JPS6427246U - - Google Patents
Info
- Publication number
- JPS6427246U JPS6427246U JP12198187U JP12198187U JPS6427246U JP S6427246 U JPS6427246 U JP S6427246U JP 12198187 U JP12198187 U JP 12198187U JP 12198187 U JP12198187 U JP 12198187U JP S6427246 U JPS6427246 U JP S6427246U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- pressure contact
- printed circuit
- circuit board
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は、実施例サーマルヘツドを示す側面図
、第２図は、実施例サーマルヘツドの圧接手段を
示す要部拡大正面図、第３図は、従来のサーマル
ヘツドを示す側面図である。
１：放熱板、２：プリント基板、３：補強板、
４：フレキシブル基板、５：コネクタ、２１：配
線パターン、２２：発熱ドツト、２３：ＩＣ、６
１：カバー体、６３：突子、６４：圧接用弾性樹
脂層。
FIG. 1 is a side view showing the thermal head of the embodiment, FIG. 2 is an enlarged front view of the main parts showing the pressure contact means of the thermal head of the embodiment, and FIG. 3 is a side view of the conventional thermal head. 1: Heat sink, 2: Printed circuit board, 3: Reinforcement plate,
4: Flexible board, 5: Connector, 21: Wiring pattern, 22: Heat generating dot, 23: IC, 6
1: Cover body, 63: Protrusion, 64: Elastic resin layer for pressure contact.
Claims (1)
ト基板を載置し、上記プリント基板の配線パター
ン上に発熱ドツトを形成すると共に、一端部が前
記配線パターンの端部に重合する外部回路接続用
のフレキシブル基板を配備し、前記プリント基板
、配線パターン及びフレキシブル基板の重合部に
対し圧接手段を備えたサーマルヘツドにおいて、 前記圧接手段は、上記重合部へ突出する突子を
突設し、この突子の先端に圧接用弾性樹脂層を一
体に配備したことを特徴とするサーマルヘツド。[Claims for Utility Model Registration] A printed circuit board having a wiring pattern is placed on the upper surface of a heat sink, and heat generating dots are formed on the wiring pattern of the printed circuit board, and one end is located at the end of the wiring pattern. A thermal head is provided with a flexible board for connecting an external circuit that overlaps with each other, and is equipped with pressure contact means for the overlapping portion of the printed circuit board, the wiring pattern, and the flexible board, wherein the pressure contact means includes a protrusion protruding toward the overlapping portion. A thermal head is characterized in that a protruding protrusion is provided, and an elastic resin layer for pressure contact is integrally provided at the tip of the protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12198187U JPH078208Y2 (en) | 1987-08-07 | 1987-08-07 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12198187U JPH078208Y2 (en) | 1987-08-07 | 1987-08-07 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6427246U true JPS6427246U (en) | 1989-02-16 |
| JPH078208Y2 JPH078208Y2 (en) | 1995-03-01 |
Family
ID=31369488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12198187U Expired - Lifetime JPH078208Y2 (en) | 1987-08-07 | 1987-08-07 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH078208Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7420282B2 (en) | 2004-10-18 | 2008-09-02 | Sharp Kabushiki Kaisha | Connection structure for connecting semiconductor element and wiring board, and semiconductor device |
-
1987
- 1987-08-07 JP JP12198187U patent/JPH078208Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7420282B2 (en) | 2004-10-18 | 2008-09-02 | Sharp Kabushiki Kaisha | Connection structure for connecting semiconductor element and wiring board, and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH078208Y2 (en) | 1995-03-01 |