JPS6038178A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS6038178A JPS6038178A JP14848483A JP14848483A JPS6038178A JP S6038178 A JPS6038178 A JP S6038178A JP 14848483 A JP14848483 A JP 14848483A JP 14848483 A JP14848483 A JP 14848483A JP S6038178 A JPS6038178 A JP S6038178A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- common electrode
- plate
- pattern
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】 [発明の技術分野〕 この発明は、ファクシミリやプリンタの記録。[Detailed description of the invention] [Technical field of invention] This invention is used for facsimile and printer recording.
表示装置として用いられるサーマルヘッドに関し、該サ
ーマルヘッドの記録電源回路の補強を図ったものに関す
るものである。The present invention relates to a thermal head used as a display device, and relates to a thermal head whose recording power supply circuit is reinforced.
従来この種の装置として、第1図、第2図に示すものが
あった。第1図、第2図において、■はセラミック基板
、2はこのセラミック基板1を支持するベース、3はセ
ラミック基板1上に印刷、または蒸着、スパッタされた
発熱素子群、4はセラミック基板1上に同様に印刷、ま
たは蒸着、スパッタされた共通電極、5は共通電極4と
の間に発熱素子群3を介して設けられた分離電極群であ
る。Conventionally, there have been devices of this type as shown in FIGS. 1 and 2. In FIGS. 1 and 2, ■ is a ceramic substrate, 2 is a base that supports this ceramic substrate 1, 3 is a group of heating elements printed, vapor-deposited, or sputtered on the ceramic substrate 1, and 4 is on the ceramic substrate 1. A common electrode 5 is printed, vapor-deposited, or sputtered in the same manner as in FIG.
本サーマルヘッドを製造する際は、アルミ放熱板等のベ
ース2で支持されたセラミック基板1上に、第1図(b
)にその拡大図を示すように1発熱素子3a、3b、・
・・からなる発熱素子群3を印刷し、各々の発熱素子3
a、3bの一端が共通電極4に接続されるように、共通
電極4の導体パターンを印刷する。次に各々の発熱素子
3a、3bの他端がそれぞれ分離電極群5の各々の分離
電極5a。When manufacturing this thermal head, it is placed on a ceramic substrate 1 supported by a base 2 such as an aluminum heat sink, as shown in FIG.
) As shown in the enlarged view, one heating element 3a, 3b, .
A heating element group 3 consisting of... is printed, and each heating element 3
A conductive pattern of the common electrode 4 is printed so that one ends of a and 3b are connected to the common electrode 4. Next, the other ends of the respective heating elements 3a and 3b are the respective separation electrodes 5a of the separation electrode group 5, respectively.
5bに接続されるように分離電極群5の導体パターンを
印刷する。通當上記セラミンク基板l上に発熱素子群3
および導体パターンで構成される共通電極41分離電極
群5を作成する場合、厚膜製透性と薄膜製造法とがある
が、製造方法は本説明では厚膜製造法とする。A conductor pattern of the separated electrode group 5 is printed so as to be connected to the electrode group 5b. A heating element group 3 is generally mounted on the ceramic substrate l.
When creating the common electrode 41 and the separated electrode group 5, which are composed of conductor patterns, there are two methods: a thick film permeable method and a thin film manufacturing method. In this description, the thick film manufacturing method is used as the manufacturing method.
次に動作について説明する。Next, the operation will be explained.
共通電極4に発熱素子群30発熱素子のそれぞれを発熱
させるべく記録電流を流すと、発熱素子群3の各々の発
熱素子3a、3b+ ・・・の他端に接続される分離電
極群5の電位を適宜選択設定することにより、発熱素子
群3の任意の発熱素子に電流を流すことができる。した
がって発熱素子に発生するジュール熱により、発熱素子
群3上の感熱紙を発色させることができる。このときの
電流容量は、通常、発熱素子−素子あたり、10mA〜
100mA程度の電流容量でもって駆動する。When a recording current is passed through the common electrode 4 to cause each of the heating elements of the heating element group 30 to generate heat, the potential of the separate electrode group 5 connected to the other end of each heating element 3a, 3b+, . . . of the heating element group 3 increases. By appropriately selecting and setting , current can be passed through any heating element of the heating element group 3 . Therefore, the Joule heat generated in the heating elements can cause the thermal paper on the heating element group 3 to develop color. The current capacity at this time is usually 10 mA to 10 mA per heating element-element.
It is driven with a current capacity of about 100 mA.
従来のこの種のサーマルヘッドは、発熱素子群を発熱さ
せるための記録電流が比較的大きいため、共通電極側の
電流容量を確保するために共通電極側パターン幅を広く
とらねばならながった。従ってサーマルヘッドの発熱素
子群をセラミック端部に設置する要求に対して対処でき
ないという欠点があった。またこの点に鑑みパターン幅
を細くし、パターン厚を大きくした場合は、共通電極が
発熱素子群より平面高さが高くなるため、発熱素子群に
押し当てる押圧ロールの押圧がマツチしない等の欠点が
あった。In conventional thermal heads of this type, the recording current required to generate heat in the heating element group is relatively large, so the pattern width on the common electrode side had to be wide in order to ensure the current capacity on the common electrode side. . Therefore, there is a drawback that it cannot meet the requirement of installing the heating element group of the thermal head at the end of the ceramic. In addition, if the pattern width is made narrower and the pattern thickness is increased in consideration of this point, the common electrode will have a higher plane height than the heating element group, resulting in disadvantages such as the pressure of the pressure roll that presses against the heating element group not matching. was there.
この発明は、上記のような従来のものの欠点を除去する
ためになされたもので、発熱素子群をセラミック基板の
端辺付近に設置し、上記基板端辺と発熱素子群との間に
共通電極パターンを設け、セラミック基板の側面部に上
記共通電極パターンと接続された電極補強パターンを有
する電極補強板を取付け、共通電極の電流容量を確保す
ることにより、上記電極補強パターンにより感熱紙に印
字された文字を記録直後に観察することを可能としたサ
ーマルヘッドを提供することを目的としている。This invention was made in order to eliminate the drawbacks of the conventional ones as described above, and a group of heating elements is installed near the edge of a ceramic substrate, and a common electrode is installed between the edge of the substrate and the group of heating elements. By providing a pattern and attaching an electrode reinforcing plate having an electrode reinforcing pattern connected to the common electrode pattern to the side surface of the ceramic substrate to ensure the current capacity of the common electrode, it is possible to print on thermal paper using the electrode reinforcing pattern. An object of the present invention is to provide a thermal head that allows characters to be observed immediately after being recorded.
以下この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第3図ないし第5図は本発明の一実施例によるサーマル
ヘッドを示し、第3図において、6は約50μmの厚み
を有しその中に銅からなる補強電極パターン(図示せず
)を有するポリイミドベース、7はポリイミドベース6
の一部を削って上記補強電極パターンを露出させ、これ
に接着することによりポリイミドベース6に取付けられ
た約70μmの金メツキ銅板、8は金メツキ銅板7上の
所定位置に熱圧着された厚み約25μmの金リボンであ
る。3 to 5 show a thermal head according to an embodiment of the present invention, and in FIG. 3, reference numeral 6 has a thickness of about 50 μm and has a reinforcing electrode pattern (not shown) made of copper therein. Polyimide base, 7 is polyimide base 6
A gold-plated copper plate of about 70 μm is attached to the polyimide base 6 by scraping off a part to expose the reinforcing electrode pattern and adhering it thereto. It is a gold ribbon of approximately 25 μm.
また第4図、第5図において、9は基板の端部−辺をシ
リトリしており、かつそのシリトリした端部側面に傾斜
部9aを有するセラミック基板、2はセラミック基板9
と、ポリイミドベース6とを支持するアルミ放熱板等の
ベース、3はセラミック基@9のシリトリした方の端部
付近に設置された発熱素子群、4は共通電極、5は分離
電極群であり、発熱素子群3の一端は共通電極4に接続
され、発熱素子群3のそれぞれの発熱素子の他端は分離
電極群5のそれぞれの分離電極に接続されている。Further, in FIGS. 4 and 5, reference numeral 9 denotes a ceramic substrate whose edges are slitted, and has an inclined portion 9a on the side surface of the slitted end, and 2 is a ceramic substrate 9.
and a base such as an aluminum heat sink that supports the polyimide base 6, 3 is a heating element group installed near the slit end of the ceramic base @ 9, 4 is a common electrode, and 5 is a separate electrode group. , one end of the heating element group 3 is connected to the common electrode 4, and the other end of each heating element of the heating element group 3 is connected to each separation electrode of the separation electrode group 5.
本サーマルヘッドの動作は従来の装置と同一であるので
説明を省略し2本サーマルヘッドの製造方法について説
明する。Since the operation of this thermal head is the same as that of the conventional device, the explanation will be omitted, and the method of manufacturing the two thermal heads will be explained.
厚み1.Otsのセラミック基板9の一辺を上面より0
.5fiシリトリする。次にセラミック基板9のシリト
リした一辺のエッヂより、INを共通電極幅とし、共通
電極パターンと分離電極パターンを印刷し、共通電極4
と分離電極群5を構成する。Thickness 1. One side of the ceramic substrate 9 of Ots is 0 from the top surface.
.. 5fi Shiritori. Next, from the edge of one side of the ceramic substrate 9, a common electrode pattern and a separation electrode pattern are printed with IN as the common electrode width, and the common electrode 4 is printed.
and constitute a separate electrode group 5.
これにより共通電極4の一部はセラミック基板9のシリ
トリされた傾斜部9aの上に形成される。As a result, a part of the common electrode 4 is formed on the slanted portion 9a of the ceramic substrate 9.
次に発熱素子群3をセラミック基板9のシリトリした一
辺のエッヂより1.5mmの位置に形成する。Next, the heating element group 3 is formed at a position 1.5 mm from the edge of one side of the ceramic substrate 9.
本発明方法の場合、この製造には厚膜印刷法を用いた。In the case of the method of the invention, a thick film printing method was used for this production.
従って共通電極4、分離電極群5は厚膜金ペーストを用
いた導体パターンとなる。次にアルミナ放熱板を用いた
ベース2上に、上記セラミック基板9を所定の位置に接
着剤で固定し、第3図で示した補強電極パターンを有し
、電極補強板となるポリイミドベース6を、第5図に示
すようにセラミック基板9のシリトリした一辺の近傍の
ベース2上に接着する。次に金メツキ銅板7上に取付け
られている金リボン8をセラミック基板9上のシリトリ
された傾斜部9a上の共通電極4の金パターン部に熱圧
着ボンダで取付ける。さらに図示していないが、金リボ
ン8保護のため、金リボン8の取付皿はエポキシ樹脂で
モールドする。Therefore, the common electrode 4 and the separate electrode group 5 are conductive patterns using thick film gold paste. Next, the ceramic substrate 9 is fixed in a predetermined position with adhesive on the base 2 made of an alumina heat sink, and a polyimide base 6 having the reinforcing electrode pattern shown in FIG. 3 and serving as an electrode reinforcing plate is attached. As shown in FIG. 5, the ceramic substrate 9 is bonded onto the base 2 in the vicinity of one slit side. Next, the gold ribbon 8 attached to the gold-plated copper plate 7 is attached to the gold pattern portion of the common electrode 4 on the slit inclined portion 9a of the ceramic substrate 9 using a thermocompression bonder. Furthermore, although not shown, the mounting plate for the gold ribbon 8 is molded with epoxy resin to protect the gold ribbon 8.
以上のような本実施例のサーマルヘッドでは、電極補強
板6の補強電極パターンにより共通電極側の電流容量を
確保するようにしたので、共通電極パターンのパターン
幅を小さくでき、これにより発熱素子群を基板のエツジ
に設置した、いわゆる超エツジタイプのサーマルヘッド
を実現できた。In the thermal head of this embodiment as described above, the current capacity on the common electrode side is ensured by the reinforcing electrode pattern of the electrode reinforcing plate 6, so the pattern width of the common electrode pattern can be made small, and thereby the heating element group We were able to create a so-called super-edge type thermal head that was installed at the edge of the substrate.
しかもこの場合共通電極パターンのパターン厚を大きく
していないので、共通電極の平面高さが発熱素子群より
高くなるようなことがなく、押圧ロールの押圧がマツチ
しないという問題は生じない。Moreover, in this case, since the pattern thickness of the common electrode pattern is not increased, the plane height of the common electrode will not be higher than the group of heat generating elements, and the problem of inconsistent pressure of the press rolls will not occur.
さらに共通電極と補強電極パターンとの接続を金メツキ
銅板7と金リボン8とを用いて行なっているので、銅か
らなる補強電極パターンと金メツキ銅板との接続および
金メツキ銅板と金リボンとの接続を安定、確実にでき、
装置の信頼性が高い。Furthermore, since the common electrode and the reinforcing electrode pattern are connected using the gold-plated copper plate 7 and the gold ribbon 8, the reinforcing electrode pattern made of copper and the gold-plated copper plate are connected, and the gold-plated copper plate and the gold ribbon are connected. Stable and reliable connection,
The equipment is highly reliable.
なお上記実施例では、共通電極42分離電極5゜発熱素
子群3を保護するための耐摩耗層については説明を省略
したが、これはあっても良い。また共通電極4と共通電
極補強板であるポリイミドベース6との接続に金リボン
熱圧着法を用いたが、これはワイヤポンド法、特殊半田
付法を用いてもよい。Note that in the above embodiment, explanation of the wear-resistant layer for protecting the common electrode 42, the separation electrode 5, and the heating element group 3 is omitted, but it may be provided. Further, although the gold ribbon thermocompression bonding method was used to connect the common electrode 4 and the polyimide base 6, which is the common electrode reinforcing plate, a wire bonding method or a special soldering method may be used instead.
以上のように、この発明にかかるサーマルヘッドによれ
ば、セラミック基板の側面を利用して、共通電極と補強
電極パターンを有する電極補強板とを接続したので、共
通電極の電流容量を十分に確保でき、かつ発熱素子の近
傍に電極補強板を付けても発熱素子上を通過する感熱紙
にキズが付くことがなく1.またローラの邪魔になるこ
ともないという種々の効果が得られる。As described above, according to the thermal head according to the present invention, the common electrode and the electrode reinforcing plate having the reinforcing electrode pattern are connected using the side surface of the ceramic substrate, so that the current capacity of the common electrode is sufficiently secured. 1. Even if an electrode reinforcing plate is attached near the heating element, the thermal paper passing over the heating element will not be damaged.1. Moreover, various effects such as not getting in the way of the rollers can be obtained.
第1図[al (blは従来のサーマルヘッドの平面図
およびその一部拡大図、第2図は従来のサーマルヘッド
の側面図、第3図は本発明の一実施例のサーマルヘッド
の製造方法に用いる電極補強板を示す斜視図、第4図は
上記本発明の一実施例によるサーマルヘッドの平面図、
第5図は上記サーマルヘッドの側面図である。
1・・・セラミック基板、2・・・ベース、3・・・発
熱素子群、4・・・共通電極、5・・・分離電極群、6
・・・ポリイミドベース(電極補強板)、7・・・金メ
・ツキ銅板、8・・・金リボン、9・・・セラミック基
板。
なお図中、同一符号は同−又は相当部分を示す。
代理・人 大 岩 増 雄FIG. 1 [al (bl is a plan view and a partially enlarged view of a conventional thermal head, FIG. 2 is a side view of a conventional thermal head, and FIG. 3 is a method for manufacturing a thermal head according to an embodiment of the present invention) FIG. 4 is a plan view of the thermal head according to an embodiment of the present invention; FIG.
FIG. 5 is a side view of the thermal head. DESCRIPTION OF SYMBOLS 1...Ceramic substrate, 2...Base, 3...Heating element group, 4...Common electrode, 5...Separate electrode group, 6
... Polyimide base (electrode reinforcing plate), 7... Gold plated copper plate, 8... Gold ribbon, 9... Ceramic board. In the drawings, the same reference numerals indicate the same or equivalent parts. Agent Masuo Oiwa
Claims (1)
端部付近に設置された発熱素子群と、上記セラミック基
板の上記端部と上記発熱素子群との間に露出して設けら
れた共通電極パターンと、上記セラミック基板の側面部
に上記共通電極パターンと近接して設置され上記共通電
極パターンと接続された補強電極パターンを有する電極
補強板とを備えたことを特徴とするサーマルヘッド。(1) A ceramic substrate, a group of heating elements installed near one end of the ceramic substrate, and a common electrode pattern exposed between the end of the ceramic substrate and the group of heating elements. and an electrode reinforcing plate having a reinforcing electrode pattern installed on a side surface of the ceramic substrate in close proximity to the common electrode pattern and connected to the common electrode pattern.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14848483A JPS6038178A (en) | 1983-08-11 | 1983-08-11 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14848483A JPS6038178A (en) | 1983-08-11 | 1983-08-11 | Thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6038178A true JPS6038178A (en) | 1985-02-27 |
Family
ID=15453786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14848483A Pending JPS6038178A (en) | 1983-08-11 | 1983-08-11 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6038178A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62111765A (en) * | 1985-11-09 | 1987-05-22 | Mitsubishi Electric Corp | Thermal head |
JPS63119040U (en) * | 1987-01-27 | 1988-08-01 |
-
1983
- 1983-08-11 JP JP14848483A patent/JPS6038178A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62111765A (en) * | 1985-11-09 | 1987-05-22 | Mitsubishi Electric Corp | Thermal head |
JPS63119040U (en) * | 1987-01-27 | 1988-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6038178A (en) | Thermal head | |
JP2020059223A (en) | Thermal print head and manufacturing method thereof | |
US5764267A (en) | Conduction recording head | |
US4990935A (en) | Thermal head | |
JP2007083401A (en) | Manufacturing method for wiring substrate, and liquid delivering head | |
JP2002036615A (en) | Thermal head | |
JP2018167439A (en) | Thermal head and thermal printer | |
JP3477076B2 (en) | Thermal head and method of manufacturing the same | |
JP2676026B2 (en) | Thermal head | |
JPS60183752A (en) | Long electronic device | |
JPS61237662A (en) | Integrated circuit device | |
JP2598729Y2 (en) | Thermal head | |
JPH0569576A (en) | Structure of line thermal printing head | |
JPS6253847A (en) | End-face type thermal head | |
JPS6242854A (en) | Thermal head | |
JPH06210884A (en) | Thermal head | |
JPH055669B2 (en) | ||
JPS61237660A (en) | Integrated circuit device | |
JP2014069374A (en) | Thermal print head, and method for manufacturing the same | |
JPS63151467A (en) | Thermal recording apparatus | |
JPH08290600A (en) | Thermal print head | |
JPH05286157A (en) | Thermal head | |
JP2010167749A (en) | Thermal print head | |
JPS62156973A (en) | Electronic device | |
JPH07323595A (en) | Thermal printing head |