JP2009295706A - Electronic controller - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic controller capable of preventing the connection defect of an electronic component provided with a heat generating element, and also improving heat radiation efficiency. <P>SOLUTION: The electronic component 30 provided with the heat generating element 31 and a heat sink 32 which urges the heat radiation of the heat generating element 31 is arranged so as to be abutted to the bottom wall 21a of the upper lid 21 of a metallic case body 20 on the heat radiation side 30b and abutted to the upper surface 40a of a substrate 40 on the counter heat radiation side 30c. Also, by tightening a bolt 24 inserted to the through-hole 41 of the substrate 40 to respective spacers 23, the bottom wall 21a of the casing 20 is pressed to the heat radiation side 30b of the electronic component 30, and the upper surface 40a of the substrate 40 is pressed to the counter heat radiation side 30c of the electronic component 30. Also, the electronic component 30 and the substrate 40 are electrically connected through a flexible substrate 50. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic control device having a heating element.

  Conventionally, for example, an electronic control device disclosed in Patent Document 1 is known as an electronic control device having a heating element. This electronic control device is configured such that a substrate on which a molded component obtained by molding an electronic component that generates heat and a heat radiating member is mounted is accommodated in a housing. Then, a heat conducting material having flexibility is pressed and brought into contact between the heat radiating member and the projecting portion formed on the housing, so that heat generated in the electronic component is externally transmitted through the heat radiating member and the housing. Dissipates heat.

In the electronic control device shown in Patent Document 2 below, an electronic component including a heating element is mounted on a substrate and accommodated in a housing. Then, the heat of the heat generating element is radiated through the heat conductive member and the housing by bringing the heat generating element and the substrate into contact with the case and cover of the housing through a flexible heat conductive member.
JP 2003-289191 A JP 2007-059608 A

  However, since the heat conduction material having flexibility has a lower thermal conductivity than metal or the like, when the heat of the heating element is radiated through the heat conduction material or the like, the case where heat is radiated by direct contact with the housing In comparison, the heat dissipation efficiency is deteriorated.

  On the other hand, when the heat generating element is directly pressed against the housing so as to eliminate the gap between the heat generating element and the housing and the heat of the heat generating element is transferred to the housing, the heat dissipation effect is improved, but the space between the heat generating element and the substrate is improved. Stress acts on the connecting part. If the stress acting on the connecting portion is increased, the connecting portion is broken or the like, resulting in poor connection.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic control device capable of preventing poor connection of an electronic component having a heating element and improving heat dissipation efficiency. It is in.

  In order to achieve the above object, in the electronic control device according to claim 1, an electronic component (30) having a heat generating element (31) and a heat dissipating member (32) that promotes heat dissipation of the heat generating element, A board (40) to which the electronic component is electrically connected, and a metal housing (20) for housing the electronic component and the board, wherein the heat dissipation member is disposed in the electronic component. The heat dissipating side (30b) is in contact with one side wall (21a) of the housing and the heat dissipating side (30c) opposite to the heat dissipating side is in contact with the substrate. An electronic control device (10) comprising: pressing means (23, 24, 26) for pressing the one side wall against the heat dissipation side of the electronic component and pressing the substrate against the heat dissipation side of the electronic component. The electronic component and the base But through a flexible substrate (50, 53) having flexibility and technical features to be electrically connected.

  In the electronic control device according to claim 4, the electronic component (70) having a heat generating element (31) and a heat dissipating member (32) for promoting heat dissipation of the heat generating element, and the electronic component comprising: A board (80) to be electrically connected; and a metal casing (60) for housing the electronic component and the board, wherein the electronic component is a side on which the heat radiating member is disposed. The side (70a) is close to the substrate and is disposed so as to abut on one side wall (61a) of the casing on the opposite side of the heat dissipation side (70b) opposite to the heat dissipation side. On the other side wall (62) opposed to the one side wall, a metal protrusion (through the opening (81) formed in the vicinity of the electronic component of the substrate and in contact with the heat dissipation side of the electronic component ( 63) is formed electronic control device (10a), And a pressing means (65, 66) for pressing the side wall against the heat dissipation side of the electronic component and pressing the protruding portion against the heat dissipation side of the electronic component, wherein the electronic component and the substrate are flexible. It is a technical feature that it is electrically connected through a flexible substrate (50) having the property.

  In the electronic control device according to claim 9, the first electronic component (100) and the first electronic component (100) each having a heat generating element (31) and a heat dissipating member (32) for promoting heat dissipation of the heat generating element are provided. Two electronic components (110), a substrate (120) to which the first electronic components and the second electronic components are electrically connected, the first electronic components, the second electronic components, and the A metal housing (90) for housing the substrate, wherein the first electronic component has one side wall (61a) on the heat radiation side (100a) on which the heat radiation member is disposed. ) And the heat dissipation side (100b) opposite to the heat dissipation side is arranged to contact one side surface (120a) of the substrate. Front side at the heat dissipating side (110a) It arrange | positions so that it may contact | abut to the other side surface (120b) of the said board | substrate in the anti-heat dissipation side (110b) opposite to this heat dissipation side while contacting the other side wall (91) facing the said one side wall of a housing | casing. An electronic control device (10b), wherein the one side wall is pressed against the heat dissipation side of the first electronic component and the other side wall is pressed against the heat dissipation side of the second electronic component ( 65, 66, 92, 93), and the first electronic component and the substrate are electrically connected via a flexible first flexible substrate (130), and the second electronic The technical feature is that the component and the substrate are electrically connected via a flexible second flexible substrate (140).

  Further, in the electronic control device according to claim 15, the plurality of electronic components (150, 160) each having a heat generating element (31) and a heat dissipating member (32) for promoting heat dissipation of the heat generating element, A substrate (170) to which the plurality of electronic components are electrically connected, and a metal casing (20) for housing the plurality of electronic components and the substrate, wherein the plurality of electronic components are The heat radiating side (150a, 160a) on which the heat radiating member is disposed is in contact with one side wall (21a) of the casing and is opposite to the heat radiating side (150b, 160b). The electronic control device (10c) is arranged so as to be in contact with the substrate respectively, and the one side wall is pressed against each heat radiation side of the plurality of electronic components, and the substrate is Pressing means (23, 24) for pressing each of the electronic components against the heat dissipation side, and the plurality of electronic components and the substrate are electrically connected via a flexible flexible substrate (180). This is a technical feature.

  According to the first aspect of the present invention, the electronic component having the heat generating element and the heat radiating member that promotes heat dissipation of the heat generating element comes into contact with one side wall of the metal casing on the heat radiating side where the heat radiating member is disposed. And it arrange | positions so that it may contact | abut to a board | substrate in the opposite heat dissipation side which is the opposite side to this heat dissipation side. Further, the pressing means presses one side wall of the housing against the heat radiating side of the electronic component and presses the substrate against the heat radiating side of the electronic component. The electronic component and the board are electrically connected via a flexible board having flexibility.

As described above, the electronic component is pressed by the pressing means in a state where the electronic component is in contact with one side wall of the metal housing on the heat dissipation side. Thereby, compared with the case where heat is radiated to the housing via the flexible heat conductive material, the heat of the electronic component can be directly radiated to the metal housing. Moreover, since the electronic component and the substrate are electrically connected via a flexible flexible substrate, even if the substrate is pressed against the electronic component by the pressing means, this pressing force is connected to the electronic component and the substrate. Does not act on the part. Thereby, the connection failure between the electronic component and board | substrate resulting from the pressing force for improving heat dissipation efficiency can be prevented.
Therefore, it is possible to prevent poor connection of an electronic component having a heat generating element and increase the heat dissipation efficiency.

  In the invention according to claim 2, the pressing means causes the one side wall to be pressed against the heat radiating side of the electronic component and the board to be pressed against the anti-heat radiating side of the electronic component by fastening the substrate to one side wall of the housing with a bolt or the like. ing. Thereby, the pressing force by a press means can be easily adjusted by adjusting the fastening force at the time of fastening.

  According to a third aspect of the present invention, the pressing means is configured such that the one side wall is placed on the heat radiation side of the electronic component by the elastic force of the first elastic member interposed between the other side wall facing the one side wall of the housing and the substrate. In addition to pressing, the substrate is pressed against the heat dissipating side of the electronic component. Thereby, the pressing force by the pressing means can be easily adjusted by adjusting the elastic force of the first elastic member.

  In the invention of claim 4, the electronic component having the heat generating element and the heat dissipating member that promotes heat dissipation of the heat generating element is close to the substrate on the heat dissipating side on which the heat dissipating member is disposed and opposite to the heat dissipating side. It arrange | positions so that it may contact | abut on the one side wall of a housing | casing in the non-heat dissipation side which is a side. Further, on the other side wall facing the one side wall of the housing, a metal protrusion is formed which is inserted through an opening formed in the vicinity of the electronic component of the substrate and abuts on the heat radiation side of the electronic component. Further, the pressing means presses one side wall of the housing against the heat radiating side of the electronic component and presses the protruding portion of the other side wall toward the heat radiating side of the electronic component. The electronic component and the board are electrically connected via a flexible board having flexibility.

  As described above, the electronic component is pressed by the pressing means in a state where the electronic component is in contact with the metal protrusion on the heat dissipation side. Thereby, compared with the case where heat is radiated to the housing via the heat conductive material having flexibility, the heat of the electronic component can be radiated to the housing via the metallic protrusion. Moreover, since the electronic component and the substrate are electrically connected via a flexible flexible substrate, even if the substrate is pressed against the electronic component by the pressing means, this pressing force is connected to the electronic component and the substrate. Does not act on the part. Thereby, the connection failure between the electronic component and board | substrate resulting from the pressing force for improving heat dissipation efficiency can be prevented.

  In the invention of claim 5, the pressing means presses the one side wall against the heat radiating side of the electronic component by fastening the one side wall and the other side wall of the housing via the second elastic member, and the protruding portion. Is pressed against the heat radiation side of the electronic component. Thereby, the pressing force by a press means can be easily adjusted by adjusting the fastening force which fastens one side wall and other side wall of a housing | casing, and the elastic force by a 2nd elastic member.

  According to the sixth aspect of the present invention, at least one of the housing and the substrate is provided with a protrusion that contacts the electronic component and restricts the movement of the electronic component in the direction perpendicular to the pressing direction by the pressing means.

  In order to prevent the pressing force by the pressing means from acting on the connection part between the electronic component and the substrate, the electronic component is not directly connected to the substrate. For this reason, the electronic component may be displaced in a direction along the substrate (a direction perpendicular to the pressing direction by the pressing means) with respect to the substrate. Therefore, the above-described shift of the electronic component is eliminated by providing a protrusion on at least one of the housing and the substrate that contacts the electronic component and restricts the movement of the electronic component in the direction perpendicular to the pressing direction by the pressing means. be able to.

  As described in the seventh aspect of the present invention, the above-described shift of the electronic component may be eliminated by adhering the anti-heat dissipating side of the electronic component and the portion contacting the anti-heat dissipating side with an adhesive.

  In the invention of claim 8, the flexible substrate is electrically connected to the substrate via a connector provided on the substrate. As a result, the electrical connection work between the flexible substrate and the substrate is facilitated, so that the assembly workability of the electronic control device can be improved.

  In the invention of claim 9, the first electronic component having the heat generating element and the heat radiating member for promoting heat dissipation of the heat generating element is a side wall of the metal housing on the heat radiating side, which is the side where the heat radiating member is disposed. And is disposed so as to contact one side surface of the substrate on the side opposite to the heat radiating side. Further, the second electronic component having the heat generating element and the heat dissipating member that promotes heat dissipation of the heat generating element comes into contact with the other side wall facing the one side wall of the housing on the heat dissipating side where the heat dissipating member is disposed. And it arrange | positions so that it may contact | abut on the other side surface of a board | substrate in the opposite heat dissipation side which is the opposite side to this heat dissipation side. The pressing means presses one side wall of the housing against the heat dissipation side of the first electronic component and presses the other side wall of the housing against the heat dissipation side of the second electronic component. In addition, the first electronic component and the substrate are electrically connected via a flexible first flexible substrate, and the second electronic component and the substrate are flexible second flexible. It is electrically connected through the substrate.

  As described above, the first electronic component and the second electronic component are pressed by the pressing means in a state where the first electronic component and the second electronic component are in contact with one side wall and the other side wall of the metal casing on the heat radiation side, respectively. Thereby, compared with the case where it heat-radiates to a housing | casing through the heat conductive material which has a softness | flexibility, the heat of both electronic components can be directly radiated | emitted to a metal housing | casing, respectively. Both electronic components and the substrate are electrically connected to each other through flexible first and second flexible substrates. For this reason, even if a board | substrate is pressed by both electronic components by a press means, this pressing force does not act on each connection part of both electronic components and a board | substrate. Thereby, the poor connection between both electronic components and a board | substrate resulting from the pressing force for improving heat dissipation efficiency can be prevented.

  In the invention of claim 10, the pressing means fastens the one side wall to the heat dissipation side of the first electronic component by fastening one side wall and the other side wall of the housing via the third elastic member, The other side wall is pressed against the heat dissipation side of the second electronic component. Thereby, the pressing force by a press means can be easily adjusted by adjusting the fastening force which fastens one side wall and other side wall of a housing | casing, and the elastic force by a 3rd elastic member.

  In the invention of claim 11, the pressing means fastens the one side wall and the other side wall of the housing via the third elastic member and fastens the substrate to the one side wall or the other side wall of the housing with a screw or the like. The one side wall is pressed against the heat dissipation side of the first electronic component, and the other side wall is pressed against the heat dissipation side of the second electronic component. As described above, in addition to the adjustment of the fastening force for fastening one side wall and the other side wall of the housing and the elastic force by the third elastic member, the fastening force for fastening the substrate to the one side wall or the other side wall of the housing is adjusted. By doing so, the pressing force by the pressing means can be adjusted with high accuracy.

  According to the invention of claim 12, at least one of the housing and the substrate is brought into contact with the first electronic component and the second electronic component and is pressed by the pressing means of the first electronic component and the second electronic component. Protrusions that restrict movement in the direction perpendicular to the pressing direction are provided. Thereby, similarly to the invention of claim 6 described above, it is possible to eliminate the shift between the first electronic component and the second electronic component.

  As described in the thirteenth aspect of the present invention, the anti-heat dissipating side of the first electronic component and the anti-heat dissipating side of the second electronic component and the portions that are in contact with both the anti-heat dissipating sides are bonded with an adhesive, respectively. The shift between the first electronic component and the second electronic component may be eliminated.

  In the invention of claim 14, the first flexible substrate and the second flexible substrate are electrically connected to the substrate via the first connector and the second connector provided on the substrate, respectively. As a result, the electrical connection work between the first flexible board and the second flexible board and the board is facilitated, so that the assembly workability of the electronic control device can be improved.

  In the invention of claim 15, the plurality of electronic components each having a heat generating element and a heat radiating member that promotes heat dissipation of the heat generating element are each a metal casing on the heat radiating side on which the heat radiating member is disposed. It is arranged so as to abut on the side wall and abut on the substrate on the side opposite to the heat dissipating side that is opposite to the heat dissipating side. Further, the pressing means presses one side wall of the housing against each heat radiation side of the plurality of electronic components, and presses the substrate against each heat radiation side of the plurality of electronic components. Further, the plurality of electronic components and the substrate are electrically connected via a flexible flexible substrate.

  In this way, the plurality of electronic components are pressed by the pressing means in a state where each electronic component is in contact with one side wall of the metal housing on each heat radiation side. Thereby, the heat of each electronic component can be directly radiated to the metal casing as compared with the case where heat is radiated to the casing via the heat conductive material having flexibility. Further, since each electronic component and the substrate are electrically connected via a flexible flexible substrate, even if the substrate is pressed against each electronic component by the pressing means, this pressing force is applied to each electronic component and each substrate. It does not act on each connection part of the board. Thereby, the connection failure between each electronic component and board | substrate resulting from the pressing force for improving heat dissipation efficiency can be prevented.

[First Embodiment]
Hereinafter, an electronic control device according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view illustrating a schematic configuration of an electronic control device 10 according to the first embodiment. FIG. 2 is a top view of the flexible substrate 50 in which the electronic component 30 and the substrate 40 are electrically connected.

  The electronic control unit 10 is, for example, an ECU (Electronic Control Unit) used for vehicle control, and as shown in FIG. 1, as shown in FIG. 1, a substantially rectangular parallelepiped box-shaped upper lid 21 and a flat plate-shaped lower lid 22. And the electronic component 30 and the substrate 40 accommodated in the case 20. The electronic component 30 and the substrate 40 are electrically connected via a flexible substrate 50 having flexibility and having a central portion opened. The electronic control device 10 is provided with an external terminal (not shown) that is electrically connected to the substrate 40. The electronic control device 10 is electrically connected to an external electronic control device or the like via the external terminal. It is configured to be connected to.

  Spacers 23 having screw holes for fastening the substrate 40 to the upper lid 21 are fixed to the four corners of the bottom wall 21a of the upper lid 21, respectively.

  The electronic component 30 includes a heating element 31 that generates heat when driving a power element, a heat sink 32 that promotes heat dissipation from the heating element 31, a plurality of wires 33 that are electrically connected to the heating element 31 by wire bonding, A plurality of leads 34 electrically connected to each wire 33, and a molding part 35 in which at least the heat generating element 31 and a connection region of each wire 33 are molded with a molding material are provided. Each lead 34 is formed by bending a portion protruding from the mold portion 35 in a direction away from the heat sink 32 (see FIG. 1).

  A plurality of lands for electrical connection to the flexible substrate 50 are formed on the upper surface 40 a of the substrate 40. Further, through holes 41 are formed at the four corners of the substrate 40 corresponding to the screw holes of the spacers 23, respectively.

  As shown in FIGS. 1 and 2, a square annular protrusion 42 is formed on the upper surface 40 a of the substrate 40 so as to protrude upward. The protrusion 42 plays a role of restricting movement of the electronic component 30 in the direction along the substrate 40 when the electronic component 30 is fitted and abutted on the side surface 30a. In addition, the protrusion 42 is composed of, for example, a plurality of substantially columnar protrusions, and each protrusion abuts on the side surface 30a of the electronic component 30 to restrict movement of the electronic component 30 in the direction along the substrate 40. May be.

  The assembly of the electronic control apparatus 10 according to the first embodiment configured as described above will be described with reference to FIGS. 1 and 2. First, the electronic component 30 and the substrate 40 are electrically connected via the flexible substrate 50 in a state where the electronic component 30 is disposed in the opening of the flexible substrate 50.

  Specifically, as shown in FIGS. 1 and 2, each lead 34 of the electronic component 30 and the corresponding land on the upper surface 50a of the flexible substrate 50 are electrically connected by, for example, solder 51 or the like, and the substrate Each land on the upper surface 40a of 40 is electrically connected to a corresponding land on the lower surface 50b of the flexible substrate 50 by, for example, solder 52 or the like. In addition, you may make it electrically connect each electrical connection part by the thermocompression-bonding process which apply | coats a solder paste to each electrical connection part, or ACF (Anisotropic Conductive Film) crimping process. In this case, connection at a low temperature is possible.

  At this time, the electronic component 30 abuts on the upper surface 40a of the substrate 40 on the anti-heat dissipating side 30c opposite to the side on which the heat sink 32 is disposed (hereinafter also referred to as the heat dissipating side 30b). Further, the protrusion 42 of the substrate 40 is fitted into and abuts on the side surface 30 a of the electronic component 30.

  Then, the bolts 24 inserted into the through holes 41 of the substrate 40 are fastened to the spacers 23 of the upper lid 21, respectively. Thereby, the electronic component 30 contacts the bottom wall 21a of the upper lid 21 of the housing 20 on the heat radiation side 30b.

  By further applying a fastening force from this contact state, the bottom wall 21a of the housing 20 is pressed against the heat radiation side 30b of the electronic component 30, and the upper surface 40a of the substrate 40 is pressed against the anti-heat radiation side 30c of the electronic component 30. The pressing force F is applied. Each spacer 23 and each bolt 24 correspond to an example of the “pressing means” described in claim 1 of the claims.

  At the time of the fastening, the height of the spacer 23 is set so that a predetermined gap is formed between the substrate 40 and each spacer 23. The pressing force F can be adjusted by adjusting the fastening force at the time of fastening so as to reduce the predetermined gap. The pressing force F may be adjusted by providing an elastic member such as rubber between the substrate 40 and each spacer 23.

  As described above, the upper lid 21 and the lower lid 22 in which the electronic component 30 and the substrate 40 are accommodated are fastened with the bolts 25, whereby the electronic control device 10 shown in FIG.

  As described above, in the electronic control apparatus 10 according to the first embodiment, the electronic component 30 including the heat generating element 31 and the heat sink 32 that promotes heat dissipation of the heat generating element 31 is made of a metal casing on the heat dissipation side 30b. The body 20 is disposed so as to be in contact with the bottom wall 21a of the upper lid 21 and to be in contact with the upper surface 40a of the substrate 40 on the heat dissipation side 30c. Further, by fastening the bolts 24 that pass through the through holes 41 of the substrate 40 to the spacers 23, the bottom wall 21a of the housing 20 is pressed against the heat radiation side 30b of the electronic component 30, and the upper surface 40a of the substrate 40 is The electronic component 30 is pressed against the heat radiating side 30c. Moreover, the electronic component 30 and the board | substrate 40 are electrically connected through the flexible board | substrate 50 which has flexibility.

As described above, the electronic component 30 is pressed in a state where the electronic component 30 is in contact with the bottom wall 21a of the metal housing 20 on the heat radiation side 30b. Thereby, the heat of the heating element 31 of the electronic component 30 can be directly radiated to the metal case 20 as compared with the case where heat is radiated to the case 20 via the heat conductive material having flexibility. Further, since the electronic component 30 and the substrate 40 are electrically connected via the flexible substrate 50, even if the substrate 40 is pressed against the electronic component 30 as described above, the pressing force F is applied to the electronic component 30 and the electronic component 30. It does not act on the connection part of the substrate 40. Thereby, the connection failure between the electronic component 30 and the board | substrate 40 resulting from the pressing force F for improving heat dissipation efficiency can be prevented.
Therefore, connection failure of the electronic component 30 having the heat generating element 31 can be prevented and heat dissipation efficiency can be increased.

  Further, in the electronic control apparatus 10 according to the first embodiment, the bolts 24 inserted into the through holes 41 of the substrate 40 are fastened to the spacers 23 of the upper lid 21, respectively, so that the bottom wall 21 a of the housing 20 is obtained. Is pressed against the heat dissipation side 30b of the electronic component 30 and the upper surface 40a of the substrate 40 is pressed against the non-heat dissipation side 30c of the electronic component 30. At the time of this fastening, a predetermined gap is provided between the substrate 40 and each spacer 23. Thereby, the said pressing force F can be adjusted easily by adjusting the fastening force at the time of fastening so that this predetermined clearance may be made small.

  Further, in the electronic control apparatus 10 according to the first embodiment, the upper surface 40a of the substrate 40 is in contact with the side surface 30a of the electronic component 30 and is along the substrate 40 of the electronic component 30 (perpendicular to the pressing direction). ) Is provided. Thereby, the shift | offset | difference of the electronic component 30 of the direction along the board | substrate 40 can be eliminated. The protrusion 42 may be provided on the bottom wall 21a of the housing 20 so as to eliminate the displacement of the electronic component 30 in a direction along the bottom wall 21a (a direction perpendicular to the pressing direction).

  Further, since the heat dissipation path of the electronic component 30 is the heat dissipation side 30b on which the heat sink 32 is disposed, the anti-heat dissipation side 30c of the electronic component 30 and the upper surface 40a of the substrate 40 in contact with the anti-heat dissipation side 30c are bonded, for example The above-described shift of the electronic component 30 may be eliminated by fixing by bonding with an agent or the like.

FIG. 3 is a cross-sectional view illustrating a schematic configuration of the electronic control device 10 according to the first modification of the first embodiment.
As a first modification of the electronic control apparatus 10 according to the first embodiment, as shown in FIG. 3, the substrate 40 is fastened by a bolt 24 a via a spacer 23 a provided on the lower lid 22 of the housing 20. An elastic member 26 such as rubber may be interposed between the lower lid 22 and the substrate 40. Accordingly, the pressing force F can be easily adjusted by adjusting the elastic force of the elastic member 26.

FIG. 4 is a cross-sectional view illustrating a schematic configuration of the electronic control device 10 according to the second modification of the first embodiment. FIG. 5 is a top view of the flexible substrate 53 in which the electronic component 30 and the substrate 40 are electrically connected.
As a second modification of the electronic control apparatus 10 according to the first embodiment, as shown in FIGS. 4 and 5, a flexible substrate 53 having a connector 54 is employed instead of the flexible substrate 50 described above. The flexible substrate 53 and the substrate 40 may be electrically connected by connecting the connector 54 to the connector 43 provided on the substrate 40.

  Thereby, the electrical connection work between the flexible substrate 53 and the substrate 40 becomes easy, so that the assembly workability of the electronic control device 10 can be improved.

[Second Embodiment]
Next, an electronic control device according to a second embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view illustrating a schematic configuration of the electronic control device 10a according to the second embodiment.

  As shown in FIG. 6, the electronic control device 10 a according to the second embodiment includes a metal casing 60, an electronic component 70 and a substrate 80 accommodated in the casing 60. The housing 60 includes a substantially rectangular box-shaped upper lid 61 whose bottom surface is opened, and a lower lid 62 formed so that the protruding portion 63 protrudes from the center. A plurality of pedestals 64 having a stepped portion 64 a for supporting the substrate 80 are formed on the lower lid 62.

  The electronic component 70 is different from the electronic component 30 described above in that the portion of each lead 34 protruding from the mold portion 35 is bent in a direction approaching the heat sink 32. The substrate 80 is different from the substrate 40 described above in that an opening 81 is formed in the vicinity of the electronic component 70.

  The assembly of the electronic control apparatus 10a according to the second embodiment configured as described above will be described with reference to FIG. First, the electronic component 70 and the board | substrate 80 are electrically connected through the flexible substrate 50 similarly to the said 1st Embodiment.

  At this time, the electronic component 70 is close to the opening 81 of the substrate 80 on the side where the heat sink 32 is disposed (hereinafter also referred to as the heat dissipation side 70a).

  The protruding portion 63 of the lower lid 62 is brought into contact with the heat radiation side 70a of the electronic component 70 in a state where the opening 81 of the substrate 80 is inserted, and the peripheral edge of the substrate 80 is set to the stepped portion of each pedestal 64 of the lower lid 62. 64a.

Next, by assembling the upper lid 61 to the lower lid 62, the electronic component 70 comes into contact with the bottom wall 61a of the upper lid 61 on the non-radiating side 70b opposite to the radiating side 70a. And the bottom wall 61a of the housing | casing 60 is pressed by the anti-heat-dissipation side 70b of the electronic component 70 by fastening the lower cover 62 and the upper cover 61 with the volt | bolt 66 via the ring-shaped elastic members 65, such as rubber | gum. A pressing force F is applied to press the protrusion 63 of the housing 60 against the heat radiation side 70 a of the electronic component 70. The ring-shaped elastic member 65 and the bolt 66 correspond to an example of the “pressing means” described in claim 4 of the claims.
Thereby, the electronic control apparatus 10a shown in FIG. 6 is completed.

  As described above, in the electronic control device 10a according to the second embodiment, the electronic component 70 is close to the substrate 80 on the heat dissipation side 70a and contacts the bottom wall 61a of the housing 60 on the anti-heat dissipation side 70b. It is arranged to touch. In addition, the lower cover 62 of the housing 60 is formed with a metal protrusion 63 that is inserted through an opening 81 formed in the vicinity of the electronic component 70 of the substrate 80 and contacts the heat radiation side 70 a of the electronic component 70. Yes. Further, by fastening the lower lid 62 and the upper lid 61 with the bolt 66 via the ring-shaped elastic member 65, the bottom wall 61a of the housing 60 is pressed against the non-heat dissipating side 70b of the electronic component 70, and the protruding portion 63 is pressed against the heat radiation side 70 a of the electronic component 70. In addition, the electronic component 70 and the substrate 80 are electrically connected via the flexible substrate 50.

  In this way, the electronic component 70 is pressed in a state where the electronic component 70 is in contact with the metal protrusion 63 on the heat dissipation side 70a. Thereby, the heat of the heat generating element 31 of the electronic component 70 is radiated to the housing 60 through the metal protrusion 63 as compared with the case where heat is radiated to the housing 60 through the heat conductive material having flexibility. be able to. Further, since the electronic component 70 and the substrate 80 are electrically connected via the flexible substrate 50, even if the substrate 80 is pressed against the electronic component 70 as described above, the pressing force F is applied to the electronic component 70 and the substrate 80. It does not act on the connection part of the substrate 80. Thereby, the connection failure between the electronic component 70 and the board | substrate 80 resulting from the pressing force F for improving heat dissipation efficiency can be prevented.

  Further, in the electronic control device 10a according to the second embodiment, the upper lid 61 and the lower lid 62 of the housing 60 are fastened by the bolt 66 via the ring-shaped elastic member 65, whereby the bottom wall 61a of the upper lid 61 is obtained. Is pressed against the heat radiating side 70 b of the electronic component 70, and the protrusion 63 is pressed against the heat radiating side 70 a of the electronic component 70. Thereby, the said pressing force F can be adjusted easily by adjusting the fastening force which fastens the upper cover 61 and the lower cover 62 of the housing | casing 60, and the elastic force by the ring-shaped elastic member 65. FIG.

  As in the first embodiment described above, a square annular protrusion 42 is provided on the bottom wall 61a of the housing 60 so as to fit and abut on the electronic component 70, and along the substrate 80 of the electronic component 70. The movement in the direction (the direction perpendicular to the pressing direction) may be restricted. Thereby, the shift | offset | difference of the electronic component 70 can be eliminated similarly to 1st Embodiment mentioned above.

  Further, the above-described deviation of the electronic component 70 may be eliminated by adhering the anti-heat dissipating side 70b of the electronic component 70 and the bottom wall 61a of the housing 60 in contact with the anti-heat dissipating side 70b with an adhesive.

  Further, similarly to the second modification of the first embodiment described above, the flexible substrate 53 having the connector 54 is employed, and the connector 54 is connected to the connector 43 provided on the substrate 80 to thereby The substrate 80 may be electrically connected.

  As a result, the electrical connection work between the flexible substrate 53 and the substrate 80 becomes easy, so that the assembly workability of the electronic control device 10a can be improved.

[Third Embodiment]
Next, an electronic control unit according to a third embodiment of the present invention will be described with reference to FIG. FIG. 7 is a cross-sectional view illustrating a schematic configuration of an electronic control device 10b according to the third embodiment.

  As shown in FIG. 7, the electronic control device 10 b according to the third embodiment includes a metal housing 90, the first electronic component 100, the second electronic component 110, and the substrate 120 housed in the housing 90. And. The first electronic component 100 and the substrate 120 are electrically connected via a first flexible substrate 130 having an opening at the center, and the second electronic component 110 and the substrate 120 are connected to a second flexible substrate 140 having an opening at the center. Is electrically connected.

  The housing 90 is different from the housing 60 described in the second embodiment in that a flat plate-like lower lid 91 is used instead of the lower lid 62 on which the protruding portion 63 is formed. The first electronic component 100 and the second electronic component 110 have the same structure as the electronic component 30 described in the first embodiment.

  The assembly of the electronic control apparatus 10b according to the third embodiment configured as described above will be described with reference to FIG. First, in a state where the first electronic component 100 is disposed in the opening of the first flexible substrate 130, the first electronic component 100 and the substrate 120 are electrically connected via the first flexible substrate 130. Further, the second electronic component 110 and the substrate 120 are electrically connected via the second flexible substrate 140 in a state where the second electronic component 110 is disposed in the opening of the second flexible substrate 140.

  At this time, the first electronic component 100 abuts on the upper surface 120a of the substrate 120 on the anti-heat dissipating side 100b opposite to the side where the heat sink 32 is disposed (hereinafter also referred to as the heat dissipating side 100a). The second electronic component 110 abuts on the lower surface 120b of the substrate 120 on the anti-heat dissipating side 110b opposite to the side on which the heat sink 32 is disposed (hereinafter also referred to as the heat dissipating side 110a).

  Then, the periphery of the substrate 120 is locked to the stepped portion 64 a of each pedestal 64 provided on the lower lid 91 of the housing 90. As a result, the second electronic component 110 contacts the lower lid 91 on the heat dissipation side 110a.

Next, by assembling the upper lid 61 to the lower lid 91, the first electronic component 100 comes into contact with the bottom wall 61a of the upper lid 61 on the heat radiating side 100a, and the second electronic component 110 is placed on the lower lid 91 on the heat radiating side 110a. Abut. Then, by fastening the lower lid 91 and the upper lid 61 with the bolt 66 via the ring-shaped elastic member 65, the bottom wall 61a of the casing 90 is pressed against the heat dissipation side 100a of the first electronic component 100, and the casing A pressing force F is applied to press the lower lid 91 of the body 90 against the heat dissipation side 110a of the second electronic component 110. The ring-shaped elastic member 65 and the bolt 66 correspond to an example of “pressing means” according to claim 9 of the claims.
Thereby, the electronic control apparatus 10b shown in FIG. 7 is completed.

  As described above, in the electronic control apparatus 10b according to the third embodiment, the first electronic component 100 contacts the bottom wall 61a of the housing 90 on the heat dissipation side 100a and the substrate 120 on the anti-heat dissipation side 100b. It arrange | positions so that it may contact | abut to the upper surface 120a. The second electronic component 110 is disposed so as to contact the lower lid 91 of the housing 90 on the heat radiating side 110a and to contact the lower surface 120b of the substrate 120 on the non-heat radiating side 110b. Further, by fastening the lower lid 91 and the upper lid 61 with the bolt 66 via the ring-shaped elastic member 65, the bottom wall 61a of the casing 90 is pressed against the heat dissipation side 100a of the first electronic component 100, and the casing The lower lid 91 of the body 90 is pressed against the heat dissipation side 110a of the second electronic component 110. The first electronic component 100 and the substrate 120 are electrically connected via the first flexible substrate 130, and the second electronic component 110 and the substrate 120 are electrically connected via the second flexible substrate 140. Has been.

  Thus, the 1st electronic component 100 and the 2nd electronic component 110 are pressed in the state which contact | abutted to the bottom wall 61a and the lower cover 91 of the metal housing | casing 90 by the thermal radiation side 100a, 110a, respectively. Thereby, the heat of both the electronic components 100 and 110 can be directly radiated to the metal casing 90 as compared with the case where the heat is radiated to the casing via the flexible heat conduction material. The electronic components 100 and 110 and the board 120 are electrically connected via the first and second flexible boards 130 and 140, respectively. For this reason, even if the board | substrate 120 is pressed by both the electronic components 100 and 110 as mentioned above, this pressing force F does not act on each connection part of both the electronic components 100 and 110 and the board | substrate 120. FIG. Thereby, the poor connection between both the electronic components 100 and 110 and the board | substrate 120 resulting from the pressing force F for improving heat dissipation efficiency can be prevented.

  Further, in the electronic control device 10b according to the third embodiment, the bottom wall 61a of the upper lid 61 is secured by fastening the lower lid 91 and the upper lid 61 of the housing 90 with the bolt 66 via the ring-shaped elastic member 65. While being pressed by the heat dissipation side 100 a of the first electronic component 100, the lower lid 91 is pressed by the heat dissipation side 110 a of the second electronic component 110. Thereby, the said pressing force F can be adjusted easily by adjusting the fastening force which fastens the upper cover 61 and the lower cover 91 of the housing | casing 90, and the elastic force by the ring-shaped elastic member 65. FIG.

  As in the first embodiment described above, the quadrangular annular protrusions 42 are provided on the upper surface 120a and the lower surface 120b of the substrate 120 so as to fit and contact the first electronic component 100 and the second electronic component 110, respectively. Thus, the movement of the electronic components 100 and 110 in the direction along the substrate 120 (the direction perpendicular to the pressing direction) may be restricted. Thereby, the shift | offset | difference of the 1st electronic component 100 and the 2nd electronic component 110 can be eliminated similarly to 1st Embodiment mentioned above.

  The anti-heat dissipating side 100b of the first electronic component 100 and the upper surface 120a of the substrate 120 in contact with the anti-heat dissipating side 100b are bonded with an adhesive, and the anti-heat dissipating side 110b of the second electronic component 110 and the anti-heat dissipating side The first electronic component 100 and the second electronic component 110 described above may be eliminated by adhering the lower surface 120b of the substrate 120 in contact with 110b with an adhesive.

  Similarly to the second modification of the first embodiment described above, the first flexible substrate 130 is electrically connected to the substrate 120 via a connector provided on the upper surface 120a of the substrate 120, and the second flexible substrate 130 The substrate 140 may be electrically connected to the substrate 120 through a connector provided on the lower surface 120b of the substrate 120.

  As a result, the electrical connection work between the flexible boards 130 and 140 and the board 120 is facilitated, so that the assembly workability of the electronic control device 10b can be improved.

FIG. 8 is a cross-sectional view illustrating a schematic configuration of an electronic control device 10b according to a modification of the third embodiment.
As a modification of the electronic control device 10b according to the third embodiment, as shown in FIG. 8, each base 64 of the housing 90 is abolished, and the substrate 120 is bolted via each spacer 92 provided on the upper lid 61. The upper lid 61 may be fastened and fixed by 93.

  Thereby, in addition to the adjustment of the fastening force for fastening the upper lid 61 and the lower lid 91 of the housing 90 and the elastic force by the ring-shaped elastic member 65, by adjusting the fastening force for fastening the substrate 120 to the upper lid 61, The pressing force F can be adjusted with high accuracy.

[Fourth Embodiment]
Next, an electronic control unit according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a cross-sectional view illustrating a schematic configuration of an electronic control device 10c according to the fourth embodiment.

  As shown in FIG. 9, an electronic control device 10 c according to the fourth embodiment includes a metal casing 20 described in the first embodiment and a first electronic component 150 accommodated in the casing 20. The second electronic component 160 and the substrate 170 are provided. Both electronic components 150 and 160 and the substrate 170 are electrically connected via a flexible substrate 180 having two openings. Here, the first electronic component 150 and the second electronic component 160 have the same structure as the electronic component 30 described in the first embodiment.

  The assembly of the electronic control apparatus 10c according to the fourth embodiment configured as described above will be described with reference to FIG. First, in a state where the first electronic component 150 and the second electronic component 160 are respectively disposed in the openings of the flexible substrate 180, the first electronic component 150, the second electronic component 160, and the substrate 170 are interposed via the flexible substrate 180. Connect electrically.

  At this time, the first electronic component 150 abuts on the upper surface 170a of the substrate 170 on the anti-heat dissipating side 150b opposite to the side where the heat sink 32 is disposed (hereinafter also referred to as the heat dissipating side 150a). The second electronic component 160 abuts on the upper surface 170a of the substrate 170 on the anti-heat dissipating side 160b opposite to the side on which the heat sink 32 is disposed (hereinafter also referred to as the heat dissipating side 160a).

  Then, the bolts 24 inserted into the through holes 41 formed at the four corners of the substrate 170 are respectively fastened to the spacers 23 of the upper lid 21. As a result, the first electronic component 150 contacts the bottom wall 21a of the upper lid 21 of the housing 20 on the heat dissipation side 150a, and the second electronic component 160 contacts the bottom of the upper lid 21 of the housing 20 on the heat dissipation side 160a. It contacts the wall 21a.

  By further applying a fastening force from this contact state, a pressing force F is applied to press the bottom wall 21a of the housing 20 against the heat radiation side 150a of the first electronic component 150 and the heat radiation side 160a of the second electronic component 160. . The spacers 23 and the bolts 24 correspond to an example of “pressing means” according to claim 15 of the claims.

  As described above, the upper lid 21 and the lower lid 22 in which the first electronic component 150, the second electronic component 160, and the substrate 170 are accommodated are fastened with the bolts 25, thereby completing the electronic control device 10c shown in FIG.

  As described above, in the electronic control apparatus 10c according to the fourth embodiment, the first electronic component 150 and the second electronic component 160 are respectively attached to the bottom wall 21a of the housing 20 at the heat dissipation side 150a and the heat dissipation side 160a. In addition to being in contact with each other, they are disposed so as to be in contact with the upper surface 170a of the substrate 170 on the heat dissipation side 150b and the heat dissipation side 160b. Further, the bolts 24 that pass through the through holes 41 provided at the four corners of the substrate 170 are fastened to the spacers 23, so that the bottom wall 21 a of the housing 20 has the heat dissipation side 150 a of the first electronic component 150 and the second electronic component 160. The upper surface 170a of the substrate 170 is pressed against the anti-heat dissipating side 150b of the first electronic component 150 and the anti-heat dissipating side 160b of the second electronic component 160. The first electronic component 150 and the second electronic component 160 and the substrate 170 are electrically connected via a flexible flexible substrate 180.

  Thus, the 1st electronic component 150 and the 2nd electronic component 160 are pressed in the state which contact | abutted to the bottom wall 21a of the metal housing | casing 20 at the thermal radiation side 150a and the thermal radiation side 160a, respectively. As a result, the heat of the first electronic component 150 and the second electronic component 160 is directly radiated to the metal housing 20 as compared with the case where heat is radiated to the housing via a flexible heat conductive material. Can do. The electronic components 150 and 160 and the substrate 170 are electrically connected via the flexible substrate 180. For this reason, even if the substrate 170 is pressed against both the electronic components 150 and 160 as described above, the pressing force F does not act on the connection portions of the both electronic components 150 and 160 and the substrate 170. Thereby, the poor connection between the electronic components 150 and 160 and the substrate 170 due to the pressing force F for improving the heat radiation efficiency can be prevented.

  In the fourth embodiment, not only the two electronic components 150 and 160 but also three or more electronic components may be accommodated in the housing 20 in a state of being pressed against the bottom wall 21a.

The present invention is not limited to the above embodiments, and may be embodied as follows. Even in this case, the same operations and effects as those of the above embodiments can be obtained.
(1) In the said 1st Embodiment, the spacer 23 and the through-hole 41 of the board | substrate 40 are not restricted to each being formed in four places, You may provide four or more. The same applies to other embodiments.

(2) In the first embodiment, the housing 20 is not limited to the upper lid 21 having a substantially rectangular parallelepiped box shape and the lower lid 22 having a flat plate shape whose lower surface is opened, and both directions facing the electronic component 30 are provided. Any shape that has one side wall and another side wall that can be pressed from the other side is acceptable. The same applies to other embodiments.

It is sectional drawing which shows the structure outline | summary of the electronic control apparatus which concerns on this 1st Embodiment. It is a top view of the flexible substrate to which the electronic component and the substrate are electrically connected. It is sectional drawing which shows the structure outline | summary of the electronic controller in the 1st modification of 1st Embodiment. It is sectional drawing which shows the structure outline | summary of the electronic controller in the 2nd modification of 1st Embodiment. It is a top view of the flexible substrate to which the electronic component and the substrate are electrically connected. It is sectional drawing which shows the structure outline | summary of the electronic controller which concerns on 2nd Embodiment. It is sectional drawing which shows the structure outline | summary of the electronic control apparatus which concerns on 3rd Embodiment. It is sectional drawing which shows the structure outline | summary of the electronic controller in the modification of 3rd Embodiment. It is sectional drawing which shows the structure outline | summary of the electronic control apparatus which concerns on 4th Embodiment.

Explanation of symbols

10, 10a, 10b, 10c ... Electronic control device 20, 60, 90 ... Housing 21, 61 ... Upper lid 21a, 61a ... Bottom wall (one side wall)
22, 62, 91 ... Lower lid (other side wall)
23, 92 ... spacer (pressing means)
24, 93 ... bolt (pressing means)
26: Elastic member (pressing means)
30, 70 ... Electronic components 30b, 70a, 100a, 110a, 150a, 160a ... Heat radiation side 30c, 70b, 100b, 110b, 150b, 160b ... Anti-heat radiation side 31 ... Heating element 32 ... Heat sink (heat radiation member)
40, 80, 120, 170 ... substrate 42 ... projection 43, 54 ... connector 50, 53, 180 ... flexible substrate 63 ... projection 65 ... ring-shaped elastic member (pressing means)
66 ... bolt (pressing means)
81 ... Opening portion 100,150 ... First electronic component 110,160 ... Second electronic component 120a ... Upper surface (one side surface)
120b ... lower surface (other side surface)
130: First flexible substrate 140: Second flexible substrate F: Pressing force

Claims (15)

An electronic component having a heat generating element and a heat dissipating member for promoting heat dissipation of the heat generating element;
A substrate to which the electronic component is electrically connected;
A metal housing for housing the electronic component and the substrate;
With
The electronic component is in contact with one side wall of the housing on the heat radiating side where the heat radiating member is disposed, and is in contact with the substrate on the opposite heat radiating side opposite to the heat radiating side. An electronic control unit arranged,
A pressing means for pressing the one side wall against the heat dissipation side of the electronic component and pressing the substrate against the heat dissipation side of the electronic component;
The electronic control device, wherein the electronic component and the substrate are electrically connected via a flexible flexible substrate.   The pressing means fastens the one side wall against the heat dissipation side of the electronic component and presses the substrate against the anti-heat dissipation side of the electronic component by fastening the substrate to the one side wall of the casing. The electronic control device according to claim 1.   The pressing means moves the one side wall to the heat dissipation side of the electronic component by the elastic force of the first elastic member interposed between the substrate and the other side wall facing the one side wall of the housing. The electronic control device according to claim 1, wherein the electronic control device presses the substrate against the heat dissipation side of the electronic component. An electronic component having a heat generating element and a heat dissipating member for promoting heat dissipation of the heat generating element;
A substrate to which the electronic component is electrically connected;
A metal housing for housing the electronic component and the substrate;
With
The electronic component is close to the substrate on the heat dissipating side where the heat dissipating member is disposed, and is in contact with one side wall of the housing on the opposite side to the heat dissipating side. Arranged,
On the other side wall of the housing facing the one side wall, a metal protrusion is formed which is inserted through an opening formed in the vicinity of the electronic component of the substrate and contacts the heat dissipation side of the electronic component. An electronic control device,
Pressing means for pressing the one side wall against the heat dissipation side of the electronic component and pressing the protruding portion against the heat dissipation side of the electronic component;
The electronic control device, wherein the electronic component and the substrate are electrically connected via a flexible flexible substrate.   The pressing means presses the one side wall against the heat dissipation side of the electronic component by fastening the one side wall and the other side wall of the housing via a second elastic member, and the protrusion The electronic control device according to claim 4, wherein a portion is pressed against the heat radiation side of the electronic component.   The projection is provided on at least one of the casing and the substrate to contact the electronic component and restrict the movement of the electronic component in a direction perpendicular to the pressing direction of the pressing unit. The electronic control apparatus as described in any one of 1-5.   The electronic control device according to claim 1, wherein the anti-heat dissipating side of the electronic component is bonded to a portion in contact with the anti-heat dissipating side with an adhesive.   The electronic control device according to claim 1, wherein the flexible substrate is electrically connected to the substrate via a connector provided on the substrate. A first electronic component and a second electronic component each having a heat generating element and a heat dissipating member for promoting heat dissipation of the heat generating element;
A substrate to which the first electronic component and the second electronic component are electrically connected;
A metal housing for housing the first electronic component, the second electronic component, and the substrate;
With
The first electronic component is in contact with one side wall of the housing on the heat radiating side on which the heat radiating member is disposed, and on one side of the substrate on the opposite side to the heat radiating side. Arranged to contact the side,
The second electronic component is in contact with the other side wall facing the one side wall of the housing on the heat radiating side on which the heat radiating member is disposed, and on the opposite side to the heat radiating side. An electronic control device arranged to contact the other side of the substrate at
A pressing means for pressing the one side wall against the heat dissipation side of the first electronic component and pressing the other side wall against the heat dissipation side of the second electronic component;
The first electronic component and the substrate are electrically connected via a flexible first flexible substrate, and the second electronic component and the substrate are flexible. An electronic control device, wherein the electronic control device is electrically connected via a substrate.   The pressing means presses the one side wall against the heat dissipation side of the first electronic component by fastening the one side wall and the other side wall of the housing via a third elastic member, and The electronic control device according to claim 9, wherein the other side wall is pressed against the heat dissipation side of the second electronic component.   The pressing means fastens the one side wall and the other side wall of the casing via a third elastic member and fastens the substrate to the one side wall or the other side wall of the casing, thereby The electronic control device according to claim 9, wherein one side wall is pressed against the heat dissipation side of the first electronic component, and the other side wall is pressed against the heat dissipation side of the second electronic component.   At least one of the housing and the substrate is in contact with the first electronic component and the second electronic component and is pressed by the pressing means of the first electronic component and the second electronic component. The electronic control device according to claim 9, further comprising a protrusion that restricts movement in a vertical direction with respect to the head.   12. The anti-heat dissipating side of the first electronic component and the anti-heat dissipating side of the second electronic component and the portions that are in contact with both anti-heat dissipating sides are respectively bonded with an adhesive. The electronic control device according to any one of the above.   The first flexible substrate and the second flexible substrate are electrically connected to the substrate via a first connector and a second connector provided on the substrate, respectively. The electronic control apparatus as described in any one of -13. A plurality of electronic components each having a heating element and a heat radiating member for promoting heat dissipation of the heating element;
A substrate to which each of the plurality of electronic components is electrically connected;
A metal housing for housing the plurality of electronic components and the substrate;
With
The plurality of electronic components are respectively in contact with one side wall of the housing on the heat radiating side on which the heat radiating member is arranged and on the substrate on the opposite heat radiating side opposite to the heat radiating side. An electronic control device arranged to abut,
Pressing means for causing the one side wall to be pressed against each of the heat dissipation sides of the plurality of electronic components and pressing the substrate against each of the heat dissipation sides of the plurality of electronic components;
The electronic control device, wherein the plurality of electronic components and the substrate are electrically connected via a flexible flexible substrate.

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