JPS61192843U - - Google Patents
Info
- Publication number
- JPS61192843U JPS61192843U JP7864685U JP7864685U JPS61192843U JP S61192843 U JPS61192843 U JP S61192843U JP 7864685 U JP7864685 U JP 7864685U JP 7864685 U JP7864685 U JP 7864685U JP S61192843 U JPS61192843 U JP S61192843U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- conductive layer
- heat
- dissipation plate
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000007651 thermal printing Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000011159 matrix material Substances 0.000 claims 1
Landscapes
- Electronic Switches (AREA)
Description
第１図および第２図は本考案の実施例を示し、
第１図はこの実施例の分解斜視図、第２図はその
中央縦断側面図、第３図は本考案が解決しようと
する問題点を説明するための熱印字ヘツドの縦断
面図である。
１…絶縁基板、２…発熱体、７…放熱板、８…
接着剤層、９…熱伝導層、９ａ…分割部分、ｃ…
間隙。
1 and 2 show an embodiment of the present invention,
FIG. 1 is an exploded perspective view of this embodiment, FIG. 2 is a central longitudinal sectional side view thereof, and FIG. 3 is a longitudinal sectional view of the thermal printing head for explaining the problem to be solved by the present invention. 1... Insulating substrate, 2... Heating element, 7... Heat sink, 8...
Adhesive layer, 9... Heat conductive layer, 9a... Divided portion, c...
gap.
Claims (1)
この絶縁基板の下面に接合される放熱板とを備え
、この放熱板と前記絶縁基板との接合面間の中央
部に接着剤層を介在させ、かつ、該接着剤層の周
囲に熱伝導層を形成すると共に、前記熱伝導層を
複数の分割部分からなるパターン状に構成し、各
分割部分間に間隙を設けたことを特徴とする熱印
字ヘツド。 (2) 前記熱伝導層の各分割部分がそれぞれ矩形
状に形成され、かつ、前記放熱板の接合面上にマ
トリクス状に配置されている前記実用新案登録請
求の範囲第１項に記載の熱印字ヘツド。[Scope of claims for utility model registration] (1) An insulating substrate on which a heating element is formed on the upper surface side;
a heat dissipation plate bonded to the lower surface of the insulating substrate, an adhesive layer is interposed in the center between the bonding surfaces of the heat dissipation plate and the insulating substrate, and a heat conductive layer is provided around the adhesive layer. 1. A thermal printing head characterized in that the thermally conductive layer is formed into a pattern consisting of a plurality of divided parts, and a gap is provided between each divided part. (2) The heat sink according to claim 1, wherein each divided portion of the heat conductive layer is formed into a rectangular shape and arranged in a matrix on the bonding surface of the heat sink. Print head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7864685U JPS61192843U (en) | 1985-05-27 | 1985-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7864685U JPS61192843U (en) | 1985-05-27 | 1985-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61192843U true JPS61192843U (en) | 1986-12-01 |
Family
ID=30622811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7864685U Pending JPS61192843U (en) | 1985-05-27 | 1985-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61192843U (en) |
-
1985
- 1985-05-27 JP JP7864685U patent/JPS61192843U/ja active Pending
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