JPS6346854U - - Google Patents
Info
- Publication number
- JPS6346854U JPS6346854U JP14101186U JP14101186U JPS6346854U JP S6346854 U JPS6346854 U JP S6346854U JP 14101186 U JP14101186 U JP 14101186U JP 14101186 U JP14101186 U JP 14101186U JP S6346854 U JPS6346854 U JP S6346854U
- Authority
- JP
- Japan
- Prior art keywords
- wall portion
- horizontal wall
- heat dissipating
- dissipating body
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005219 brazing Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
Description
第１図は第１実施例の本考案品を備えた半導体
冷却器の部分斜視図で、外壁板が省略されている
。第２図は同半導体冷却器の正面図、第３図は本
考案品のみの正面図、第４図は第２実施例の本考
案品のみの正面図、第５図は従来例を示す半導体
冷却器の部分側面図である。
１……ベース、２，７……放熱体、２ａ……下
部水平壁部、２ｂ……垂直壁部、２ｃ……中間水
平壁部、２ｄ……上部水平壁部、３……接合板、
４……ろう材収容凹部。
FIG. 1 is a partial perspective view of a semiconductor cooler equipped with a first embodiment of the present invention, with the outer wall plate omitted. Fig. 2 is a front view of the same semiconductor cooler, Fig. 3 is a front view of only the product of the present invention, Fig. 4 is a front view of only the product of the present invention of the second embodiment, and Fig. 5 is a front view of the conventional semiconductor cooler. FIG. 3 is a partial side view of the cooler. DESCRIPTION OF SYMBOLS 1... Base, 2, 7... Heat sink, 2a... Lower horizontal wall part, 2b... Vertical wall part, 2c... Intermediate horizontal wall part, 2d... Upper horizontal wall part, 3... Bonding plate,
4...Brazing material storage recess.
Claims (1)
べき水平壁部２ａと、水平壁部２ａに対して略直
角状に設けられた垂直壁部２ｂとを備えたアルミ
ニウム押出型材製放熱体において、水平壁部２ａ
の下面に、ろう付けのさいの溶融ろう材を収容す
るろう材収容凹部４が設けられている半導体冷却
器用放熱体。 In a heat dissipating body made of an extruded aluminum material, which includes a horizontal wall portion 2a to be brazed to the upper surface of the semiconductor mounting base 1, and a vertical wall portion 2b provided approximately at right angles to the horizontal wall portion 2a, the horizontal Wall part 2a
A heat dissipating body for a semiconductor cooler, which is provided with a brazing material storage recess 4 for containing a molten brazing material during brazing on the lower surface thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14101186U JPH0429570Y2 (en) | 1986-09-12 | 1986-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14101186U JPH0429570Y2 (en) | 1986-09-12 | 1986-09-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6346854U true JPS6346854U (en) | 1988-03-30 |
| JPH0429570Y2 JPH0429570Y2 (en) | 1992-07-17 |
Family
ID=31048403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14101186U Expired JPH0429570Y2 (en) | 1986-09-12 | 1986-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429570Y2 (en) |
-
1986
- 1986-09-12 JP JP14101186U patent/JPH0429570Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0429570Y2 (en) | 1992-07-17 |