JPS63139941U - - Google Patents
Info
- Publication number
- JPS63139941U JPS63139941U JP1987033015U JP3301587U JPS63139941U JP S63139941 U JPS63139941 U JP S63139941U JP 1987033015 U JP1987033015 U JP 1987033015U JP 3301587 U JP3301587 U JP 3301587U JP S63139941 U JPS63139941 U JP S63139941U
- Authority
- JP
- Japan
- Prior art keywords
- common electrode
- substrate
- electronic device
- functional elements
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第1図は一実施例を示す斜視図、第2図は第1
図のB―B線位置での断面図、第3図は保護膜を
形成する方法を示す概略側面図、第4図は従来の
サーマルヘツドを示す斜視図、第5図は第4図の
A―A線位置での断面図、第6図は他の従来のサ
ーマルヘツドを示す断面図である。
2……耐熱基板、4……発熱抵抗体素子、6…
…共通電極、10……保護膜。
FIG. 1 is a perspective view showing one embodiment, and FIG. 2 is a perspective view showing one embodiment.
3 is a schematic side view showing a method of forming a protective film, FIG. 4 is a perspective view showing a conventional thermal head, and FIG. 5 is an A of FIG. 4. -A cross-sectional view at line A. FIG. 6 is a cross-sectional view showing another conventional thermal head. 2...Heat-resistant substrate, 4...Heating resistor element, 6...
...Common electrode, 10...Protective film.
Claims (1)
置されて形成されており、その機能素子配列と基
板の一辺との間に共通電極が形成されている電子
装置において、前記機能素子を被う保護膜が前記
共通電極も被い、さらにその共通電極が形成され
ている側の基板辺の端面も被つていることを特徴
とする電子装置。 In an electronic device in which functional elements are arranged in a row along one side on a substrate surface, and a common electrode is formed between the functional element array and one side of the substrate, the functional elements are covered. An electronic device characterized in that the protective film covers the common electrode and further covers an end surface of a side of the substrate on which the common electrode is formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987033015U JPS63139941U (en) | 1987-03-05 | 1987-03-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987033015U JPS63139941U (en) | 1987-03-05 | 1987-03-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63139941U true JPS63139941U (en) | 1988-09-14 |
Family
ID=30840230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987033015U Pending JPS63139941U (en) | 1987-03-05 | 1987-03-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63139941U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6164463A (en) * | 1984-09-06 | 1986-04-02 | Matsushita Electric Ind Co Ltd | Preparation of thermal head |
JPS63126766A (en) * | 1986-11-17 | 1988-05-30 | Seiko Epson Corp | Thermal printing head |
-
1987
- 1987-03-05 JP JP1987033015U patent/JPS63139941U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6164463A (en) * | 1984-09-06 | 1986-04-02 | Matsushita Electric Ind Co Ltd | Preparation of thermal head |
JPS63126766A (en) * | 1986-11-17 | 1988-05-30 | Seiko Epson Corp | Thermal printing head |