JPH078208Y2 - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH078208Y2 JPH078208Y2 JP12198187U JP12198187U JPH078208Y2 JP H078208 Y2 JPH078208 Y2 JP H078208Y2 JP 12198187 U JP12198187 U JP 12198187U JP 12198187 U JP12198187 U JP 12198187U JP H078208 Y2 JPH078208 Y2 JP H078208Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- thermal head
- circuit board
- printed circuit
- pressure contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electronic Switches (AREA)
Description
【考案の詳細な説明】 （イ）産業上の利用分野 この考案は、サーマルヘッドであって、プリント基板の
配線パターンと外部回路接続用のフレキシブル基板とを
簡易、且つ正確に圧接する圧接手段を配備したサーマル
ヘッドに関する。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial field of application The present invention relates to a thermal head, which includes a pressure contact means for easily and accurately pressure contacting a wiring pattern of a printed circuit board and a flexible circuit board for connecting an external circuit. Regarding the deployed thermal head.
（ロ）従来の技術 第３図は、従来のサーマルヘッドを示す側面図である。(B) Conventional Technique FIG. 3 is a side view showing a conventional thermal head.
サーマルヘッドは、アルミ放熱板71の上面に、配線パタ
ーン72を備えたプリント基板73と補強板74とを載置し、
上記プリント基板73の配線パターン72上に発熱ドット
（発熱素子）75及びドライブ用IC76を実装すると共に、
前記補強板74の上面に一端部が前記配線パターン72の端
部に重合する外部回路接続用のフレキシブル基板77を配
備し、このフレキシブル基板77にコネクタ79を接続し、
前記プリント基板73、配線パターン72及びフレキシブル
基板77の重合部に対し圧接手段78を備えて構成されてい
る。この圧接手段78は、上記補強板74に対して脱着可能
に螺着されたカバー体78aの内面に、内方向へ窪む断面
半円形状穴部78bを形成し、この穴部78bに圧接用棒状シ
リコンゴム78cを嵌着させて構成している。このカバー
体78aは、補強板（放熱板71を含む）74に対し、ネジ78d
止めされた状態において、圧接用棒状シリコンゴム78c
の下半周部（突出部）が、プリント基板73、配線パター
ン72及びフレキシブル基板77の重合部に対応位置するよ
うに設定されている。上記重合部の圧接は、ネジ78dの
締めつけにより圧接用棒状シリコンゴム78cの下半周部
（穴部より突出部）が、重合部を押圧、圧接すること
で、プリント基板73、配線パターン72及びフレキシブル
基板77の３層が電気的に接続される。The thermal head mounts a printed circuit board 73 having a wiring pattern 72 and a reinforcing plate 74 on the upper surface of the aluminum heat dissipation plate 71,
While mounting the heating dot (heating element) 75 and the drive IC 76 on the wiring pattern 72 of the printed board 73,
On the upper surface of the reinforcing plate 74 is arranged a flexible board 77 for external circuit connection in which one end overlaps with the end of the wiring pattern 72, and a connector 79 is connected to the flexible board 77.
The printed circuit board 73, the wiring pattern 72, and the flexible substrate 77 are provided with pressure contact means 78 for overlapping portions. The pressure contact means 78 has a semicircular hole 78b having a semicircular cross section, which is recessed inward, is formed on the inner surface of the cover body 78a that is detachably screwed to the reinforcing plate 74, and is used for pressure contact with the hole 78b. It is configured by fitting a rod-shaped silicone rubber 78c. This cover body 78a is attached to the reinforcing plate (including the heat dissipation plate 71) 74 with the screw 78d.
78c of rod-shaped silicon rubber for pressure welding when stopped
The lower half peripheral portion (protruding portion) is set to correspond to the overlapping portion of the printed board 73, the wiring pattern 72, and the flexible board 77. The pressure welding of the overlapping portion is performed by tightening the screw 78d so that the lower half peripheral portion (protruding portion from the hole) of the pressure-bonding rod-shaped silicon rubber 78c presses and presses the overlapping portion, so that the printed circuit board 73, the wiring pattern 72, and the flexible portion. The three layers of the substrate 77 are electrically connected.
（ハ）考案が解決しようとする問題点 上記、従来の圧接手段は、カバー体の内面に設けた穴部
に、棒状シリコンゴムを嵌着し、つまり棒状シリコンゴ
ムの上半周部を穴部に嵌着し、下半周部を穴部から突設
する構造であるため、カバー体に棒状シリコンゴムを嵌
着する工程が必要となり、この嵌着工程の自動化が困難
であり、生産性が極めて悪い。また、棒状シリコンゴム
の取付上、穴部と棒状シリコンゴムの寸法公差に精密な
正確性を要する許かりでなく、シリコンゴムが棒状であ
るため、高価なシリコンゴム資材を多量に必要とする結
果、製品原価が高騰する等の不利があった。(C) Problems to be Solved by the Invention In the above-mentioned conventional pressure contact means, rod-shaped silicone rubber is fitted into the hole provided on the inner surface of the cover body, that is, the upper half of the rod-shaped silicon rubber is used as the hole. Since the structure is such that the lower half peripheral portion is fitted and protrudes from the hole, a step of fitting the rod-shaped silicone rubber to the cover body is required, and automation of this fitting step is difficult and productivity is extremely poor. . In addition, when the rod-shaped silicone rubber is attached, the dimensional tolerance of the hole and the rod-shaped silicon rubber requires precise precision.Since the silicon rubber is rod-shaped, a large amount of expensive silicon rubber material is required. However, there were disadvantages such as high product cost.
この考案は、以上のような問題点を解消させ、適正な圧
接作用を発揮し、安価な圧接手段を備えたサーマルヘッ
ドを提供することを目的とする。An object of the present invention is to provide a thermal head which solves the above problems, exhibits a proper pressure contact action, and is provided with an inexpensive pressure contact means.
（ニ）問題点を解決するための手段及び作用 この目的を達成させるために、この考案のサーマルヘッ
ドでは、次のような構成としている。(D) Means and Actions for Solving Problems In order to achieve this object, the thermal head of the present invention has the following configuration.
サーマルヘッドは、放熱板の上面に、配線パターンを備
えたプリント基板を載置し、上記プリント基板の配線パ
ターン上に発熱ドットを形成すると共に、一端部が前記
配線パターンの端部に重合する外部回路接続用のフレキ
シブル基板を配備し、前記プリント基板、配線パターン
及びフレキシブル基板の重合部に対し圧接手段を備えた
サーマルヘッドであって、前記圧接手段は、上記重合部
へ突出する突子を突設し、この突子の先端に圧接用弾性
樹脂層を一体に配備して構成されている。The thermal head mounts a printed circuit board having a wiring pattern on the upper surface of a heat dissipation plate, forms heating dots on the wiring pattern of the printed circuit board, and one end overlaps with the end of the wiring pattern. A thermal head provided with a flexible board for circuit connection, comprising a press contact means for the printed circuit board, the wiring pattern, and the overlapped portion of the flexible board, wherein the press contact means projects a protrusion protruding to the overlapped portion. The elastic resin layer for pressure contact is integrally provided at the tip of the protrusion.
このような構成を有するサーマルヘッドでは、重合部対
応して、つまり、プリント基板、配線パターン及びフレ
キシブル基板の重合部に対し、圧接手段（突子先端に例
えば、シリコン系樹脂で形成された圧接用弾性樹脂層）
が対応配置されている。圧接力により、突子（圧接用弾
性樹脂層）が降下し、先端の圧接用弾性樹脂層が重合部
を押圧して、重合３層（プリント基板、配線パターン及
びフレキシブル基板）を圧接し、電気的に接続する。従
って、圧接用弾性樹脂層は、カバー体の内面より突出す
る突子の先端に一体形成されているから、従来のように
穴部に対し棒状シリコンゴムを嵌着する困難な生産工数
が省略でき、且つ穴部と棒状シリコンゴムの寸法公差の
適正化に神経を煩わされず、部品製造の自動化を実現し
得る。しかも、突子の先端部に対し圧接用弾性樹脂層を
成形するため、樹脂材料が少量で済み、且つ均等圧接作
用を発揮し得る。In the thermal head having such a structure, the pressure contact means is provided corresponding to the overlap portion, that is, to the overlap portion of the printed circuit board, the wiring pattern, and the flexible substrate (for the pressure contact formed at the tip of the protrusion with, for example, silicon resin). Elastic resin layer)
Are arranged correspondingly. Due to the pressure contact force, the protrusion (elastic resin layer for pressure contact) is lowered, and the elastic resin layer for pressure contact at the tip presses the polymerized portion to press the polymerized three layers (printed circuit board, wiring pattern and flexible circuit board) to generate electrical contact. Connect to each other. Therefore, since the elastic resin layer for pressure contact is integrally formed at the tip of the protrusion protruding from the inner surface of the cover body, it is possible to omit the difficult man-hours for fitting the rod-shaped silicone rubber into the hole as in the conventional case. In addition, the dimensional tolerance of the hole and the rod-shaped silicon rubber is not bothered, and automation of component manufacturing can be realized. In addition, since the elastic resin layer for pressure contact is formed on the tip of the protrusion, a small amount of resin material is required and the uniform pressure contact action can be exhibited.
（ホ）実施例 第１図は、実施例サーマルヘッドの具体的な一実施例を
示す側面図である。(E) Example FIG. 1 is a side view showing a specific example of the thermal head of the example.
サーマルヘッドは、公知のように一定幅長さを有する矩
形板状のアルミ放熱板１の上面に、配線パターン21を備
えたプリント基板２と、一定厚みを有する平板状絶縁補
強板３とを載置し、上記プリント基板２の配線パターン
21上に発熱ドット（発熱素子）22及びドライブ用IC23を
実装すると共に、前記補強板３の上面に一端部が前記配
線パターン21の端部に重合する外部回路接続用のフレキ
シブル基板４を配備し、このフレキシブル基板４にコネ
クタ５を接続している。そして、前記プリント基板２、
配線パターン21及びフレキシブル基板４の重合部には、
対応する圧接手段６が配備してある。As is well known, the thermal head mounts a printed circuit board 2 having a wiring pattern 21 and a flat plate-shaped insulating reinforcing plate 3 having a constant thickness on the upper surface of a rectangular plate-shaped aluminum heat dissipation plate 1 having a constant width and length. Place the wiring pattern on the printed circuit board 2
A heat generating dot (heat generating element) 22 and a drive IC 23 are mounted on 21 and a flexible board 4 for external circuit connection is provided on the upper surface of the reinforcing plate 3, one end of which overlaps with the end of the wiring pattern 21. A connector 5 is connected to the flexible board 4. And the printed circuit board 2,
In the overlapping portion of the wiring pattern 21 and the flexible substrate 4,
Corresponding crimping means 6 are provided.
この考案の特徴である前記圧接手段６は、第２図で示す
ように、上記補強板３に対し脱着可能にネジ62止めされ
たカバー体61の内面に、上記配線パターン（重合部）21
方向へ突出する突子63を突設し、この突子63の先端に圧
接用弾性樹脂層64を一体に配備して構成されている。カ
バー体61は、一定幅、長さを有する平面形状が矩形平板
で、上記フレキシブル基板４、配線パターン（IC23の導
体パターン）21及びIC23の上方を覆う大きさに設定して
ある。そして、カバー体61のほぼ中央部の凹陥部61a底
面にネジ穴（図示せず）が貫通形成してあり、このネジ
穴周面部（凹陥部61a底面）が前記フレキシブル基板
（補強板３）４の上面に接面し、且つ補強板３のネジ穴
（図示せず）と連通するように設定し、連通ネジ穴にネ
ジ62を螺着して、カバー体61が補強板３に取付けられて
いる。As shown in FIG. 2, the press-contact means 6, which is a feature of the present invention, has the wiring pattern (overlapping portion) 21 on the inner surface of the cover body 61 that is detachably attached to the reinforcing plate 3 with screws 62.
A protrusion 63 protruding in the direction is provided in a protruding manner, and an elastic resin layer 64 for pressure contact is integrally provided at the tip of the protrusion 63. The cover body 61 is a rectangular flat plate having a constant width and length, and is set to a size that covers the flexible substrate 4, the wiring pattern (conductor pattern of the IC 23) 21 and the IC 23. A screw hole (not shown) is formed through the bottom surface of the recessed portion 61a at substantially the center of the cover body 61, and the peripheral surface portion of the screw hole (bottom surface of the recessed portion 61a) is the flexible substrate (reinforcing plate 3) 4 The cover body 61 is attached to the reinforcing plate 3 by contacting the upper surface of the reinforcing plate 3 and communicating with a screw hole (not shown) of the reinforcing plate 3, and screwing a screw 62 into the communicating screw hole. There is.
上記圧接用弾性樹脂層（突子63）64は、カバー体61が補
強板（放熱板１を含む）３に対し螺着された状態におい
て、上記重合部、つまりプリント基板２、配線パターン
21及びフレキシブル基板４のそれぞれの端部の重合部の
ほぼ中央部上面に、近接状態で対応位置するように設定
されている。The pressure-bonding elastic resin layer (protruder 63) 64 is the overlapping portion, that is, the printed circuit board 2 and the wiring pattern when the cover body 61 is screwed to the reinforcing plate (including the heat dissipation plate 1) 3.
21 and the flexible substrate 4 are set so as to be positioned at the corresponding positions in the proximity state on the upper surface of the central portion of the overlapping portion at the respective end portions.
圧接用弾性樹脂層64は、突子63の先端部に対し耐熱性、
電気絶縁性に優れ、弾性（ゴム状）を有するシリコン系
樹脂（ケイ素樹脂）を印刷塗着成形、或いはディスペン
サによる吹きつけ塗着成形にて一定厚みに一体形成され
る。The elastic resin layer 64 for pressure contact is heat resistant to the tip of the protrusion 63,
Silicone resin (silicone resin) having excellent electric insulation and elasticity (rubber) is integrally formed to have a constant thickness by print coating or spray coating with a dispenser.
このような構成を有するサーマルヘッドでは、補強板３
にネジ62止めされたカバー体61の圧接用弾性樹脂層（突
子63を含む）64が、プリント基板２、配線パターン21及
びフレキシブル基板４の重合部に適対応位置している。
重合部を電気的に接続する場合、補強板３に螺着されて
いるネジ62を締めつけることで、突子（圧接用弾性樹脂
層64）63が降下し、先端の圧接用弾性樹脂層64が重合部
を押圧して、重合３層（プリント基板２、配線パターン
21及びフレキシブル基板４）を圧接し、電気的に接続す
る。つまり、外部回路に接続するコネクタ５がフレキシ
ブル基板４及び配線パターン21を介してプリント基板
（IC23、発熱ドット22）２と電気的に接続される。従っ
て、圧接用弾性樹脂層64は、カバー体61の内面より突出
する突子63の先端に一体形成されているから、従来のよ
うに穴部に対し棒状シリコンゴムを適嵌着する困難な生
産工数が省略でき、且つ穴部と棒状シリコンゴムの寸法
公差の適正化に神経を煩わされず、部品製造の自動化を
実現し得る。しかも、突子の先端部に対し圧接用弾性樹
脂層を成形するため、樹脂材料が小量で済み、且つ均等
圧接作用を発揮し得る。In the thermal head having such a configuration, the reinforcing plate 3
The elastic resin layer for pressure contact (including the protrusion 63) 64 of the cover body 61 fixed to the screw 62 is appropriately positioned at the overlapping portion of the printed board 2, the wiring pattern 21, and the flexible board 4.
When electrically connecting the overlapped portions, by tightening the screw 62 screwed to the reinforcing plate 3, the protrusion (the elastic resin layer 64 for pressure welding) 63 is lowered, and the elastic resin layer 64 for pressure welding at the tip ends. By pressing the overlapped portion, the overlapped three layers (printed circuit board 2, wiring pattern
21 and the flexible substrate 4) are pressure-welded and electrically connected. That is, the connector 5 connected to the external circuit is electrically connected to the printed circuit board (IC 23, heating dot 22) 2 via the flexible substrate 4 and the wiring pattern 21. Therefore, since the elastic resin layer 64 for pressure contact is integrally formed at the tip of the protrusion 63 protruding from the inner surface of the cover body 61, it is difficult to appropriately fit the rod-shaped silicone rubber into the hole as in the conventional case. The number of steps can be omitted, and the optimization of the dimensional tolerance between the hole and the rod-shaped silicon rubber is not bothered, and automation of component manufacturing can be realized. Moreover, since the elastic resin layer for pressure contact is formed on the tip portion of the protrusion, the resin material can be small in amount and the uniform pressure contact effect can be exhibited.
（ヘ）考案の効果 この考案では、以上のように、プリント基板、配線パタ
ーン及びフレキシブル基板の重合部に対応して配置され
たカバー体の内面に、重合部の中央部に適対応位置する
突子を設け、この突子の先端に圧接用弾性樹脂層を配備
し、圧接用弾性樹脂層により簡易且つ正確に重要部を押
圧圧接し、重合部を電気的に接続することが出来る。(F) Advantageous effect of the invention In this invention, as described above, the protrusion appropriately positioned at the central portion of the overlapping portion is provided on the inner surface of the cover body arranged corresponding to the overlapping portion of the printed circuit board, the wiring pattern and the flexible substrate. A child is provided, and an elastic resin layer for pressure contact is provided at the tip of this protrusion, and the important portion can be pressed and pressure-contacted easily and accurately by the elastic resin layer for pressure contact to electrically connect the overlapping portion.
圧接用弾性樹脂層は、カバー体の内面に突設した突子の
先端に一体に層体形成したから、従来のように穴部と棒
状シリコンゴムとの困難な嵌着作業が省略できる許かり
でなく、穴部と棒状シリコンゴムとの寸法公差に余分な
神経を使う必要がない。また、圧接用弾性樹脂層は突子
の先端に一体形成することとしたから、棒状シリコンゴ
ムに比し、高価なシリコン資材が小量で済み、しかも部
品の自動化が達成されるため、安価な製品を提供し得る
等、考案目的を達成した優れた効果を有する。Since the elastic resin layer for pressure contact is integrally formed on the tip of the protrusion protruding on the inner surface of the cover body, it is possible to omit the difficult fitting work between the hole and the rod-shaped silicone rubber as in the conventional case. Moreover, it is not necessary to use extra nerves in the dimensional tolerance between the hole and the rod-shaped silicone rubber. Further, since the elastic resin layer for pressure contact is integrally formed at the tip of the protrusion, a small amount of expensive silicon material is required as compared with the rod-shaped silicon rubber, and the automation of the parts is achieved, so that the cost is low. It has an excellent effect of achieving the object of the invention, such as being able to provide a product.
第１図は、実施例サーマルヘッドを示す側面図、第２図
は、実施例サーマルヘッドの圧接手段を示す要部拡大正
面図、第３図は、従来のサーマルヘッドを示す側面図で
ある。 1:放熱板、2:プリント基板、3:補強板、4:フレキシブル
基板、5:コネクタ、21:配線パターン、22:発熱ドット、
23:IC、61:カバー体、63:突子、64:圧接用弾性樹脂層。FIG. 1 is a side view showing a thermal head of an embodiment, FIG. 2 is an enlarged front view of an essential part showing a pressure contact means of the thermal head of the embodiment, and FIG. 3 is a side view showing a conventional thermal head. 1: Heat sink, 2: Printed circuit board, 3: Reinforcement board, 4: Flexible board, 5: Connector, 21: Wiring pattern, 22: Heating dot,
23: IC, 61: cover body, 63: protrusion, 64: elastic resin layer for pressure contact.
Claims (1)
リント基板を載置し、上記プリント基板の配線パターン
上に発熱ドットを形成すると共に、一端部が前記配線パ
ターンの端部に重合する外部回路接続用のフレキシブル
基板を配備し、前記プリント基板、配線パターン及びフ
レキシブル基板の重合部に対し圧接手段を備えたサーマ
ルヘッドにおいて、 前記圧接手段は、上記重合部へ突出する突子を突設し、
この突子の先端に圧接用弾性樹脂層を一体に配備したこ
とを特徴とするサーマルヘッド。1. A printed circuit board having a wiring pattern is placed on the upper surface of a heat dissipation plate, heating dots are formed on the printed circuit board wiring pattern, and one end of the printed circuit board is superposed on the end of the wiring pattern. In a thermal head provided with a flexible board for connecting an external circuit, the print head, the wiring pattern, and a thermal head having a press-contact means for overlapping portions of the flexible board, wherein the press-connecting means has a protrusion protruding to the overlap portion. Then
The thermal head is characterized in that an elastic resin layer for pressure welding is integrally provided at the tip of the protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12198187U JPH078208Y2 (en) | 1987-08-07 | 1987-08-07 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12198187U JPH078208Y2 (en) | 1987-08-07 | 1987-08-07 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6427246U JPS6427246U (en) | 1989-02-16 |
| JPH078208Y2 true JPH078208Y2 (en) | 1995-03-01 |
Family
ID=31369488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12198187U Expired - Lifetime JPH078208Y2 (en) | 1987-08-07 | 1987-08-07 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH078208Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7420282B2 (en) | 2004-10-18 | 2008-09-02 | Sharp Kabushiki Kaisha | Connection structure for connecting semiconductor element and wiring board, and semiconductor device |
-
1987
- 1987-08-07 JP JP12198187U patent/JPH078208Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6427246U (en) | 1989-02-16 |
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