JPH0222838U - - Google Patents
Info
- Publication number
- JPH0222838U JPH0222838U JP10136788U JP10136788U JPH0222838U JP H0222838 U JPH0222838 U JP H0222838U JP 10136788 U JP10136788 U JP 10136788U JP 10136788 U JP10136788 U JP 10136788U JP H0222838 U JPH0222838 U JP H0222838U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- insulating layer
- end side
- electrodes
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は一実施例を示す平面図、第２図は第１
図のＡ―Ａ線位置での断面図、第３図は他の実施
例を示す平面図、第４図は第３図のＢ―Ｂ線位置
での断面図、第５図はさらに他の実施例を示す断
面図である。第６図は検討中の端面型サーマルヘ
ツドを示す平面図、第７図は第６図のＣ―Ｃ線位
置での断面図である。
１０……セラミツク基板、１１……印字面、１
２……グレーズ層、１４……共通電極、１６……
絶縁層、２０，２０ａ……発熱部、２２……個別
電極、３０……導体基板。
FIG. 1 is a plan view showing one embodiment, and FIG. 2 is a plan view showing one embodiment.
3 is a plan view showing another embodiment, FIG. 4 is a sectional view taken along line BB in FIG. 3, and FIG. 5 is a plan view showing another embodiment. It is a sectional view showing an example. FIG. 6 is a plan view showing the end-face type thermal head under consideration, and FIG. 7 is a sectional view taken along line CC in FIG. 10... Ceramic substrate, 11... Printing surface, 1
2... Glaze layer, 14... Common electrode, 16...
Insulating layer, 20, 20a... Heat generating part, 22... Individual electrode, 30... Conductor substrate.
Claims (1)
に異なる層に絶縁層により絶縁されて形成されて
おり、前記絶縁層は基板の一端部側で除去されて
、その一端部側には両電極に接続される発熱体が
設けられており、被記録体が基板の前記一端部側
の端面に沿つて摺動して印字が行なわれる端面型
サーマルヘツド。 A common electrode and individual electrodes are formed on different layers on one main surface of the substrate and insulated by an insulating layer, and the insulating layer is removed at one end of the substrate, and both electrodes are formed on the one end side. An edge type thermal head is provided with a heating element connected to the substrate, and printing is performed by sliding the recording medium along the end surface on the one end side of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10136788U JPH0222838U (en) | 1988-07-30 | 1988-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10136788U JPH0222838U (en) | 1988-07-30 | 1988-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0222838U true JPH0222838U (en) | 1990-02-15 |
Family
ID=31330294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10136788U Pending JPH0222838U (en) | 1988-07-30 | 1988-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0222838U (en) |
-
1988
- 1988-07-30 JP JP10136788U patent/JPH0222838U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61107542U (en) | ||
| JPH0222838U (en) | ||
| JPH0217341U (en) | ||
| JPH0180356U (en) | ||
| JPS62175929U (en) | ||
| JPH0285150U (en) | ||
| JPH04551U (en) | ||
| JPS61122844U (en) | ||
| JPH0339549U (en) | ||
| JPH02150250U (en) | ||
| JPS5848448U (en) | thermal head | |
| JPS61125452U (en) | ||
| JPS58110443U (en) | Heating element structure of thermal recording head | |
| JPH01166535U (en) | ||
| JPH0210948U (en) | ||
| JPS62175930U (en) | ||
| JPH01110928U (en) | ||
| JPS6219252U (en) | ||
| JPH0282537U (en) | ||
| JPH01110929U (en) | ||
| JPH0185040U (en) | ||
| JPH04553U (en) | ||
| JPH0180355U (en) | ||
| JPH0286740U (en) | ||
| JPH0219547U (en) |