断面図及び背面図、第４図ａ
〜ｃは第３図の放熱基板の正面図、Ｄ―Ｄ′線断
面図及び背面図、第５図ａ〜ｃは従来の樹脂封止
形半導体装置の一例の正面図、Ｅ―Ｅ′線断面図
及び背面図、第６図ａ〜ｃは第５図の放熱基板正
面図、Ｆ―Ｆ′線断面図及び背面図である。
１……半導体チツプ、２Ａ〜２Ｃ……放熱基板
、２ａ……放熱片、２Ａｂ〜２Ｃｂ……チツプ載
置基板、２ｃ……基板正面、２ｄ……基板背面、
４……貫通孔、５，６……凹部、９……樹脂部。
Figures 1 a to c are a front view, a sectional view taken along the line A-A', and a rear view of the first embodiment of the present invention, and Figures 2 a to c are front views of the first heat dissipation board, B-B' Line sectional view and rear view, Figures 3a-c are front views of the second embodiment of the present invention, CC' line sectional view and rear view, Figure 4a
~c are a front view, a sectional view taken along the line D-D', and a rear view of the heat dissipation board in Figure 3; Figures a~c are a front view of an example of a conventional resin-sealed semiconductor device, taken along the line E-E' 6a to 6c are a front view, a sectional view taken along the line FF', and a rear view of the heat dissipation board in FIG. 5. 1... Semiconductor chip, 2A to 2C... Heat dissipation board, 2a... Heat dissipation piece, 2Ab to 2Cb... Chip mounting board, 2c... Front side of the board, 2d... Back side of the board,
4...Through hole, 5, 6...Recessed portion, 9...Resin part.
Claims (1)
正面に載置され前記放熱片の近傍に少なくとも一
つの貫通孔と背面に該貫通孔に連続しかつ面積が
前記貫通孔よりも大きい凹部を有するチツプ載置
基板との一体構造を有する放熱基板、 (B) 前記半導体チツプ及び前記チツプ載置基板
の正面を覆い、かつ前記貫通孔及び凹部を充填す
る樹脂部、 を含むことを特徴とする樹脂封止形半導体装置
。[Claims for Utility Model Registration] (A) A heat dissipating piece with both sides exposed, a semiconductor chip placed on the front side, at least one through hole in the vicinity of the heat dissipating piece, and a back side continuous with the through hole and having an area. (B) a heat dissipation board having an integral structure with a chip mounting board having a recess larger than the through hole; (B) a resin part covering the front surface of the semiconductor chip and the chip mounting board and filling the through hole and the recess; A resin-sealed semiconductor device comprising: .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5434687U JPS6426848U (en) | 1987-04-09 | 1987-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5434687U JPS6426848U (en) | 1987-04-09 | 1987-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6426848U true JPS6426848U (en) | 1989-02-15 |
Family
ID=31280281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5434687U Pending JPS6426848U (en) | 1987-04-09 | 1987-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6426848U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03293748A (en) * | 1990-04-11 | 1991-12-25 | Rohm Co Ltd | Semiconductor device |
| JPH03293749A (en) * | 1990-04-11 | 1991-12-25 | Rohm Co Ltd | Semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60242649A (en) * | 1985-03-29 | 1985-12-02 | Hitachi Ltd | Resin sealed semiconductor device |
-
1987
- 1987-04-09 JP JP5434687U patent/JPS6426848U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60242649A (en) * | 1985-03-29 | 1985-12-02 | Hitachi Ltd | Resin sealed semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03293748A (en) * | 1990-04-11 | 1991-12-25 | Rohm Co Ltd | Semiconductor device |
| JPH03293749A (en) * | 1990-04-11 | 1991-12-25 | Rohm Co Ltd | Semiconductor device |