JPH0256637U - - Google Patents
Info
- Publication number
- JPH0256637U JPH0256637U JP13389088U JP13389088U JPH0256637U JP H0256637 U JPH0256637 U JP H0256637U JP 13389088 U JP13389088 U JP 13389088U JP 13389088 U JP13389088 U JP 13389088U JP H0256637 U JPH0256637 U JP H0256637U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- thermal head
- insulating substrate
- thinner
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図ａ
は製作途中の補助放熱板の反りの測定図、第２図
ｂは製作後のサーマルヘツド表面の反りの測定図
、第３図は第一の従来例の斜視図、第４図は熱に
よる変形の説明図、第５図は第二の従来例の斜視
図である。
２……発熱抵抗体、３，４……絶縁基板、５…
…放熱板、８……サーマルヘツド、９……補助放
熱板。
Figure 1 is a perspective view of one embodiment of the present invention, Figure 2 a
Figure 2b is a measurement diagram of the warpage of the auxiliary heat sink during manufacture, Figure 2b is a measurement diagram of the warpage of the thermal head surface after manufacture, Figure 3 is a perspective view of the first conventional example, and Figure 4 is deformation due to heat. FIG. 5 is a perspective view of the second conventional example. 2... Heat generating resistor, 3, 4... Insulating substrate, 5...
...heat sink, 8...thermal head, 9...auxiliary heat sink.
Claims (1)
発熱抵抗体層を形成したサーマルヘツドにおいて
、前記絶縁基板と前記放熱板との間に銅又はニツ
ケルから形成され前記放熱板より薄い補助放熱板
を接着したことを特徴とするサーマルヘツド。 In a thermal head in which a heating resistor layer is formed on the surface of an insulating substrate with a heat sink attached to the back side, an auxiliary heat sink made of copper or nickel and thinner than the heat sink is provided between the insulating substrate and the heat sink. A thermal head characterized by being bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13389088U JPH0256637U (en) | 1988-10-13 | 1988-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13389088U JPH0256637U (en) | 1988-10-13 | 1988-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256637U true JPH0256637U (en) | 1990-04-24 |
Family
ID=31392169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13389088U Pending JPH0256637U (en) | 1988-10-13 | 1988-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256637U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002166585A (en) * | 2000-11-30 | 2002-06-11 | Shinko Electric Co Ltd | Thermal head |
-
1988
- 1988-10-13 JP JP13389088U patent/JPH0256637U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002166585A (en) * | 2000-11-30 | 2002-06-11 | Shinko Electric Co Ltd | Thermal head |