JPS641948U - - Google Patents
Info
- Publication number
- JPS641948U JPS641948U JP9614387U JP9614387U JPS641948U JP S641948 U JPS641948 U JP S641948U JP 9614387 U JP9614387 U JP 9614387U JP 9614387 U JP9614387 U JP 9614387U JP S641948 U JPS641948 U JP S641948U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- driver
- ceramic substrate
- head assembly
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図及び第２図は本考案の１実施例によるラ
イン型サーマルヘツド組立体に係り、第１図は印
刷状態の一部切断要部側面図、第２図は一部切り
欠いた平面図、第３図及び第４図は従来例に係り
、第３図は第１図に対応する印刷状態の一部切断
要部側面図、第４図は第２図に対応する一部切り
欠いた平面図である。
図中、２は発熱抵抗体、３はドライバーＩＣ、
４はフレキシブル基板、５は放熱板、７はネジ、
８は弾性体、１２はプラテン、１３はセラミツク
基板、１３ａは平坦な下面、１３ｂは平坦面、１
３ｃは傾斜面、１４はスペーサ板、１５は保護板
、１５ａは上面、１６は被印刷媒体である。
1 and 2 relate to a line-type thermal head assembly according to an embodiment of the present invention, in which FIG. 1 is a partially cutaway side view of the main part in a printed state, and FIG. 2 is a partially cutaway plan view. , Fig. 3 and Fig. 4 relate to the conventional example, Fig. 3 is a partially cutaway side view of the main part in a printed state corresponding to Fig. 1, and Fig. 4 is a partially cutaway side view corresponding to Fig. 2. FIG. In the figure, 2 is a heating resistor, 3 is a driver IC,
4 is a flexible board, 5 is a heat sink, 7 is a screw,
8 is an elastic body, 12 is a platen, 13 is a ceramic substrate, 13a is a flat bottom surface, 13b is a flat surface, 1
3c is an inclined surface, 14 is a spacer plate, 15 is a protection plate, 15a is an upper surface, and 16 is a printing medium.
Claims (1)
ミツク基板は、その上面に、発熱抵抗体を形成し
た細幅の平坦面と、該発熱抵抗体と接続されたリ
ード電極が形成され且つ前記平坦面から漸次厚み
を減じるように傾斜した傾斜面とをもち、前記傾
斜面にはドライバーＩＣが搭載されると共に、こ
のドライバーＩＣを覆う保護板を前記放熱板に取
り付け、且つ、この放熱板の上平面を前記セラミ
ツク基板の平坦面と略面一にしたことを特徴とす
るライン型サーマルヘツド組立体。 The ceramic substrate, whose flat lower surface is attached to a heat sink, has a narrow flat surface on which a heating resistor is formed and a lead electrode connected to the heating resistor on its upper surface. A driver IC is mounted on the inclined surface, and a protective plate covering the driver IC is attached to the heat sink, and the upper plane of the heat sink is A line type thermal head assembly characterized in that the thermal head assembly is substantially flush with the flat surface of the ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9614387U JPS641948U (en) | 1987-06-23 | 1987-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9614387U JPS641948U (en) | 1987-06-23 | 1987-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS641948U true JPS641948U (en) | 1989-01-09 |
Family
ID=30961564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9614387U Pending JPS641948U (en) | 1987-06-23 | 1987-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS641948U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0452057U (en) * | 1990-09-10 | 1992-05-01 |
-
1987
- 1987-06-23 JP JP9614387U patent/JPS641948U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0452057U (en) * | 1990-09-10 | 1992-05-01 |
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