JPS62185044U - - Google Patents
Info
- Publication number
- JPS62185044U JPS62185044U JP7319386U JP7319386U JPS62185044U JP S62185044 U JPS62185044 U JP S62185044U JP 7319386 U JP7319386 U JP 7319386U JP 7319386 U JP7319386 U JP 7319386U JP S62185044 U JPS62185044 U JP S62185044U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heating element
- printing head
- thermal printing
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000007651 thermal printing Methods 0.000 claims 2
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案の第１実施例を示す断面図、第
２図は本考案の第２実施例を示す側面図、第３図
は第２図の斜視図、第４図は本考案の第３実施例
を示す側面図、第５図は従来例の側面図である。
１……放熱板、２……コンパウンド層、２ａ…
…肉厚部、３……セラミツク基板、３ａ……凸部
、４……発熱体。
Fig. 1 is a sectional view showing the first embodiment of the invention, Fig. 2 is a side view showing the second embodiment of the invention, Fig. 3 is a perspective view of Fig. 2, and Fig. 4 is a cross-sectional view showing the second embodiment of the invention. A side view showing the third embodiment, and FIG. 5 is a side view of the conventional example. 1... Heat sink, 2... Compound layer, 2a...
... Thick part, 3... Ceramic substrate, 3a... Convex part, 4... Heat generating element.
Claims (1)
ウンド層を介して貼着してある熱印字ヘツドにお
いて、 上記発熱体の近傍で基板の裏面に凸部もしくは
コンパウンド層の肉厚部を形成したことを特徴と
する熱印字ヘツド。[Scope of Claim for Utility Model Registration] In a thermal printing head in which a substrate with a heating element is attached to the surface of a heat sink via a compound layer, a convex portion or a compound on the back side of the substrate in the vicinity of the heating element. A thermal printing head characterized by forming a thick layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986073193U JPH0721328Y2 (en) | 1986-05-14 | 1986-05-14 | Thermal print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986073193U JPH0721328Y2 (en) | 1986-05-14 | 1986-05-14 | Thermal print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62185044U true JPS62185044U (en) | 1987-11-25 |
| JPH0721328Y2 JPH0721328Y2 (en) | 1995-05-17 |
Family
ID=30917309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986073193U Expired - Lifetime JPH0721328Y2 (en) | 1986-05-14 | 1986-05-14 | Thermal print head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0721328Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63154237U (en) * | 1987-03-31 | 1988-10-11 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5863473A (en) * | 1981-10-13 | 1983-04-15 | Oki Electric Ind Co Ltd | Thermal head |
-
1986
- 1986-05-14 JP JP1986073193U patent/JPH0721328Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5863473A (en) * | 1981-10-13 | 1983-04-15 | Oki Electric Ind Co Ltd | Thermal head |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63154237U (en) * | 1987-03-31 | 1988-10-11 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0721328Y2 (en) | 1995-05-17 |