JPH0180356U - - Google Patents
Info
- Publication number
- JPH0180356U JPH0180356U JP1987175153U JP17515387U JPH0180356U JP H0180356 U JPH0180356 U JP H0180356U JP 1987175153 U JP1987175153 U JP 1987175153U JP 17515387 U JP17515387 U JP 17515387U JP H0180356 U JPH0180356 U JP H0180356U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resistor
- film
- thermal head
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図ａは本考案の一実施例を示すヘツドの上
面図、同ｂ，ｃはその断面図、第２図は、第３図
は他の実施例を示す断面図、第４図ａは従来のヘ
ツドの上面図、同ｂは同断面図である。
１：セラミツク基板、１Ａ：導体基板、１Ｂ：
ガラエポ基板、１ａ〜１ｄ：導体膜、２：抵抗体
（発熱体）、３ａ：個別電極、３ｂ：共通電極、
３ｃ：補強用のメツキ層、４：保護膜、５ａ，５
ｂ：絶縁膜、６：コンタクト、７：スリツト、８
：スルホール。
Fig. 1a is a top view of a head showing one embodiment of the present invention, b and c are sectional views thereof, Fig. 2 and 3 are sectional views showing another embodiment, and Fig. 4a is a sectional view of the head. A top view of a conventional head, and part (b) is a sectional view of the same. 1: Ceramic substrate, 1A: Conductor substrate, 1B:
Glass epoxy substrate, 1a to 1d: conductor film, 2: resistor (heating element), 3a: individual electrode, 3b: common electrode,
3c: Plating layer for reinforcement, 4: Protective film, 5a, 5
b: Insulating film, 6: Contact, 7: Slit, 8
: Thruhole.
Claims (1)
させ、感熱紙を発色させる如く構成されるサーマ
ルヘツドに用いられる基板において、前記抵抗体
に通電するための共通電極を少なくとも二層化し
、絶縁層を介して前記抵抗体の下層に配置したこ
とを特徴とする、サーマルヘツド用基板。 (2) 前記基板の本体が絶縁体で構成されており
、該基板表面に第一の導体膜、第一の絶縁膜、第
二の導体膜、第二の絶縁膜を形成し、前記第一、
第二の導体膜を、前記抵抗体の下層に配置した共
通電極とすることを特徴とする、実用新案登録請
求の範囲第１項記載のサーマルヘツド用基板。 (3) 前記基板の本体が導体で構成されており、
該基板表面に第一の絶縁膜、導体膜、第二の絶縁
膜を形成し、前記基板本体を構成する導体と前記
導体膜とを、前記抵抗体の下層に配置した共通電
極とすることを特徴とする、実用新案登録請求の
範囲第１項記載のサーマルヘツド用基板。[Claims for Utility Model Registration] (1) In a substrate used in a thermal head configured to generate heat by energizing a resistor formed on the substrate to color thermal paper, for energizing the resistor. 1. A substrate for a thermal head, characterized in that the common electrode is formed into at least two layers, and is arranged under the resistor with an insulating layer interposed therebetween. (2) The main body of the substrate is made of an insulator, and a first conductive film, a first insulating film, a second conductive film, and a second insulating film are formed on the surface of the substrate, and ,
2. The thermal head substrate according to claim 1, wherein the second conductive film is a common electrode disposed below the resistor. (3) the main body of the board is made of a conductor;
A first insulating film, a conductor film, and a second insulating film are formed on the surface of the substrate, and the conductor constituting the substrate body and the conductor film form a common electrode disposed below the resistor. A substrate for a thermal head according to claim 1 of the registered utility model.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987175153U JPH0180356U (en) | 1987-11-17 | 1987-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987175153U JPH0180356U (en) | 1987-11-17 | 1987-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180356U true JPH0180356U (en) | 1989-05-30 |
Family
ID=31466965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987175153U Pending JPH0180356U (en) | 1987-11-17 | 1987-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180356U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0232867A (en) * | 1988-07-22 | 1990-02-02 | Nhk Spring Co Ltd | Electrode structure for thermal head |
-
1987
- 1987-11-17 JP JP1987175153U patent/JPH0180356U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0232867A (en) * | 1988-07-22 | 1990-02-02 | Nhk Spring Co Ltd | Electrode structure for thermal head |