JPH0227344U - - Google Patents
Info
- Publication number
- JPH0227344U JPH0227344U JP10561288U JP10561288U JPH0227344U JP H0227344 U JPH0227344 U JP H0227344U JP 10561288 U JP10561288 U JP 10561288U JP 10561288 U JP10561288 U JP 10561288U JP H0227344 U JPH0227344 U JP H0227344U
- Authority
- JP
- Japan
- Prior art keywords
- driver
- substrate
- heat dissipation
- heating element
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 3
- 239000000919 ceramic Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案のサーマルヘツドの断面図、第
２図は従来のサーマルヘツドの断面図、第３図は
従来のサーマルヘツドの他の例の断面図、第４図
は従来のサーマルヘツドの部分拡大断面図である
。
１……放熱マウント、２……グレーズドセラミ
ツク基板、３……部分グレーズ、４……配線板、
５……ドライバＩＣ、６……ボンデイングワイヤ
、７……封止樹脂、８……プラテンローラ、１１
，１２……面、１３……段部。
Fig. 1 is a sectional view of the thermal head of the present invention, Fig. 2 is a sectional view of a conventional thermal head, Fig. 3 is a sectional view of another example of a conventional thermal head, and Fig. 4 is a sectional view of a conventional thermal head. FIG. 3 is a partially enlarged sectional view. 1... Heat dissipation mount, 2... Glazed ceramic board, 3... Partial glaze, 4... Wiring board,
5... Driver IC, 6... Bonding wire, 7... Sealing resin, 8... Platen roller, 11
, 12... surface, 13... step part.
Claims (1)
ライバＩＣと、 ドライバＩＣと発熱体とを電気的に接続するた
めに、ドライバＩＣ上のパツドと基板上のパツド
とを接続するボンデイングワイヤと、 ドライバＩＣ上のパツドと基板上のパツドが略
同一の高さとなるように、基板の固定面より低く
放熱マウント上に形成された配線板を固定するた
めの面とを備えるサーマルヘツド。[Scope of claim for utility model registration] A heat dissipation mount that radiates generated heat, a board placed on the heat dissipation mount, a heating element formed on the board, a wiring board on which a power supply line is formed, and a wiring board. a driver IC mounted on the top of the driver IC that drives the heating element; a bonding wire that connects a pad on the driver IC with a pad on the substrate in order to electrically connect the driver IC and the heating element; A thermal head comprising a surface for fixing a wiring board formed on a heat dissipation mount lower than a fixing surface of the substrate so that the pads on the substrate and the pads on the substrate are at approximately the same height.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10561288U JPH0227344U (en) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10561288U JPH0227344U (en) | 1988-08-10 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227344U true JPH0227344U (en) | 1990-02-22 |
Family
ID=31338384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10561288U Pending JPH0227344U (en) | 1988-08-10 | 1988-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227344U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017177476A (en) * | 2016-03-29 | 2017-10-05 | 京セラ株式会社 | Thermal head and thermal printer |
-
1988
- 1988-08-10 JP JP10561288U patent/JPH0227344U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017177476A (en) * | 2016-03-29 | 2017-10-05 | 京セラ株式会社 | Thermal head and thermal printer |