JPH0468572U - - Google Patents
Info
- Publication number
- JPH0468572U JPH0468572U JP11150990U JP11150990U JPH0468572U JP H0468572 U JPH0468572 U JP H0468572U JP 11150990 U JP11150990 U JP 11150990U JP 11150990 U JP11150990 U JP 11150990U JP H0468572 U JPH0468572 U JP H0468572U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- solder layer
- laser diode
- laser
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000002470 thermal conductor Substances 0.000 claims 1
Description
第１図ａ，ｂは、本考案の実施例の斜視図なら
びに断面図、第２図ａ，ｂは本考案の他の実施例
の斜視図ならびに断面図、第３図ａ，ｂは従来の
ヒートシンクの斜視図ならびに断面図である。
１……レーザダイオード、２……ヒートシンク
、３……半田層、４……レーザ出射面、５……は
み出す半田、６……レーザ出射部。
Figures 1a and b are perspective views and sectional views of an embodiment of the present invention, Figures 2a and b are perspective views and sectional views of another embodiment of the invention, and Figures 3a and b are conventional views. FIG. 2 is a perspective view and a cross-sectional view of a heat sink. DESCRIPTION OF SYMBOLS 1... Laser diode, 2... Heat sink, 3... Solder layer, 4... Laser emission surface, 5... Protruding solder, 6... Laser emission part.
Claims (1)
いるレーザダイオード用ヒートシンクにおいて、
レーザ出射面側に該当する半田層を一定面積除去
したことを特徴とするレーザダイオード用ヒート
シンク。 In a heat sink for a laser diode, which has a solder layer on the surface of a base made of a good thermal conductor,
A heat sink for a laser diode, characterized in that a certain area of the solder layer corresponding to the laser emission surface side is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11150990U JPH0468572U (en) | 1990-10-24 | 1990-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11150990U JPH0468572U (en) | 1990-10-24 | 1990-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468572U true JPH0468572U (en) | 1992-06-17 |
Family
ID=31858972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11150990U Pending JPH0468572U (en) | 1990-10-24 | 1990-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468572U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010141017A (en) * | 2008-12-10 | 2010-06-24 | Sharp Corp | Light emitting element, chip, and method of manufacturing light emitting element |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5544735A (en) * | 1978-09-25 | 1980-03-29 | Mitsubishi Electric Corp | Semiconductor laser device |
| JPS5756984A (en) * | 1980-09-23 | 1982-04-05 | Mitsubishi Electric Corp | Assembling method for semiconductor light emitting device |
-
1990
- 1990-10-24 JP JP11150990U patent/JPH0468572U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5544735A (en) * | 1978-09-25 | 1980-03-29 | Mitsubishi Electric Corp | Semiconductor laser device |
| JPS5756984A (en) * | 1980-09-23 | 1982-04-05 | Mitsubishi Electric Corp | Assembling method for semiconductor light emitting device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010141017A (en) * | 2008-12-10 | 2010-06-24 | Sharp Corp | Light emitting element, chip, and method of manufacturing light emitting element |