JPH02111538U - - Google Patents
Info
- Publication number
- JPH02111538U JPH02111538U JP1848889U JP1848889U JPH02111538U JP H02111538 U JPH02111538 U JP H02111538U JP 1848889 U JP1848889 U JP 1848889U JP 1848889 U JP1848889 U JP 1848889U JP H02111538 U JPH02111538 U JP H02111538U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- substrate
- thermal head
- metal layer
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案に係るサーマルヘツドの放熱構
造の実施例を示す要部の断面図、第２図は従来の
サーマルヘツドの放熱構造を示す要部の断面図、
第３図は一般的な熱転写プリンタを示す要部の斜
視図、第４図は第３図のサーマルヘツド近傍の拡
大斜視図、第５図は第３図の側面図である。
６……サーマルヘツド、６Ａ……発熱要素、６
Ｂ……基板、６Ｃ……グレーズ層、１３……ヘツ
ド取付台、１８……接着剤、１９……ニツケル層
、２０……はんだ。
FIG. 1 is a cross-sectional view of the main parts showing an embodiment of the heat dissipation structure of a thermal head according to the present invention, and FIG. 2 is a cross-sectional view of the main parts showing the heat dissipation structure of a conventional thermal head.
3 is a perspective view of the main parts of a general thermal transfer printer, FIG. 4 is an enlarged perspective view of the vicinity of the thermal head shown in FIG. 3, and FIG. 5 is a side view of FIG. 3. 6...Thermal head, 6A...Heating element, 6
B...Substrate, 6C...Glaze layer, 13...Head mounting base, 18...Adhesive, 19...Nickel layer, 20...Solder.
Claims (1)
放熱構造において、前記基板の表面にはんだ付け
可能な金属層を形成し、この金属層を介して前記
放熱板を前記基板にはんだ付けにより取付けたこ
とを特徴とするサーマルヘツドの放熱構造。 In the heat dissipation structure of a thermal head in which a heat dissipation plate is attached to a substrate, a solderable metal layer is formed on the surface of the substrate, and the heat dissipation plate is attached to the substrate by soldering via this metal layer. Features a thermal head heat dissipation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1848889U JPH02111538U (en) | 1989-02-20 | 1989-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1848889U JPH02111538U (en) | 1989-02-20 | 1989-02-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02111538U true JPH02111538U (en) | 1990-09-06 |
Family
ID=31233183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1848889U Pending JPH02111538U (en) | 1989-02-20 | 1989-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02111538U (en) |
-
1989
- 1989-02-20 JP JP1848889U patent/JPH02111538U/ja active Pending
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