JPH0355239U - - Google Patents
Info
- Publication number
- JPH0355239U JPH0355239U JP11649989U JP11649989U JPH0355239U JP H0355239 U JPH0355239 U JP H0355239U JP 11649989 U JP11649989 U JP 11649989U JP 11649989 U JP11649989 U JP 11649989U JP H0355239 U JPH0355239 U JP H0355239U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- common electrode
- conductor
- substrate
- transfer printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000010023 transfer printing Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は一実施例を表わす図であり、ＡはＢの
−線位置での断面図、Ｂは保護膜の図示を省
略した平面図である。第２図は熱転写印字装置を
示す正面断面図、第３図は熱転写印字装置の要部
を示す正面断面図、第４図はサーマルプリントヘ
ツドの発熱体と電極を示す略線図、第５図は熱転
写印字装置の転写動作を示す概略断面図である。
２０……基板、２２……セラミツク基板、２４
……導電体膜、２４ａ……共通電極と接続される
導電体膜部分、２６……グレーズ層、２８……抵
抗体、２８ａ……発熱体、３０……選択電極、３
２……共通電極、３４……保護膜。
FIG. 1 is a diagram showing one embodiment, in which A is a cross-sectional view of B at the - line position, and B is a plan view in which illustration of a protective film is omitted. Fig. 2 is a front sectional view showing the thermal transfer printing device, Fig. 3 is a front sectional view showing the main parts of the thermal transfer printing device, Fig. 4 is a schematic diagram showing the heating element and electrodes of the thermal print head, and Fig. 5 FIG. 2 is a schematic cross-sectional view showing the transfer operation of the thermal transfer printing device. 20...Substrate, 22...Ceramic substrate, 24
...Conductor film, 24a...Conductor film portion connected to the common electrode, 26...Glaze layer, 28...Resistor, 28a...Heating element, 30...Selection electrode, 3
2... Common electrode, 34... Protective film.
Claims (1)
が配列される側の端部を除いて絶縁層が形成され
、この絶縁層上に発熱体、選択電極及び共通電極
が形成され、共通電極は前基端部の絶縁層が除か
れた部分で基板の導体と接続されている熱転写印
字用サーマルプリントヘツド。 An insulating layer is formed on the substrate whose surface is at least a conductor, except for the end on the side where the heating elements are arranged, and the heating element, the selection electrode, and the common electrode are formed on this insulating layer, and the common electrode is on the front side. A thermal print head for thermal transfer printing that is connected to the conductor of the substrate at the base end where the insulating layer is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11649989U JPH0355239U (en) | 1989-10-02 | 1989-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11649989U JPH0355239U (en) | 1989-10-02 | 1989-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0355239U true JPH0355239U (en) | 1991-05-28 |
Family
ID=31664772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11649989U Pending JPH0355239U (en) | 1989-10-02 | 1989-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0355239U (en) |
-
1989
- 1989-10-02 JP JP11649989U patent/JPH0355239U/ja active Pending