JPH01127842U - - Google Patents
Info
- Publication number
- JPH01127842U JPH01127842U JP2417488U JP2417488U JPH01127842U JP H01127842 U JPH01127842 U JP H01127842U JP 2417488 U JP2417488 U JP 2417488U JP 2417488 U JP2417488 U JP 2417488U JP H01127842 U JPH01127842 U JP H01127842U
- Authority
- JP
- Japan
- Prior art keywords
- head
- heat sink
- attached
- board
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案の一実施例を示すサーマルプリ
ントヘツドの概略平面図、第２図および第３図は
従来のヘツド貼着構造を示す断面図である。
２０…ヘツド基板、２１，２２…駆動基板、２
３…放熱板、２４，２５，２６…接着部。
FIG. 1 is a schematic plan view of a thermal print head showing an embodiment of the present invention, and FIGS. 2 and 3 are sectional views showing a conventional head adhesion structure. 20... Head board, 21, 22... Drive board, 2
3... Heat sink, 24, 25, 26... Adhesive part.
Claims (1)
媒体部を駆動制御する制御回路が配設された駆動
基板とを対接させ、接着剤を介して放熱板に支持
し、前記駆動基板を前記ヘツド基板より膨張係数
の大きい材質で構成してなるプリントヘツドにお
いて、 前記ヘツド基板をその裏面中央部で貼着すると
ともに、前記駆動基板は前記放熱板の長手方向に
近接配列した複数の分割基板とし、両端部に位置
する分割基板は少なくとも前記放熱板の中央側に
非貼着部を設けて貼着したことを特徴とするプリ
ントヘツド。[Claims for Utility Model Registration] A head substrate on which a print medium portion is formed and a drive substrate on which a control circuit for driving and controlling the print medium portion is disposed are brought into contact with each other and supported on a heat sink via an adhesive. In the print head in which the drive board is made of a material having a larger coefficient of expansion than the head board, the head board is attached at the center of the back surface thereof, and the drive board is adjacent to the heat sink in the longitudinal direction. 1. A print head comprising a plurality of divided substrates arranged in an array, and the divided substrates located at both ends are attached with a non-attached portion provided at least in the center of the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2417488U JPH0711982Y2 (en) | 1988-02-25 | 1988-02-25 | Print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2417488U JPH0711982Y2 (en) | 1988-02-25 | 1988-02-25 | Print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01127842U true JPH01127842U (en) | 1989-08-31 |
| JPH0711982Y2 JPH0711982Y2 (en) | 1995-03-22 |
Family
ID=31243798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2417488U Expired - Lifetime JPH0711982Y2 (en) | 1988-02-25 | 1988-02-25 | Print head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0711982Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012066496A (en) * | 2010-09-24 | 2012-04-05 | Toshiba Hokuto Electronics Corp | Thermal print head |
-
1988
- 1988-02-25 JP JP2417488U patent/JPH0711982Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012066496A (en) * | 2010-09-24 | 2012-04-05 | Toshiba Hokuto Electronics Corp | Thermal print head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0711982Y2 (en) | 1995-03-22 |