JPS61140843U - - Google Patents
Info
- Publication number
- JPS61140843U JPS61140843U JP2421085U JP2421085U JPS61140843U JP S61140843 U JPS61140843 U JP S61140843U JP 2421085 U JP2421085 U JP 2421085U JP 2421085 U JP2421085 U JP 2421085U JP S61140843 U JPS61140843 U JP S61140843U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- head substrate
- head
- thermal print
- print head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 1
Landscapes
- Electronic Switches (AREA)
Description
第１図はこの考案の実施例を示す平面図、第２
図は同断面図、第３図は他の例を示す断面図、第
４図は従来例の平面図である。
１……ヘツド基板、２……発熱素子、３……放
熱板、４……接着剤、６……コンパウンド。
Figure 1 is a plan view showing an embodiment of this invention, Figure 2 is a plan view showing an embodiment of this invention.
The figure is a sectional view of the same, FIG. 3 is a sectional view showing another example, and FIG. 4 is a plan view of the conventional example. 1... Head board, 2... Heat generating element, 3... Heat sink, 4... Adhesive, 6... Compound.
Claims (1)
ド基板を放熱板に支持してなるサーマルプリント
ヘツドにおいて、前記ヘツド基板を前記放熱板に
、部分的に塗布した接着剤で接着するとともに、
前記ヘツド基板と放熱板との接触面に熱伝導性の
コンパウンドを塗布してなるサーマルプリントヘ
ツド。 In a thermal print head in which a head substrate having a heating element for printing on the surface is supported on a heat sink, the head substrate is adhered to the heat sink with an adhesive partially applied, and
A thermal print head comprising a thermally conductive compound applied to the contact surface between the head substrate and the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985024210U JPH0611794Y2 (en) | 1985-02-21 | 1985-02-21 | Thermal print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985024210U JPH0611794Y2 (en) | 1985-02-21 | 1985-02-21 | Thermal print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61140843U true JPS61140843U (en) | 1986-09-01 |
| JPH0611794Y2 JPH0611794Y2 (en) | 1994-03-30 |
Family
ID=30518153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985024210U Expired - Lifetime JPH0611794Y2 (en) | 1985-02-21 | 1985-02-21 | Thermal print head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611794Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56133464U (en) * | 1980-03-11 | 1981-10-09 | ||
| JPS5938052U (en) * | 1982-08-31 | 1984-03-10 | ロ−ム株式会社 | Thermal print head heat sink |
| JPS60194533U (en) * | 1984-06-01 | 1985-12-25 | 株式会社リコー | thermal head |
-
1985
- 1985-02-21 JP JP1985024210U patent/JPH0611794Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56133464U (en) * | 1980-03-11 | 1981-10-09 | ||
| JPS5938052U (en) * | 1982-08-31 | 1984-03-10 | ロ−ム株式会社 | Thermal print head heat sink |
| JPS60194533U (en) * | 1984-06-01 | 1985-12-25 | 株式会社リコー | thermal head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0611794Y2 (en) | 1994-03-30 |
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