JPH01131538U - - Google Patents
Info
- Publication number
- JPH01131538U JPH01131538U JP2940288U JP2940288U JPH01131538U JP H01131538 U JPH01131538 U JP H01131538U JP 2940288 U JP2940288 U JP 2940288U JP 2940288 U JP2940288 U JP 2940288U JP H01131538 U JPH01131538 U JP H01131538U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- groove
- heat sink
- print head
- adhered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は、この考案の一実施例を示すサーマル
プリントヘツドの分解斜視図、第２図は、同サー
マルプリントヘツドの断面図、第３図及び第４図
は、従来のサーマルプリントヘツドを示す分解斜
視図である。
１：放熱板、２：セラミツク基板、３：接着剤
、４：凹溝。
Fig. 1 is an exploded perspective view of a thermal print head showing an embodiment of this invention, Fig. 2 is a sectional view of the same thermal print head, and Figs. 3 and 4 show a conventional thermal print head. It is an exploded perspective view. 1: heat sink, 2: ceramic substrate, 3: adhesive, 4: groove.
Claims (1)
溝に接着剤を充填し、この接着剤で前記放熱板と
発熱抵抗体を形成した絶縁性基板が貼着されてな
ることを特徴とするプリントヘツド。 A groove is provided in the longitudinal direction of the upper surface of the heat sink, this groove is filled with an adhesive, and the heat sink and an insulating substrate on which the heat generating resistor is formed are adhered with the adhesive. print head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2940288U JPH01131538U (en) | 1988-03-04 | 1988-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2940288U JPH01131538U (en) | 1988-03-04 | 1988-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01131538U true JPH01131538U (en) | 1989-09-06 |
Family
ID=31253584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2940288U Pending JPH01131538U (en) | 1988-03-04 | 1988-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01131538U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1582360A2 (en) | 2004-03-30 | 2005-10-05 | Alps Electric Co., Ltd. | Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same |
| JP2012066400A (en) * | 2010-09-21 | 2012-04-05 | Toshiba Hokuto Electronics Corp | Thermal print head |
| WO2023223806A1 (en) * | 2022-05-17 | 2023-11-23 | ローム株式会社 | Thermal printhead |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5863473A (en) * | 1981-10-13 | 1983-04-15 | Oki Electric Ind Co Ltd | Thermal head |
-
1988
- 1988-03-04 JP JP2940288U patent/JPH01131538U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5863473A (en) * | 1981-10-13 | 1983-04-15 | Oki Electric Ind Co Ltd | Thermal head |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1582360A2 (en) | 2004-03-30 | 2005-10-05 | Alps Electric Co., Ltd. | Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same |
| JP2012066400A (en) * | 2010-09-21 | 2012-04-05 | Toshiba Hokuto Electronics Corp | Thermal print head |
| WO2023223806A1 (en) * | 2022-05-17 | 2023-11-23 | ローム株式会社 | Thermal printhead |