JPH03120043U - - Google Patents

Info

Publication number
JPH03120043U
JPH03120043U JP2805390U JP2805390U JPH03120043U JP H03120043 U JPH03120043 U JP H03120043U JP 2805390 U JP2805390 U JP 2805390U JP 2805390 U JP2805390 U JP 2805390U JP H03120043 U JPH03120043 U JP H03120043U
Authority
JP
Japan
Prior art keywords
heat sink
integrated circuit
hybrid integrated
ceramic
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2805390U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2805390U priority Critical patent/JPH03120043U/ja
Publication of JPH03120043U publication Critical patent/JPH03120043U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,b,cはこの考案の一実施例を示す
混成集積回路の上面図、正面図および裏面図、第
2図は従来およびこの発明共通の混成集積回路を
放熱ブロツクに取付けた場合の平面図、第3図a
,b,cは従来の混成集積回路を示す上面図、正
面図および裏面図、第4図は従来の混成集積回路
の内部斜視図である。 1……放熱板、3……キヤツプ、4……リード
、5……放熱ブロツク、7……ねじを示す。なお
、図中、同一符号は同一、又は相当部分を示す。
Figures 1a, b, and c are top, front, and back views of a hybrid integrated circuit showing an embodiment of this invention, and Figure 2 shows a hybrid integrated circuit common to the conventional and the present invention when mounted on a heat dissipation block. Plan view of Figure 3a
, b, and c are top, front, and back views of a conventional hybrid integrated circuit, and FIG. 4 is an internal perspective view of the conventional hybrid integrated circuit. 1... Heat sink, 3... Cap, 4... Lead, 5... Heat sink block, 7... Screw. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 放熱板上にセラミツク等の基板を融着してなる
混成集積回路において、前記放熱板の裏面の一部
に凹状部を設けたことを特徴とする混成集積回路
1. A hybrid integrated circuit comprising a substrate made of ceramic or the like fused onto a heat sink, characterized in that a concave portion is provided in a part of the back surface of the heat sink.
JP2805390U 1990-03-19 1990-03-19 Pending JPH03120043U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2805390U JPH03120043U (en) 1990-03-19 1990-03-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2805390U JPH03120043U (en) 1990-03-19 1990-03-19

Publications (1)

Publication Number Publication Date
JPH03120043U true JPH03120043U (en) 1991-12-10

Family

ID=31530877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2805390U Pending JPH03120043U (en) 1990-03-19 1990-03-19

Country Status (1)

Country Link
JP (1) JPH03120043U (en)

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