JPH02108033U - - Google Patents
Info
- Publication number
- JPH02108033U JPH02108033U JP1668789U JP1668789U JPH02108033U JP H02108033 U JPH02108033 U JP H02108033U JP 1668789 U JP1668789 U JP 1668789U JP 1668789 U JP1668789 U JP 1668789U JP H02108033 U JPH02108033 U JP H02108033U
- Authority
- JP
- Japan
- Prior art keywords
- fixed
- print medium
- board
- circuit pattern
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本願考案の一実施例の断面図、第２図
は第１図の要部拡大図、第３図は従来例の断面図
である。
２……印字媒体、３……駆動用ＩＣ、１７……
サーマルプリントヘツド、１８……ベース基板、
１９……ヘツド基板、２０……保護カバー、２１
……リードパターン、２２……回路パターン。
FIG. 1 is a sectional view of one embodiment of the present invention, FIG. 2 is an enlarged view of the main part of FIG. 1, and FIG. 3 is a sectional view of a conventional example. 2... Print medium, 3... Drive IC, 17...
Thermal print head, 18...Base board,
19... Head board, 20... Protective cover, 21
...Lead pattern, 22...Circuit pattern.
Claims (1)
形成したベース基板上の所定部位に、印字媒体と
上記印字媒体へ導通するリードパターンとを備え
るヘツド基板を固着するとともに、上記印字媒体
を駆動させる駆動用ＩＣを、上記ベース基板の回
路パターンに固定する一方、上記駆動用ＩＣと上
記ヘツド基板のリードパターンとの間および上記
駆動用ＩＣと上記ベース基板上の回路パターンと
の間をそれぞれワイヤボンデイングにより結線し
、かつ、上記駆動用ＩＣを覆う保護カバーをベー
ス基板上に固定して構成したことを特徴とする、
サーマルプリントヘツド。 A head board comprising a print medium and a lead pattern electrically connected to the print medium is fixed to a predetermined portion on a base board that also serves as a heat sink and has a circuit pattern formed on one side, and a driving IC that drives the print medium. is fixed to the circuit pattern on the base board, and the drive IC and the lead pattern on the head board and the drive IC and the circuit pattern on the base board are connected by wire bonding, respectively. , and a protective cover covering the driving IC is fixed on the base substrate,
Thermal print head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989016687U JP2535032Y2 (en) | 1989-02-15 | 1989-02-15 | Thermal print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989016687U JP2535032Y2 (en) | 1989-02-15 | 1989-02-15 | Thermal print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02108033U true JPH02108033U (en) | 1990-08-28 |
| JP2535032Y2 JP2535032Y2 (en) | 1997-05-07 |
Family
ID=31229832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989016687U Expired - Lifetime JP2535032Y2 (en) | 1989-02-15 | 1989-02-15 | Thermal print head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2535032Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012206273A (en) * | 2011-03-29 | 2012-10-25 | Toshiba Hokuto Electronics Corp | Thermal head |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60206673A (en) * | 1984-03-30 | 1985-10-18 | Seiko Keiyo Kogyo Kk | Thermal head |
| JPS6370338U (en) * | 1986-10-27 | 1988-05-11 |
-
1989
- 1989-02-15 JP JP1989016687U patent/JP2535032Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60206673A (en) * | 1984-03-30 | 1985-10-18 | Seiko Keiyo Kogyo Kk | Thermal head |
| JPS6370338U (en) * | 1986-10-27 | 1988-05-11 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012206273A (en) * | 2011-03-29 | 2012-10-25 | Toshiba Hokuto Electronics Corp | Thermal head |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2535032Y2 (en) | 1997-05-07 |