JPH0232867A - Electrode structure for thermal head - Google Patents
Electrode structure for thermal headInfo
- Publication number
- JPH0232867A JPH0232867A JP18319988A JP18319988A JPH0232867A JP H0232867 A JPH0232867 A JP H0232867A JP 18319988 A JP18319988 A JP 18319988A JP 18319988 A JP18319988 A JP 18319988A JP H0232867 A JPH0232867 A JP H0232867A
- Authority
- JP
- Japan
- Prior art keywords
- common electrode
- heating element
- resistance heating
- thermal head
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 claims abstract description 12
- 238000007772 electroless plating Methods 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 28
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052804 chromium Inorganic materials 0.000 abstract description 2
- 239000011651 chromium Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 abstract 2
- 241000136406 Comones Species 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 46
- 239000000919 ceramic Substances 0.000 description 16
- 239000011521 glass Substances 0.000 description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- ORQWZDMGFYSKGA-UHFFFAOYSA-N dioxosilane tantalum Chemical compound [Si](=O)=O.[Ta] ORQWZDMGFYSKGA-UHFFFAOYSA-N 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［発明の目的］
〈産業上の利用分野〉
本発明は、基板上の或る方向に沿って配列された複数の
抵抗発熱体膜に給電するべく、基板上に形成された個別
電極及び共通電極を有するサーマルヘッドの電極構造に
関する。[Detailed Description of the Invention] [Object of the Invention] <Industrial Application Field> The present invention is directed to a heating element formed on a substrate in order to supply power to a plurality of resistance heating element films arranged along a certain direction on the substrate. The present invention relates to an electrode structure of a thermal head having individual electrodes and a common electrode.
〈従来の技術〉
従来から、サーマルヘッドの抵抗発熱部をプラテンに支
持された用紙に感熱転写インクリボンを介して摺接させ
ることにより所望の印字を行うサーマルプリンタが知ら
れている。上記したサーマルヘッドに於て、抵抗発熱部
は基板上に或る方向に沿って配列された複数の抵抗発熱
体膜からなっており、これら抵抗発熱体膜の各々は、そ
の一端が個別電極に接続され、他端が共通電極に接続さ
れている。この抵抗発熱体膜の発熱効率を向上するため
に特に共通電極の抵抗値を可及的に低くすることが好ま
しいが、例えば、共通電極を物理蒸着法等により形成す
る場合、膜厚が比較的薄くなることから、共通電極の抵
抗値が総じて高くなりがらであった。<Prior Art> Conventionally, thermal printers have been known that perform desired printing by bringing a resistance heating portion of a thermal head into sliding contact with a sheet of paper supported by a platen via a thermal transfer ink ribbon. In the above-mentioned thermal head, the resistance heating section consists of a plurality of resistance heating element films arranged along a certain direction on the substrate, and one end of each of these resistance heating element films is connected to an individual electrode. and the other end is connected to a common electrode. In order to improve the heat generation efficiency of this resistance heating element film, it is particularly preferable to lower the resistance value of the common electrode as much as possible. As the thickness of the common electrode increases, the resistance value of the common electrode tends to increase.
そこで、共通電極の表面に導電性のペーストを用いて厚
膜を焼成することが考えられるが、その場合、低温ペー
ストでは比抵抗が高いことから共通電極の低抵抗化が困
難となり、高温ペーストでは画電極及び抵抗発熱体膜の
熱による損傷を回避するべくその成膜工程が煩雑になる
問題がある。Therefore, it is conceivable to use conductive paste on the surface of the common electrode and fire a thick film, but in that case, low-temperature paste has a high specific resistance, making it difficult to reduce the resistance of the common electrode, and high-temperature paste There is a problem in that the film forming process becomes complicated in order to avoid damage to the picture electrode and the resistance heating element film due to heat.
また、サーマルヘッドの熱応答性を向上するために基板
の底面に設けられた金属製ヒートシンクを共通電極の低
抵抗化に利用することも考えられるが、共通電極とヒー
トシンクとは上記同様の厚膜により接続されるため、そ
の焼成熱により当該サーマルヘッドに搭載されるべきＩ
Ｃ等の電子部品やその保護用封止材等が損傷したり、ヒ
ートシンク自体が変形し易い問題がある。更に時開ＶＡ
６３−４９４５３＠公報には、共通電極の幅が狭くなる
箇所に導電性テープを貼着することにより、該部分の断
面積を大きくし、その抵抗値を低くすることが提案され
ているが、導電性テープは基板形状によっては貼着し難
く、その作業が煩雑になる問題がある。また、例えばサ
ーマルラインヘッドに於ては上記抵抗発熱体膜が多数配
列されており、その位置によって共通電極の抵抗値に差
を生じ、即ち各抵抗発熱体膜に供給される電流に差を生
じることから抵抗発熱体膜の発熱量が不均一となり、印
字むらの要因となる。In addition, in order to improve the thermal response of the thermal head, it is also possible to use a metal heat sink provided on the bottom of the substrate to lower the resistance of the common electrode, but the common electrode and heat sink are made of a thick film similar to the above. , the firing heat causes the I to be mounted on the thermal head to
There are problems in that electronic components such as C and their protective sealing materials are damaged, and the heat sink itself is easily deformed. Furthermore, time-opening VA
Publication No. 63-49453 proposes attaching a conductive tape to the part where the width of the common electrode becomes narrow to increase the cross-sectional area of that part and lower its resistance value. There is a problem in that the conductive tape is difficult to adhere depending on the shape of the substrate, and the work becomes complicated. In addition, for example, in a thermal line head, a large number of the above-mentioned resistance heating element films are arranged, and the resistance value of the common electrode varies depending on the position, which causes a difference in the current supplied to each resistance heating element film. As a result, the amount of heat generated by the resistance heating element film becomes non-uniform, which causes uneven printing.
〈発明が解決しようとする課題〉
このような従来技術の問題点に鑑み、本発明の主な目的
は、基板上に或る方向に沿って配列された複数の抵抗発
熱体膜に接続された共通電極の抵抗値が可及的に低減さ
れたサーマルヘッドの電極構造を提供することにある。<Problems to be Solved by the Invention> In view of the problems of the prior art, the main purpose of the present invention is to provide a heating element connected to a plurality of resistance heating element films arranged along a certain direction on a substrate. An object of the present invention is to provide an electrode structure for a thermal head in which the resistance value of a common electrode is reduced as much as possible.
［発明の構成］
く課題を解決するための手段〉
このような目的は、本発明によれば、サーマルヘッドの
基板上に或る方向に沿って配列された複数の抵抗発熱体
膜に給電するべく、前記基板上に形成されると共に前記
各抵抗発熱体膜に接続された個別電極及び共通電極を有
するサーマルヘッドの電極構造であって、前記共通電極
が、電解めっき及び無電解めっきのいずれか一方により
形成されるか或いは少なくとも前記共通電極表面の一部
に電解めっきまたは無電解めっきにより形成された導Ｎ
層を重ね合せたことを特徴とするサーマルヘッドを提供
することにより達成される。[Structure of the Invention] Means for Solving the Problems According to the present invention, such an object is to supply power to a plurality of resistance heating element films arranged along a certain direction on a substrate of a thermal head. An electrode structure of a thermal head having individual electrodes and a common electrode formed on the substrate and connected to each of the resistance heating element films, wherein the common electrode is formed by either electrolytic plating or electroless plating. or at least a part of the common electrode surface by electrolytic plating or electroless plating.
This is achieved by providing a thermal head characterized by superimposed layers.
く作用〉
このように、めっきにより共通電極を形成することによ
り、その断面積が大きくなり、即ち抵抗値が低減された
共通電極を得ることができる。また、共通電極の表面に
めっきにより比較的厚みのある導電層を設けることによ
り、上記同様共通電極の抵抗値を低くし得る。更に、抵
抗発熱体膜の配列方向に沿ってその全幅に亘り上記導電
層を形成すること（より、例えばサーマルラインヘッド
に於て各抵抗発熱体膜の発熱毎に外を生じることがない
。Effects> As described above, by forming the common electrode by plating, it is possible to obtain a common electrode whose cross-sectional area is increased, that is, whose resistance value is reduced. Further, by providing a relatively thick conductive layer on the surface of the common electrode by plating, the resistance value of the common electrode can be lowered as described above. Furthermore, the conductive layer is formed over the entire width of the resistive heating element films in the direction in which they are arranged (thereby, for example, in a thermal line head, there is no occurrence of excess heat every time the respective resistive heating element films generate heat).
〈実施例〉
以下、本発明の好適実施例を添付の図面について詳しく
説明する。<Embodiments> Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
第１図及び第２図は、本発明に基づく第１の実施例を示
す。図示されない紙の印字面に感熱転写インクリボンを
介して対向するサーマルラインヘッド１は、セラミック
基板２と該基板上に第１図に於ける左右方向に延在する
抵抗発熱部３と、抵抗発熱部３の復配する多数の抵抗発
熱体膜３ａに接続された個別電極４と、全ての抵抗発熱
体膜３ａに個別電極４と相反する側にて接続された共通
電極５とを有している。各個別電極４は各抵抗発熱体Ｗ
；４３ａ’！ｉ−選択的に発熱させるための図示されな
いＩＣ等の電子部品に接続されている。1 and 2 show a first embodiment according to the invention. The thermal line head 1, which faces the printed surface of paper (not shown) via a thermal transfer ink ribbon, includes a ceramic substrate 2, a resistance heating section 3 extending in the left-right direction in FIG. It has individual electrodes 4 connected to a large number of redistributed resistance heating element films 3a of section 3, and a common electrode 5 connected to all the resistance heating element films 3a on the side opposite to the individual electrodes 4. . Each individual electrode 4 has a resistance heating element W
;43a'! i- Connected to electronic components such as an IC (not shown) for selectively generating heat.
第２図に良く示すように、セラミック基板２は、アルミ
ナ層６と、その表面に成層したガラスグレーズ層７とか
らなる。ガラスグレーズ層７の表面には厚さ２μｍの二
酸化珪素からなるアンダーコ−上層８が積層されている
。また、抵抗発熱部３に於て、ガラスグレーズ層７が盛
上げられ、凸部７ａを形成形成し、その上層のアンダー
コート層８の表面に厚さ８００人のタンタル−二酸化珪
素（Ｔａ−３ｉ ０２ ）からなる抵抗発熱体膜３ａが
スパッタリングにより成膜されている。抵抗発熱体膜３
ａの両端部に各々接するように厚さ１０００人のクロム
層及び厚さ１．２μｍの金層からなる個別電極４と、共
通電極５とが電解めっき或いは無電解めっきにより形成
されている。尚、実際には画電極４．５をスパッタリン
グ或いは真空蒸着等により成膜しても良い。更に、第１
図に併せて示すように、共通電極５には、抵抗発熱体膜
３ａの配列方向に沿ってその全幅に亘り厚ざが１２μｍ
程度の銅からなる導電層９が電解めっきにより形成され
ている。画電極４．５、抵抗発熱体膜３ａ及び導電層９
の表面には、厚さ４μｍの二酸化珪素層及び厚さ１．５
μｍの窒化珪素層からなる保ｉｌｌ！！１０が成膜され
ている。As clearly shown in FIG. 2, the ceramic substrate 2 consists of an alumina layer 6 and a glass glaze layer 7 formed on the surface thereof. On the surface of the glass glaze layer 7, an undercoat upper layer 8 made of silicon dioxide and having a thickness of 2 μm is laminated. Further, in the resistance heating part 3, the glass glaze layer 7 is raised to form a convex part 7a, and the surface of the upper undercoat layer 8 is coated with tantalum-silicon dioxide (Ta-3i 02) with a thickness of 800 mm. ) is formed by sputtering. Resistance heating element membrane 3
Individual electrodes 4 made of a chromium layer with a thickness of 1000 mm and a gold layer with a thickness of 1.2 μm and a common electrode 5 are formed by electrolytic plating or electroless plating so as to be in contact with both ends of the electrode a. In fact, the picture electrode 4.5 may be formed by sputtering, vacuum deposition, or the like. Furthermore, the first
As shown in the figure, the common electrode 5 has a thickness difference of 12 μm over its entire width along the arrangement direction of the resistance heating element films 3a.
A conductive layer 9 made of copper is formed by electrolytic plating. Picture electrode 4.5, resistance heating element film 3a and conductive layer 9
The surface is covered with a 4 μm thick silicon dioxide layer and a 1.5 μm thick silicon dioxide layer.
A shield made of μm silicon nitride layer! ! 10 is deposited.
ここで、導電層９が抵抗発熱体膜３ａの配列方向に沿っ
てその全幅に亘り設けられていることにより、共通電極
５の該部分に於ける抵抗値を充分低くすることが可能と
なることから、各抵抗発熱体膜３ａの間でその発熱量に
差を生じることがない。Here, by providing the conductive layer 9 along the entire width of the resistance heating element film 3a, it is possible to sufficiently reduce the resistance value in this portion of the common electrode 5. Therefore, there is no difference in the amount of heat generated between the respective resistance heating element films 3a.
第３図は、本発明に基づく第２の実施例を示す第２図と
同様の図である。本実施例では抵抗発熱体膜１３ａがセ
ラミック基板１２の端部近傍に設けられている。また、
ガラスグレーズ層１７及びアンダーコート層１８がセラ
ミック基板１２の主面側のみでなく、その端面及び表面
側の一部にまで形成されている。更に、共通電極１５も
セラミック基板１２の主面、端面及び裏面に形成されて
いる。そして、本実施例では、導電層１９がセラミツク
基板１２裏面側の共通電極１８上にのみ電解めっきによ
り形成されている。FIG. 3 is a diagram similar to FIG. 2 showing a second embodiment based on the present invention. In this embodiment, the resistance heating element film 13a is provided near the end of the ceramic substrate 12. Also,
A glass glaze layer 17 and an undercoat layer 18 are formed not only on the main surface side of the ceramic substrate 12 but also on the end surface and part of the surface side. Furthermore, a common electrode 15 is also formed on the main surface, end surface, and back surface of the ceramic substrate 12. In this embodiment, the conductive layer 19 is formed only on the common electrode 18 on the back side of the ceramic substrate 12 by electrolytic plating.
尚、本実施例に於て、セラミック基板１２の裏面側には
共通電極１５を形成せず、導電層１９をセラミック基板
１２の主面或いは端面にて共通電極１５と部分的に接触
するように無電解めっきにより形成しても良い。In this embodiment, the common electrode 15 is not formed on the back side of the ceramic substrate 12, but the conductive layer 19 is made to partially contact the common electrode 15 on the main surface or end surface of the ceramic substrate 12. It may be formed by electroless plating.
第４図は本発明に基づく第３の実施例を示す第３図と同
様の図である。本実施例では、セラミック基板２２に於
て、ガラスグレーズ層２７及びアンダーコート層２８が
主面側にのみ形成されている。また、共通電極２５は、
セラミック基板２２の主面、端面及び裏面に形成されて
いる。従って・比較的多孔質なアルミナＮ２６の隅部に
てその表面に共通電極２５が直接形成されていることか
ら該電極が破断し易くなることが考えられるが、導電層
２９が共通電極２５表面の主面側から端面及び裏面側に
かけて形成されているため、該電極を補強している。そ
れ以外の構成は第２の実施例と同様である。FIG. 4 is a diagram similar to FIG. 3 showing a third embodiment based on the present invention. In this embodiment, in the ceramic substrate 22, the glass glaze layer 27 and the undercoat layer 28 are formed only on the main surface side. Further, the common electrode 25 is
They are formed on the main surface, end surface, and back surface of the ceramic substrate 22. Therefore, since the common electrode 25 is formed directly on the surface of the relatively porous alumina N26 at the corner, it is conceivable that the electrode is likely to break. Since it is formed from the main surface side to the end surface and back surface side, the electrode is reinforced. The rest of the configuration is the same as the second embodiment.
第５図は本発明に基づく第４の実施例を示す第３図と同
様の図である。本実施例では、抵抗発熱体膜３３ａがセ
ラミック基板３２の主面と端面との間の隅部に形成され
た傾斜面３２ａの部分に形成されている。それ以外の構
成は第２の実施例と同様である。FIG. 5 is a diagram similar to FIG. 3 showing a fourth embodiment based on the present invention. In this embodiment, the resistance heating element film 33a is formed on the inclined surface 32a formed at the corner between the main surface and the end surface of the ceramic substrate 32. The rest of the configuration is the same as the second embodiment.
第６図は本発明に基づく第５の実施例を示す第５図と同
様の図である。本実施例では、セラミック基板４２のガ
ラスグレーズ層４７及びアンダーコート層４８がアルミ
ナ層４６の主面及び端面にのみ設けられている。本実施
例に於ても、アルミナ層４６の端面と表面との間の隅部
にて、その表面に共通電極４５が直接形成されているが
、導電層４９が共通電極４５表面の端面から裏面側にか
けて形成されているため、該電極を補強している。FIG. 6 is a diagram similar to FIG. 5 showing a fifth embodiment based on the present invention. In this embodiment, the glass glaze layer 47 and undercoat layer 48 of the ceramic substrate 42 are provided only on the main surface and end surface of the alumina layer 46. In this embodiment as well, the common electrode 45 is formed directly on the surface of the alumina layer 46 at the corner between the end surface and the front surface, but the conductive layer 49 extends from the end surface of the surface of the common electrode 45 to the back surface. Since it is formed over the side, it reinforces the electrode.
それ以外の構成は第４の実施例と同様である。The rest of the configuration is the same as the fourth embodiment.
［発明の効果コ
このように本発明によれば、共通電極を電解めっき或い
は無電解めっきにより形成することにより断面積が大き
く即ち抵抗値が低く、かつ抵抗発熱体膜等に悪影響を及
ぼすことのない共通電極を容易に得ることができる。ま
た、共通電極の表面に電解めっき或いは無電解めっきに
より導電層を形成することにより、上記同様の共通電極
の抵抗値を可及的に低くすることができる。更に、抵抗
発熱体膜の配設方向に沿ってその全幅に亘り上記導電層
を形成することにより、例えばサーマルラインヘッドに
於て各抵抗発熱体膜の発熱最に差を生じることがなくな
る。以上のことからサーマルヘッドに於ける電力の使用
効率が向上すると共に印字性能が大幅に向上するため、
本発明の効果は極めて大である。[Effects of the Invention] As described above, according to the present invention, by forming the common electrode by electrolytic plating or electroless plating, the cross-sectional area is large, that is, the resistance value is low, and it is possible to avoid the negative effect on the resistance heating element film, etc. A common electrode can be easily obtained. Further, by forming a conductive layer on the surface of the common electrode by electrolytic plating or electroless plating, the resistance value of the common electrode similar to the above can be made as low as possible. Furthermore, by forming the conductive layer over the entire width of the resistive heating element films in the direction in which they are disposed, for example, in a thermal line head, there is no difference in heat generation between the respective resistive heating element films. From the above, the efficiency of power usage in the thermal head is improved and the printing performance is significantly improved.
The effects of the present invention are extremely large.
第１図は本発明に基づく電極構造が適用されたサーマル
ラインヘッドの要部を示す平面図である。
第２図は第１図の■−■線から見た拡大断面図である。
第３図〜第６図は本発明に基づく第２〜第５の実施例を
示す第２図と同様の図である。
１・・・サーマルラインヘッド
２・・・セラミック基板 ３・・・抵抗発熱部３ａ・・
・抵抗発熱体膜 ４・・・個別電極５・・・共通電極
６・・・アルミナ層７・・・ガラスグレーズ層７
ａ・・・凸部８・・・アンダーコート層９・・・導電層
１０・・・保護層 １２・・・セラミック基板１
３ａ・・・抵抗発熱体膜１５・・・共通電極１６・・・
アルミナ層 １７・・・ガラスグレーズ層１８・・・
アンダーコート層
１９・・・導電層 ２２・・・セラミック基板２
５・・・共通電極 ２６・・・アルミナ層２７・・
・ガラスグレーズ層
２８・・・アンダーコート層
２９・・・導電層 ３２ａ・・・傾斜面３３ａ・
・・抵抗発熱体膜４２・・・セラミック基板４５・・・
共通電極 ４６・・・アルミナ層４７・・・ガラス
グレーズ層
４８・・・アンダーコート層
４９・・・導電層FIG. 1 is a plan view showing the main parts of a thermal line head to which an electrode structure according to the present invention is applied. FIG. 2 is an enlarged sectional view taken along the line ■-■ in FIG. 1. 3 to 6 are views similar to FIG. 2 showing second to fifth embodiments based on the present invention. 1... Thermal line head 2... Ceramic substrate 3... Resistance heating part 3a...
・Resistance heating element membrane 4...Individual electrode 5...Common electrode
6...Alumina layer 7...Glass glaze layer 7
a... Convex portion 8... Undercoat layer 9... Conductive layer 10... Protective layer 12... Ceramic substrate 1
3a...Resistance heating element film 15...Common electrode 16...
Alumina layer 17...Glass glaze layer 18...
Undercoat layer 19...conductive layer 22...ceramic substrate 2
5... Common electrode 26... Alumina layer 27...
・Glass glaze layer 28...Undercoat layer 29...Conductive layer 32a...Slanted surface 33a・
... Resistance heating element film 42 ... Ceramic substrate 45 ...
Common electrode 46...Alumina layer 47...Glass glaze layer 48...Undercoat layer 49...Conductive layer
Claims (3)
された複数の抵抗発熱体膜に給電するべく、前記基板上
に形成されると共に前記各抵抗発熱体膜に接続された個
別電極及び共通電極を有するサーマルヘッドの電極構造
であつて、 前記共通電極が、電解めつき及び無電解めつきのいずれ
か一方により形成されたことを特徴とするサーマルヘッ
ドの電極構造。(1) In order to supply power to a plurality of resistance heating element films arranged along a certain direction on the substrate of the thermal head, individual electrodes formed on the substrate and connected to each of the resistance heating element films; 1. An electrode structure for a thermal head having a common electrode, wherein the common electrode is formed by either electrolytic plating or electroless plating.
された複数の抵抗発熱体膜に給電するべく、前記基板上
に形成されると共に前記各抵抗発熱体膜に接続された個
別電極及び共通電極を有するサーマルヘッドの電極構造
であって、 少なくとも前記共通電極表面の一部に電解めつきまたは
無電解めつきにより形成された導電層を重ね合せたこと
を特徴とするサーマルヘッドの電極構造。(2) Individual electrodes formed on the substrate and connected to each of the resistance heating element films in order to supply power to the plurality of resistance heating element films arranged along a certain direction on the substrate of the thermal head; An electrode structure for a thermal head having a common electrode, characterized in that a conductive layer formed by electrolytic plating or electroless plating is superimposed on at least a part of the surface of the common electrode. .
つてその全幅に亘り形成されたことを特徴とする特許請
求の範囲第２項に記載のサーマルヘッドの電極構造。(3) The electrode structure of a thermal head according to claim 2, wherein the conductive layer is formed over the entire width of the resistance heating element film along the arrangement direction thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63183199A JP2561133B2 (en) | 1988-07-22 | 1988-07-22 | Electrode structure of thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63183199A JP2561133B2 (en) | 1988-07-22 | 1988-07-22 | Electrode structure of thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0232867A true JPH0232867A (en) | 1990-02-02 |
| JP2561133B2 JP2561133B2 (en) | 1996-12-04 |
Family
ID=16131503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63183199A Expired - Fee Related JP2561133B2 (en) | 1988-07-22 | 1988-07-22 | Electrode structure of thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2561133B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012030380A (en) * | 2010-07-28 | 2012-02-16 | Kyocera Corp | Thermal head and thermal printer equipped with the same |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5862655U (en) * | 1981-10-22 | 1983-04-27 | 日本電気株式会社 | thermal printer head |
| JPS58101080A (en) * | 1981-12-14 | 1983-06-16 | Oki Electric Ind Co Ltd | Manufacture of thermal head |
| JPS6110472A (en) * | 1984-06-26 | 1986-01-17 | Toshiba Corp | Manufacture of thermal head |
| JPS6164463A (en) * | 1984-09-06 | 1986-04-02 | Matsushita Electric Ind Co Ltd | Preparation of thermal head |
| JPS61183652U (en) * | 1986-04-17 | 1986-11-15 | ||
| JPS6347164A (en) * | 1986-08-15 | 1988-02-27 | Nec Corp | Substrate for thermal print head and manufacture therefor |
| JPS6374659A (en) * | 1986-09-19 | 1988-04-05 | Hitachi Ltd | Thermal recording head |
| JPH0180356U (en) * | 1987-11-17 | 1989-05-30 | ||
| JPH01275068A (en) * | 1988-04-26 | 1989-11-02 | Nec Corp | Thermal head substrate |
-
1988
- 1988-07-22 JP JP63183199A patent/JP2561133B2/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5862655U (en) * | 1981-10-22 | 1983-04-27 | 日本電気株式会社 | thermal printer head |
| JPS58101080A (en) * | 1981-12-14 | 1983-06-16 | Oki Electric Ind Co Ltd | Manufacture of thermal head |
| JPS6110472A (en) * | 1984-06-26 | 1986-01-17 | Toshiba Corp | Manufacture of thermal head |
| JPS6164463A (en) * | 1984-09-06 | 1986-04-02 | Matsushita Electric Ind Co Ltd | Preparation of thermal head |
| JPS61183652U (en) * | 1986-04-17 | 1986-11-15 | ||
| JPS6347164A (en) * | 1986-08-15 | 1988-02-27 | Nec Corp | Substrate for thermal print head and manufacture therefor |
| JPS6374659A (en) * | 1986-09-19 | 1988-04-05 | Hitachi Ltd | Thermal recording head |
| JPH0180356U (en) * | 1987-11-17 | 1989-05-30 | ||
| JPH01275068A (en) * | 1988-04-26 | 1989-11-02 | Nec Corp | Thermal head substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012030380A (en) * | 2010-07-28 | 2012-02-16 | Kyocera Corp | Thermal head and thermal printer equipped with the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2561133B2 (en) | 1996-12-04 |
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