JPS6374659A - Thermal recording head - Google Patents
Thermal recording headInfo
- Publication number
- JPS6374659A JPS6374659A JP21950386A JP21950386A JPS6374659A JP S6374659 A JPS6374659 A JP S6374659A JP 21950386 A JP21950386 A JP 21950386A JP 21950386 A JP21950386 A JP 21950386A JP S6374659 A JPS6374659 A JP S6374659A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- drive circuit
- recording head
- thermal recording
- circuit system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000003698 laser cutting Methods 0.000 claims abstract description 6
- 238000007639 printing Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 abstract description 16
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 238000005520 cutting process Methods 0.000 abstract description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 3
- 239000010931 gold Substances 0.000 abstract description 3
- 229910052737 gold Inorganic materials 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 3
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000005338 heat storage Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000004886 head movement Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は感熱記録ヘッドに係り、特にファクシミリやプ
リンタ等に利用される小型化でき、低コスト化、粗面紙
への対応に好適な感熱記録ヘッドに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a thermal recording head, and in particular to a thermal recording head that can be used in facsimile machines, printers, etc. and can be made smaller, lower in cost, and suitable for handling rough paper. This relates to recording heads.
従来の感熱記録ヘッドは、特開昭５７−１０７８６６号
公報に代表されるように、セラミックス基板のフラット
側に発熱抵抗体を置く構造になっており、また、現在、
アイデアの段階であるが、エツジ面に発熱抵抗体を形成
させる構造は、特開昭５７−９３１７１号公報に代表さ
れるように、機能部である発熱域と駆動回路部とを一体
化しである。Conventional thermal recording heads have a structure in which a heating resistor is placed on the flat side of a ceramic substrate, as typified by Japanese Patent Laid-Open No. 57-107866.
Although it is still at the idea stage, the structure in which the heating resistor is formed on the edge surface is to integrate the heating area, which is a functional part, and the drive circuit part, as typified by Japanese Patent Laid-Open No. 57-93171. .
上記従来技術は、ヘッドの小型化や低コスト化などの点
については配慮がなされておらず、そのため、プリンタ
などに搭載すると、装置の大型化を招いていた。The above-mentioned conventional technology does not give consideration to miniaturization or cost reduction of the head, and therefore, when installed in a printer or the like, the device becomes larger.
本発明の目的は、プリンタなどの実装しやすく、小形化
が可能で、かつ、高密度実装化が可能な感熱記録ヘッド
を提供することにある。An object of the present invention is to provide a thermal recording head that is easy to mount in a printer or the like, can be miniaturized, and can be mounted with high density.
上記目的は、基板のエツジ面に発熱機能部を配置し、別
の基板のフラット面に駆動用ＩＣを含む駆動回路系を配
置した構成のサイドフェース形感熱記録ヘッドとし、上
記発熱機能部と駆動回路系の接続を金属の全面印刷後レ
ーザ・カッティングによって配線パターンを形成して行
った構成として達成するようにした。The above object is to provide a side-face type thermal recording head with a configuration in which a heat generating function section is arranged on the edge surface of a substrate, and a drive circuit system including a driving IC is arranged on a flat surface of another substrate, and the above heat generating function section and drive circuit system are arranged on the flat surface of another substrate. The connection of the circuit system was achieved by forming a wiring pattern by laser cutting after printing the entire surface of the metal.
例えば、厚膜抵抗体を例にとって説明すると。 For example, let's take a thick film resistor as an example.
通常、厚膜の抵抗体は、酸化雰囲気中で焼成して形成さ
れるが、この部分に比較的安価な、例えば銅のような材
料を用いると、酸化によって使用不能となる。しかし、
金では問題がない。一方、駆動回路などの相対的に粗に
配線部に対しては、金などの貴金属を用いるとコスト高
となってしまう。Normally, thick film resistors are formed by firing in an oxidizing atmosphere, but if a relatively inexpensive material such as copper is used for this part, it will become unusable due to oxidation. but,
There is no problem with money. On the other hand, if noble metals such as gold are used for relatively coarse wiring parts such as drive circuits, the cost will be high.
従来の記録ヘッドのように、各プロセスが直列に進行し
ていく場合、抵抗体が形成後の熱履歴の影響を受け、安
定なヘッドを作るのが技術的に相当難しくなるが、生産
管理上１機能部分と駆動部分を分割生産すると、不良の
回収率（見かけの歩留り）が向上する。When each process proceeds in series, as in conventional recording heads, the resistor is affected by the thermal history after formation, making it technically quite difficult to create a stable head. Separate production of one functional part and the drive part improves the recovery rate of defects (apparent yield).
以下本発明を第１図〜第８図、第１０図、第１２図に示
した実施例および第９図、第１１図を用いて詳細に説明
する。The present invention will be explained in detail below with reference to the embodiments shown in FIGS. 1 to 8, FIG. 10, and FIG. 12, and FIGS. 9 and 11.
第１図は本発明の感熱記録ヘッドの一実施例を示す組立
タイプのサンド・フェース形感熱記録ヘッドの横断面図
であり、第２図は第１図の組立分解図である。エツジ面
に発熱抵抗体１を有しているが、このエツジ面は、グレ
ーズガラスつきセラミックス基板のフラット面を短く切
断して形成しである。この上に電極配線および発熱抵抗
体１が形成してあり、駆動側電極と共通電極の間に電力
を印加すると１間の発熱抵抗体１が発熱し、発色するし
くみになっている。FIG. 1 is a cross-sectional view of an assembled type sand-face type thermal recording head showing an embodiment of the thermal recording head of the present invention, and FIG. 2 is an exploded view of FIG. 1. The heating resistor 1 is provided on the edge surface, and this edge surface is formed by cutting a flat surface of a ceramic substrate with glazed glass into short lengths. Electrode wiring and a heat generating resistor 1 are formed on this, and when electric power is applied between the driving side electrode and the common electrode, the heat generating resistor 1 between the electrodes 1 generates heat and colors.
最終的に、機能部基板と駆動回路基板およびヒートシン
クを接合して記録ヘッドを形成させる。Finally, the functional unit board, drive circuit board, and heat sink are bonded together to form a recording head.
なお、第１図、第２図において、２はブレース蓄熱層、
３はセラミックス基板、４は駆動回路板、５は駆動用Ｉ
Ｃ，６はヒートシンク兼用配線板、７はコネクタ、８は
駆動側カバー、９は共通側カバーである。In addition, in FIG. 1 and FIG. 2, 2 is a brace heat storage layer,
3 is a ceramic substrate, 4 is a drive circuit board, and 5 is a drive I.
C, 6 is a wiring board that also serves as a heat sink, 7 is a connector, 8 is a drive side cover, and 9 is a common side cover.
次に、エツジ面にある機能部配線と駆動回路系の配線お
よび共通配線との接続について説明する。Next, the connection between the functional wiring on the edge surface, the wiring of the drive circuit system, and the common wiring will be explained.
第３図は機能部と駆動回路系の接続を金の全面印刷ある
いはメッキを施してレーザ・カッティングして配線パタ
ーンを形成して行う方法を示した図で、接続部を含む特
定領域に金の全面印刷あるいはメッキを施した後、レー
ザによって切断する。Figure 3 shows a method for connecting functional parts and drive circuits by printing or plating the entire surface of gold and forming wiring patterns by laser cutting. After the entire surface is printed or plated, it is cut using a laser.
駆動回路配線と共通配線は、発熱部に比べ配線幅を十分
にとれ、同時に配線間隔も十分とれることから、レーザ
による切断に支障をきたすことはない、なお、第３図に
おいて、１０は共通側電極、１１は駆動側電極、１２は
接続部、１３はレーザ装置で、その他は第１図と同様で
ある。The drive circuit wiring and the common wiring have a sufficient wiring width compared to the heat generating part, and the wiring spacing is also sufficient, so there is no problem with laser cutting. The other parts are the same as those shown in FIG. 1, including electrodes, 11 is a driving side electrode, 12 is a connecting portion, and 13 is a laser device.
第４＠は第３図の接続方法によって作ったサイド・フェ
ース形感熱記録ヘッドの縦断面図であり、第３図の機能
部配線と駆動回路系配線を全面印刷あるいはメッキを施
した後、レーザ・カッティングによって切断して樽た記
録ヘッドを示しており、１４にレーザ・カッティング溝
である。Figure 4 is a vertical cross-sectional view of a side-face type thermal recording head made using the connection method shown in Figure 3. After the functional wiring and drive circuit wiring shown in Figure 3 are printed or plated on the entire surface, the laser - It shows a recording head that has been cut by cutting, and there is a laser cutting groove at 14.
第５図はワイヤーボンディングによる接続方法を示した
図で、機能部配線と駆動回路系配線をワイヤーボンディ
ング１５によって接続しである。FIG. 5 is a diagram showing a connection method using wire bonding, in which functional part wiring and drive circuit wiring are connected by wire bonding 15. In FIG.
ワイヤーボンディング１５の自動ボンダーは多くの実績
があり、実施にあたってなんら問題はない。The wire bonding 15 automatic bonder has many achievements and there are no problems in implementing it.
第６図は半田端子を両端にもつ接合フィルムによって接
合する方法を示した図で、機能部配線と駆動回路系配線
の両端に半田層を形成し、両配線に相対する配線をもつ
接合フィルタ（例えば。Figure 6 shows a method of bonding using a bonding film that has solder terminals on both ends, in which a solder layer is formed on both ends of the functional wiring and the drive circuit wiring, and a bonding filter ( for example.
ＦＰＣ）１６を半田によって接合するように１ノである
。FPC) 16 is connected by soldering.
第７図は対向させた機能部と駆動回路の配線とを半田接
合した上にネジによる機械的接合による接続方法を示し
た図で、機能部配線と駆動回路系配線とを対向させ、両
配線に半田層を形成し、半田接着するとともに、ヒート
シンク兼用配線板６にネジ穴を設けて接合用ネジ１７に
よって機能的結合を行うようにしである。Figure 7 is a diagram showing a connection method by soldering the facing functional part and drive circuit wiring and mechanically joining them with screws. A solder layer is formed on the heat sink wiring board 6 for solder bonding, and screw holes are provided in the wiring board 6 that also serves as a heat sink so that a functional connection can be achieved using a joining screw 17.
第８図は異方性導電膜によって接続する方法を示した図
で、第７図と同様に機能部配線と駆動回路系配線とを対
向させ、その間に異方性導電膜１８を用いる方法である
。異方性導電膜１８とは、接着性、導電性、絶縁性の３
つの機能を同時に有した接続材料であり、熱圧着するこ
とにより、膜１８の厚み方向には導電性９面方向には絶
縁性という電気的異方性をもつ高分子膜である。FIG. 8 is a diagram showing a method of connection using an anisotropic conductive film, in which the functional part wiring and the drive circuit wiring are made to face each other as in FIG. 7, and an anisotropic conductive film 18 is used between them. be. The anisotropic conductive film 18 has three properties: adhesive, conductive, and insulating.
It is a connecting material having two functions at the same time, and by thermocompression bonding, it is a polymer film that has electrical anisotropy such that it is conductive in the thickness direction of the film 18 and insulating in the direction of the nine planes.
次に実施例の効果について説明する。初めに、装置小型
化を実現する実装性の良さについて説明する。第９図は
従来のフラット形感熱記録ヘッドを用いて、第１０図は
本発明の実施例によるサイドフェース形感熱記録ヘッド
を用いてフルカラー熱転写記録をする場合の装置実装の
模式図を示す。Next, the effects of the embodiment will be explained. First, we will explain the ease of mounting that makes the device smaller. FIG. 9 shows a schematic diagram of an apparatus implementation when performing full-color thermal transfer recording using a conventional flat type thermal recording head and FIG. 10 using a side face type thermal recording head according to an embodiment of the present invention.
従来のフラット形感熱記録ヘッドにおいては、第９図に
示すように、フラツト形感熱記録ヘッド１９自体の占め
る体積も大きく、また、拘束領域ならびに３色記録のた
めのヘッド移動領域も大きいため、必然的に転写フィル
ム・カセット２０が大きくなり、装置の厚みＬも大きく
なっている。In the conventional flat type thermal recording head, as shown in FIG. 9, the volume occupied by the flat type thermal recording head 19 itself is large, and the restraint area and the head movement area for three-color recording are also large, so Specifically, the transfer film cassette 20 has become larger, and the thickness L of the device has also become larger.
なお、２１はプラテン・ドラム、２２は被転写紙である
。これに対して、本発明の実施例の感熱記録ヘッドでは
、第１０図に示すように、サイドフェース形感熱記録ヘ
ッド２３の直動領域が比較的小さくてすむため、転写フ
ィルム・カセット２゜も小さくでき、装置の小型薄形化
、カセットの低価格化をはかることができる。Note that 21 is a platen drum, and 22 is a transfer paper. On the other hand, in the thermal recording head according to the embodiment of the present invention, as shown in FIG. The device can be made smaller, the device can be made smaller and thinner, and the cost of the cassette can be reduced.
次に、粗面紙などの表面特性の劣る紙への転写特性の向
上について述べる。第１１図は従来のフラット形感熱記
録ヘッドを用いた場合、第１２図は本発明の実施例のサ
イドフェース形感熱記録ヘッドを用いた場合の転写フィ
ルムの被転写紙の切離し領域の自由度の差を示した図で
、第１１図の従来形のヘッドでは、フラット形感熱記録
ヘッド１９が大きく、媒体の径路をふさぐため、切離し
角度や切離し時期を自由に設定できない欠点を有してい
た。これに対して本発明の実施例のサイド・フェース形
感熱記録ヘッド２３では、第１２図に示すように自由度
が大きく、これらのタイミングを最適にでき、その結果
として粗面紙への転写特性を向上できる。なお、第１１
図、第１２図において、２２は被転写紙、２４は転写フ
ィルムである。Next, we will discuss the improvement of transfer characteristics to paper with poor surface characteristics such as rough paper. FIG. 11 shows the degree of freedom in the separation area of the transferred paper from the transfer film when a conventional flat type thermal recording head is used, and FIG. In the conventional head shown in FIG. 11, the flat thermal recording head 19 is large and blocks the path of the medium, so it has the disadvantage that the separation angle and separation timing cannot be set freely. On the other hand, the side face type thermal recording head 23 according to the embodiment of the present invention has a large degree of freedom as shown in FIG. can be improved. In addition, the 11th
In the figure and FIG. 12, 22 is a transfer paper, and 24 is a transfer film.
以上説明したように、本発明によれば、プリンタなどに
実装しやすく、小形化が可能であり、かつ、高密度実装
化が可能であるという効果がある。As described above, the present invention has the advantage of being easy to mount in a printer or the like, allowing for miniaturization, and enabling high-density packaging.
第１図は本発明の感熱記録ヘッドの一実施例を示す組立
タイプのサイド・フェース形感熱記録ヘッドの横断面図
、第２図は第１図の感熱記録ヘッドの組立分解図、第３
図は機能部と駆動部の接続部を全面印刷あるいはメッキ
を施し、レーザ・カッティングする方法を示した図、第
４図は第３図の接続方法によって作ったサイド・フェー
ス形感熱記録ヘッドの一実施例を示す縦断面図、第５図
はワイヤーボンディングによる接続方法を示した図、第
６図は半田端子を両端にもつ接合フィルムによって接合
する方法を示した図、第７図は対向させた機能部と駆動
部の配線を半田接合した上にネジによる機械的結合によ
る接続方法を示した図。
第８図は異方性導電膜によって接続する方法を示した図
、第９図は従来のフラット形感熱記録ヘッドを用いて、
第１０図は本発明の実施例のサイドフェース形感熱記録
ヘッドを用いてフルカラー熱転写記録をする場合の装置
実装の模式図、第１１図は従来のフラット形感熱記録ヘ
ッドを用いた場合、第１２図は本発明の実施例のサイド
フェース形感熱記録ヘッドを用いた場合の転写フィルム
と被転写紙の切離し領域の自由度の差を示した図である
。
１・・・発熱抵抗体、２・・・グレーズ蓄熱層、３・・
・セラミック基板、４・・・駆動回路板、５・・・駆動
用ＩＣ１６・・・ヒートシンク兼用配線板、７・・・コ
ネクタ、１０・・・共通側電極、１１・・・駆動側電極
、１２・・・接続部、１５・・・ワイヤーボンディング
、１６・・・接合フィルム、１７・・・接合用ネジ、１
８・・・異方性導電第 １ 図
／４−４−サー力７テン７溝
早 ５ の
１５・・・ワイヤ一本“／ディ〉り゛。
第 ６ 図
７６−・・接合フィルム
第 ７１２Ｔ
１７、棲＠用ンヅ
奉 ９１２］
？Ｏ、転写、フィルムＪ１仕ソト
２３°゛・サイＦフェースク〉測＼熱
寥乙銖ヘッド
２４・・・転写フイルムFIG. 1 is a cross-sectional view of an assembly type side face type thermal recording head showing an embodiment of the thermal recording head of the present invention, FIG. 2 is an exploded view of the thermal recording head of FIG. 1, and FIG.
The figure shows a method of printing or plating the entire surface of the connecting part between the functional part and the driving part, and cutting it with a laser. Figure 4 shows a side face type thermal recording head made using the connecting method shown in Figure 3. A vertical cross-sectional view showing an embodiment, Fig. 5 is a drawing showing a connection method using wire bonding, Fig. 6 is a drawing showing a method of bonding using a bonding film having solder terminals on both ends, and Fig. 7 is a drawing showing a connection method using a bonding film with solder terminals on both ends. A diagram showing a connection method in which wiring between a functional part and a driving part is soldered and then mechanically connected using screws. Fig. 8 shows a method of connection using an anisotropic conductive film, and Fig. 9 shows a connection method using a conventional flat type thermal recording head.
FIG. 10 is a schematic diagram of the device implementation when performing full-color thermal transfer recording using the side-face type thermal recording head according to the embodiment of the present invention, and FIG. The figure shows the difference in the degree of freedom in the separation area between the transfer film and the transfer paper when the side face type thermal recording head of the embodiment of the present invention is used. 1... Heat generating resistor, 2... Glaze heat storage layer, 3...
- Ceramic substrate, 4... Drive circuit board, 5... Drive IC 16... Heat sink wiring board, 7... Connector, 10... Common side electrode, 11... Drive side electrode, 12 ... Connection part, 15 ... Wire bonding, 16 ... Bonding film, 17 ... Bonding screw, 1
8...Anisotropic conduction No. 1 Figure/4-4-Sur force 7 Ten 7 Groove speed 5-15...One wire "/di". 6 Figure 76--Joining film No. 712T 17, living @ use 912] ?O, transfer, film J1 type soto 23°゛・Sai F face> measurement ＼ heat transfer head 24... transfer film
Claims (1)
ラット面に駆動用ＩＣを含む駆動回路系を有するサイド
フェース形感熱記録ヘッドであつて、前記発熱機能部と
駆動回路系の接続を金属の全面印刷後レーザ・カッティ
ングによつて配線パターンを形成して行つた構成とした
ことを特徴とする感熱記録ヘッド。1. A side face type thermal recording head having a heat generating function section on the edge surface of a substrate and a drive circuit system including a drive IC on the flat surface of another substrate, wherein the heat generating function section and the drive circuit system are connected to each other. A thermal recording head characterized in that the connection is made by forming a wiring pattern by laser cutting after printing the entire surface of metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21950386A JPS6374659A (en) | 1986-09-19 | 1986-09-19 | Thermal recording head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21950386A JPS6374659A (en) | 1986-09-19 | 1986-09-19 | Thermal recording head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6374659A true JPS6374659A (en) | 1988-04-05 |
Family
ID=16736470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21950386A Pending JPS6374659A (en) | 1986-09-19 | 1986-09-19 | Thermal recording head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6374659A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0232867A (en) * | 1988-07-22 | 1990-02-02 | Nhk Spring Co Ltd | Electrode structure for thermal head |
-
1986
- 1986-09-19 JP JP21950386A patent/JPS6374659A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0232867A (en) * | 1988-07-22 | 1990-02-02 | Nhk Spring Co Ltd | Electrode structure for thermal head |
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