JPH0339551U - - Google Patents
Info
- Publication number
- JPH0339551U JPH0339551U JP10072289U JP10072289U JPH0339551U JP H0339551 U JPH0339551 U JP H0339551U JP 10072289 U JP10072289 U JP 10072289U JP 10072289 U JP10072289 U JP 10072289U JP H0339551 U JPH0339551 U JP H0339551U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- resin layer
- substrate
- insulating resin
- heat resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は一実施例の発熱基板を示す平面図、第
２図は第１図のＡ−Ａ′線位置での断面図、第３
図は大判基板にポリイミド層が形成された状態を
示す平面図、第４図は第３図のＢ−Ｂ′線位置で
の断面図、第５図は大判基板にサーマルヘツドが
形成された状態を示す部分断面図である。
２……金属基板、４……ポリイミド層、６……
ＳｉＯ２膜、８……抵抗体膜、８ａ……発熱抵抗
体素子、１０……選択電極、１２……共通電極、
１２ａ……共通電極の基板との導通部分、１６…
…ダイシングライン。
FIG. 1 is a plan view showing a heat generating board of one embodiment, FIG. 2 is a sectional view taken along the line A-A' in FIG. 1, and FIG.
The figure is a plan view showing a state in which a polyimide layer is formed on a large-sized substrate, Fig. 4 is a cross-sectional view taken along the line B-B' in Fig. 3, and Fig. 5 is a state in which a thermal head is formed on a large-sized substrate. FIG. 2...Metal substrate, 4...Polyimide layer, 6...
SiO 2 film, 8... Resistor film, 8a... Heat generating resistor element, 10... Selection electrode, 12... Common electrode,
12a... Conductive portion of the common electrode with the substrate, 16...
...Dicing line.
Claims (1)
上に発熱抵抗体素子を有する発熱基板を備えたサ
ーマルヘツドにおいて、前記金属基板上の耐熱性
絶縁樹脂層の一部が除かれており、その除去部で
発熱抵抗体素子の共通電極が金属基板と導通し、
金属基板が共通電極を兼ねていることを特徴とす
るサーマルヘツド。 In a thermal head equipped with a heat generating substrate having a heating resistor element on a substrate formed with a heat resistant insulating resin layer on a metal substrate, a part of the heat resistant insulating resin layer on the metal substrate is removed, and the heat resistant insulating resin layer on the metal substrate is partially removed. The common electrode of the heating resistor element is electrically connected to the metal substrate in the removed part.
A thermal head characterized by a metal substrate that also serves as a common electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10072289U JPH0339551U (en) | 1989-08-28 | 1989-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10072289U JPH0339551U (en) | 1989-08-28 | 1989-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0339551U true JPH0339551U (en) | 1991-04-16 |
Family
ID=31649710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10072289U Pending JPH0339551U (en) | 1989-08-28 | 1989-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339551U (en) |
-
1989
- 1989-08-28 JP JP10072289U patent/JPH0339551U/ja active Pending