JPH0424355U - - Google Patents
Info
- Publication number
- JPH0424355U JPH0424355U JP6574190U JP6574190U JPH0424355U JP H0424355 U JPH0424355 U JP H0424355U JP 6574190 U JP6574190 U JP 6574190U JP 6574190 U JP6574190 U JP 6574190U JP H0424355 U JPH0424355 U JP H0424355U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- ceramic substrate
- circuit board
- printed circuit
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 4
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案の一実施例のサーマルヘツドの
断面構造図、第２図は本考案の他の実施例のセラ
ミツク板の断面図、第３図、第４図は従来例のサ
ーマルヘツドの断面構造図である。
１……アルミニウム放熱板、２……セラミツク
板、３……突起部、４……アモルフアスグレーズ
層、５……発熱体層、６……コモン電極、７……
個別電極、８……発熱体部、１０……ＰＣＢ、１
１……ＰＣＢ、１２……コモン電極取出し部、１
５……ＩＣ。
Figure 1 is a sectional view of a thermal head according to an embodiment of the present invention, Figure 2 is a sectional view of a ceramic plate according to another embodiment of the invention, and Figures 3 and 4 are of a conventional thermal head. FIG. DESCRIPTION OF SYMBOLS 1...Aluminum heat sink, 2...Ceramic plate, 3...Protrusion, 4...Amorphous glaze layer, 5...Heating element layer, 6...Common electrode, 7...
Individual electrode, 8... Heating element part, 10... PCB, 1
1...PCB, 12...Common electrode extraction part, 1
5...IC.
Claims (1)
サーマルヘツドにおいて、 放熱板上に、突起部に発熱体部を設けたセラミ
ツク基板と、コモン電極機能を有する電極部を形
成したプリント回路板と、駆動回路を形成したプ
リント回路板とを設け、セラミツク基板上の各電
極とプリント回路板上の電極部、駆動回路をワイ
ヤボンデイングにより接続することを特徴とする
サーマルヘツド。 (2) ワイヤボンデイングにより接続したセラミ
ツク基板上の各電極と、プリント回路板上の電極
部、駆動回路をエポキシ樹脂で被覆することを特
徴とする請求項１記載のサーマルヘツド。[Scope of Claim for Utility Model Registration] (1) In a thermal head in which a heating element is arranged on a ceramic substrate, a ceramic substrate in which a heating element is provided on a protrusion on a heat sink, and an electrode having a common electrode function. A printed circuit board having a part formed thereon and a printed circuit board having a driving circuit formed thereon are provided, and each electrode on the ceramic substrate is connected to the electrode part on the printed circuit board and the driving circuit by wire bonding. Head. (2) The thermal head according to claim 1, wherein each electrode on the ceramic substrate connected by wire bonding, the electrode portion on the printed circuit board, and the drive circuit are coated with epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6574190U JPH0424355U (en) | 1990-06-21 | 1990-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6574190U JPH0424355U (en) | 1990-06-21 | 1990-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0424355U true JPH0424355U (en) | 1992-02-27 |
Family
ID=31597839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6574190U Pending JPH0424355U (en) | 1990-06-21 | 1990-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0424355U (en) |
-
1990
- 1990-06-21 JP JP6574190U patent/JPH0424355U/ja active Pending
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