JPS63100234U - - Google Patents
Info
- Publication number
- JPS63100234U JPS63100234U JP19363686U JP19363686U JPS63100234U JP S63100234 U JPS63100234 U JP S63100234U JP 19363686 U JP19363686 U JP 19363686U JP 19363686 U JP19363686 U JP 19363686U JP S63100234 U JPS63100234 U JP S63100234U
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- substrate
- film material
- thick film
- thermal recording
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図Ａは本考案のサーマルヘツドの一実施例
を示す要部平面図であり、第１図Ｂは第１図中
―線における概略的な断面図である。第２図は
本考案の他の実施例を示す要部断面図である。第
３図は従来のサーマルヘツドを示す要部断面図で
ある。
１……基板、１ａ……一主面、１ｂ……裏面、
２……発熱抵抗体、３……共通電極、４……個別
電極、５……接着剤層、６……支持放熱板、１１
……感熱記録紙。
FIG. 1A is a plan view of essential parts showing an embodiment of the thermal head of the present invention, and FIG. 1B is a schematic cross-sectional view taken along the line ``--'' in FIG. FIG. 2 is a sectional view of a main part showing another embodiment of the present invention. FIG. 3 is a sectional view of a main part of a conventional thermal head. 1...Substrate, 1a...One main surface, 1b...Back surface,
2...Heating resistor, 3...Common electrode, 4...Individual electrode, 5...Adhesive layer, 6...Support heat sink, 11
...Thermal recording paper.
Claims (1)
体と厚膜材料よりなる回路部とが形成された基板
を前記一主面側で支持放熱板に接合一体化してな
り、 前記基板を耐摩耗層とし、かつ前記一主面とは
反対側の面で感熱記録紙に対して感熱記録を行う
ことを特徴とするサーマルヘツド。[Claims for Utility Model Registration] A substrate having at least a heating resistor made of a thick film material and a circuit part made of a thick film material formed on one main surface is integrally bonded to a supporting heat sink on the one main surface side. A thermal head, wherein the substrate is a wear-resistant layer, and thermal recording is performed on a thermal recording paper on a surface opposite to the one main surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19363686U JPS63100234U (en) | 1986-12-18 | 1986-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19363686U JPS63100234U (en) | 1986-12-18 | 1986-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63100234U true JPS63100234U (en) | 1988-06-29 |
Family
ID=31149841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19363686U Pending JPS63100234U (en) | 1986-12-18 | 1986-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63100234U (en) |
-
1986
- 1986-12-18 JP JP19363686U patent/JPS63100234U/ja active Pending