JP2020031122A - Semiconductor device and manufacturing method thereof - Google Patents

Semiconductor device and manufacturing method thereof Download PDF

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JP2020031122A
JP2020031122A JP2018155376A JP2018155376A JP2020031122A JP 2020031122 A JP2020031122 A JP 2020031122A JP 2018155376 A JP2018155376 A JP 2018155376A JP 2018155376 A JP2018155376 A JP 2018155376A JP 2020031122 A JP2020031122 A JP 2020031122A
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pressing
main
arrangement
heat
generating component
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雅昭 長谷川
Masaaki Hasegawa
雅昭 長谷川
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新電元工業株式会社
Shindengen Electric Mfg Co Ltd
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Abstract

To reduce the size of a semiconductor device.SOLUTION: A semiconductor device includes a heat dissipating member 2 having an arrangement surface 2a, a heat generating component 3 having a main body 21 disposed on the disposing surface 2a of the heat dissipating member 2 and a lead 22 protruding from the main body 21, and a pressing member 4 that presses the main body 21 of the heat generating component 3 against the arrangement surface 2a so as to be fixed to the heat dissipating member 2, and the pressing member 4 is made of a resin material having electrical insulation.SELECTED DRAWING: Figure 2

Description

この発明は、半導体装置、及び、半導体装置の製造方法に関する。   The present invention relates to a semiconductor device and a method for manufacturing a semiconductor device.
従来、通電により発熱する発熱部品の熱を高い効率で放熱するために、放熱部材上に発熱部品を配した上で、放熱部材に固定される押付部材(板バネ)の弾性力によって発熱部品を放熱部材に押し付けた半導体装置がある。
特許文献1には、発熱部品と押付部材との電気的な絶縁を図るために、発熱部品と押付部材との間に絶縁部材を配した半導体装置が開示されている。また、特許文献1には、絶縁部材の外縁の一部を放熱部材に形成された段差(側壁)に接触させる構成、及び、発熱部品のリード(配線部材)を絶縁部材に形成された貫通孔に通した構成が開示されている。これらの構成により、特許文献1の半導体装置では、発熱部品が放熱部材や絶縁部材に対して位置ずれすることを抑えている。
Conventionally, in order to radiate heat of a heat-generating component that generates heat by energization with high efficiency, a heat-generating component is arranged on a heat-dissipating member, and the heat-generating component is pressed by an elastic force of a pressing member (leaf spring) fixed to the heat-dissipating member. There is a semiconductor device pressed against a heat dissipation member.
Patent Literature 1 discloses a semiconductor device in which an insulating member is disposed between a heat-generating component and a pressing member in order to electrically insulate the heat-generating component from the pressing member. Patent Document 1 discloses a configuration in which a part of the outer edge of an insulating member is brought into contact with a step (side wall) formed in a heat radiating member, and a through hole formed in a lead (wiring member) of a heat generating component in the insulating member. Is disclosed. With these configurations, in the semiconductor device of Patent Literature 1, displacement of the heat-generating component with respect to the heat-radiating member and the insulating member is suppressed.
特開2017−183338号公報JP 2017-183338 A
しかしながら、従来の半導体装置では、押付部材が金属製であり、放熱部材と導通する。このため、発熱部品のリードと押付部材とが電気的に短絡しないように、発熱部品のリードを押付部材から離して位置させる必要がある。この場合、放熱部材における発熱部品及び押付部材の配置領域が大きくなり、半導体装置の小型化を阻害する、という問題がある。   However, in the conventional semiconductor device, the pressing member is made of metal and is electrically connected to the heat radiating member. Therefore, it is necessary to position the lead of the heat-generating component away from the press member so that the lead of the heat-generating component and the pressing member are not electrically short-circuited. In this case, there is a problem that the arrangement area of the heat-generating component and the pressing member in the heat-radiating member becomes large, which hinders miniaturization of the semiconductor device.
本発明は、上述した事情に鑑みたものであって、小型化を図ることができる半導体装置、及び、半導体装置の製造方法を提供することを目的とする。   The present invention has been made in view of the above circumstances, and has as its object to provide a semiconductor device which can be reduced in size and a method for manufacturing the semiconductor device.
本発明の一態様は、配置面を有する放熱部材と、前記配置面に配される本体部及び前記本体部から突出するリードを有する発熱部品と、前記放熱部材に固定されることで前記本体部を前記配置面に押し付ける押付部材と、を備え、前記押付部材が、電気的な絶縁性を有する樹脂材料からなる半導体装置である。   One embodiment of the present invention is a heat radiating member having an arrangement surface, a heat generating component having a main body disposed on the arrangement surface and a lead protruding from the main body, and the main body being fixed to the heat radiating member. And a pressing member for pressing the pressing member against the arrangement surface, wherein the pressing member is made of a resin material having electrical insulation.
また、本発明の一態様は、前記半導体装置を製造する半導体装置の製造方法であって、前記発熱部品の複数の前記リードを前記押付部材に形成された複数のリード挿通孔に個別に挿通させることで、前記発熱部品を前記押付部材に取り付ける取付工程と、前記取付工程の後に、前記押付部材を前記放熱部材に固定する固定工程と、を備える半導体装置の製造方法である。   One embodiment of the present invention is a method for manufacturing a semiconductor device for manufacturing the semiconductor device, wherein the plurality of leads of the heat-generating component are individually inserted into a plurality of lead insertion holes formed in the pressing member. Thus, there is provided a method of manufacturing a semiconductor device, comprising: a mounting step of mounting the heat generating component to the pressing member; and a fixing step of fixing the pressing member to the heat radiating member after the mounting step.
本発明によれば、押付部材が絶縁性を有する樹脂材料であるため、リードが押付部材の近くに位置していても、リードと放熱部材との電気的な絶縁性を確保できる。リードを押付部材の近くに配置できることで、配置面における発熱部品及び押付部材の配置領域を小さくすることができる。したがって、半導体装置の小型化を図ることができる。   According to the present invention, since the pressing member is a resin material having an insulating property, electrical insulation between the lead and the heat radiating member can be ensured even when the lead is located near the pressing member. Since the lead can be arranged near the pressing member, the area where the heat-generating component and the pressing member are arranged on the arrangement surface can be reduced. Therefore, the size of the semiconductor device can be reduced.
本発明の一実施形態に係る半導体装置を示す平面図である。1 is a plan view illustrating a semiconductor device according to an embodiment of the present invention. 図1のII−II矢視断面図である。FIG. 2 is a sectional view taken along the line II-II in FIG. 1. 図1のIII−III矢視断面図である。FIG. 3 is a sectional view taken along the line III-III in FIG. 1. 図1のIV−IV矢視断面図である。FIG. 4 is a sectional view taken along the line IV-IV in FIG. 1. 図1〜4の半導体装置に備える押付部材を反対面側から見た斜視図である。FIG. 5 is a perspective view of a pressing member included in the semiconductor device of FIGS. 図1〜4の半導体装置に備える押付部材を対向面側から見た斜視図である。FIG. 5 is a perspective view of a pressing member included in the semiconductor device of FIGS. 図1〜4の半導体装置に備える押付部材の押付部を示す拡大断面図である。FIG. 5 is an enlarged sectional view showing a pressing portion of a pressing member provided in the semiconductor device of FIGS. 図1〜4の半導体装置において、同一の発熱部品のリードを押付部材のリード挿通孔に挿通させた状態を示す断面図である。FIG. 5 is a cross-sectional view showing a state in which leads of the same heat-generating component are inserted into lead insertion holes of a pressing member in the semiconductor device of FIGS. 図1〜4の半導体装置において、発熱部品を押付部材に取り付けた状態を示す斜視図である。FIG. 5 is a perspective view showing a state in which a heat-generating component is attached to a pressing member in the semiconductor device of FIGS. 図1〜4の半導体装置を、放熱部材と、発熱部品及び押付部材と、回路基板とに分解した状態を示す分解斜視図である。FIG. 5 is an exploded perspective view showing a state in which the semiconductor device of FIGS. 1 to 4 is disassembled into a heat radiating member, a heat generating component and a pressing member, and a circuit board. 押付部材を配置面に固定する際の押付部の動きを示す断面図である。It is sectional drawing which shows the movement of the pressing part at the time of fixing a pressing member to an arrangement surface.
以下、図1〜11を参照して本発明の一実施形態について説明する。
図1〜4に示すように、本実施形態に係る半導体装置1は、放熱部材2と、発熱部品3と、押付部材4と、を備える。また、本実施形態の半導体装置1は、回路基板5を備える。
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 to 4, the semiconductor device 1 according to the present embodiment includes a heat radiating member 2, a heat generating component 3, and a pressing member 4. Further, the semiconductor device 1 of the present embodiment includes a circuit board 5.
放熱部材2は、発熱部品3や押付部材4が配される配置面2aを有する。配置面2aは、平坦な面に形成されている。放熱部材2は、例えば平板状に形成されてよい。本実施形態の放熱部材2は、配置面2aを含む底壁部11と、配置面2aの周縁から底壁部11の厚さ方向(Z軸正方向)に延びる筒状の周壁部12と、を備える。すなわち、放熱部材2は配置面2aを底面とし、配置面2aの上方に開口する箱状に形成されている。箱状の放熱部材2には、発熱部品3や押付部材4、回路基板5等が収容される。放熱部材2は、任意の材料によって構成されてよいが、本実施形態では熱伝導率が高い材料(例えばアルミニウムなど)によって構成されている。   The heat radiating member 2 has an arrangement surface 2a on which the heat generating component 3 and the pressing member 4 are arranged. The arrangement surface 2a is formed as a flat surface. The heat radiation member 2 may be formed, for example, in a flat plate shape. The heat dissipating member 2 of the present embodiment includes a bottom wall portion 11 including the arrangement surface 2a, a cylindrical peripheral wall portion 12 extending from the periphery of the arrangement surface 2a in the thickness direction of the bottom wall portion 11 (positive Z-axis direction), Is provided. That is, the heat dissipating member 2 is formed in a box shape having the arrangement surface 2a as a bottom surface and opening above the arrangement surface 2a. The heat-generating component 3, the pressing member 4, the circuit board 5, and the like are accommodated in the box-shaped heat radiating member 2. The heat radiating member 2 may be made of any material, but in this embodiment, is made of a material having a high thermal conductivity (for example, aluminum).
図1,10に示すように、本実施形態の放熱部材2には、係止部13が形成されている。係止部13は、放熱部材2の配置面2aに配された押付部材4に引っ掛かることで、押付部材4を配置面2aにおいて位置決めする。係止部13は、例えば配置面2aから窪んで形成される凹部であってよいが、本実施形態では配置面2aから突出する突起である。係止部13は、複数形成されている。複数の係止部13は、互いに間隔をあけて配されている。   As shown in FIGS. 1 and 10, a locking portion 13 is formed on the heat radiation member 2 of the present embodiment. The locking portion 13 positions the pressing member 4 on the arrangement surface 2a by being hooked on the pressing member 4 arranged on the arrangement surface 2a of the heat radiation member 2. The locking portion 13 may be, for example, a concave portion formed to be depressed from the arrangement surface 2a, but in the present embodiment, is a projection protruding from the arrangement surface 2a. A plurality of locking portions 13 are formed. The plurality of locking portions 13 are arranged at intervals from each other.
発熱部品3は、通電により発熱する部品である。図1〜4,9に示すように、発熱部品3は、放熱部材2の配置面2aに配される本体部21と、本体部21から突出するリード22と、を備える。   The heat-generating component 3 is a component that generates heat when energized. As shown in FIGS. 1 to 4 and 9, the heat generating component 3 includes a main body 21 disposed on the arrangement surface 2 a of the heat radiating member 2 and a lead 22 protruding from the main body 21.
本体部21は、通電によって主に発熱する部分であり、所定の容積を有する塊である。本体部21は、主な熱源である半導体素子(不図示)と、半導体素子を封止する樹脂23と、を備える。半導体素子は、例えばトランジスタやダイオード等であってよい。半導体素子の電極は、リード22に接続される。樹脂23は、電気絶縁性を有する。樹脂23は任意の形状に形成されてよいが、本実施形態では直方体状に形成されている。これにより、樹脂23の平坦な面23a(以下、本体部21の下面23aと呼ぶ。)を放熱部材2の配置面2aに対向させた状態で、本体部21を配置面2aに配することができる。
本実施形態の本体部21は、放熱用の金属部24をさらに備える。金属部24は、例えば樹脂23の表面に露出しなくてもよいが、本実施形態では樹脂23の下面23aに露出する。また、金属部24は、樹脂23から樹脂23の下面23aに沿う方向に突出している。図示例において、金属部24の突出部分にはこれを貫通する孔25が形成されているが、これに限ることはない。
The main body 21 is a portion that mainly generates heat when energized, and is a lump having a predetermined volume. The main body 21 includes a semiconductor element (not shown) that is a main heat source, and a resin 23 that seals the semiconductor element. The semiconductor element may be, for example, a transistor or a diode. The electrodes of the semiconductor element are connected to the leads 22. The resin 23 has an electrical insulating property. The resin 23 may be formed in any shape, but is formed in a rectangular parallelepiped shape in the present embodiment. Accordingly, the main body 21 can be arranged on the arrangement surface 2a with the flat surface 23a of the resin 23 (hereinafter, referred to as the lower surface 23a of the main body 21) facing the arrangement surface 2a of the heat radiation member 2. it can.
The main body 21 of the present embodiment further includes a metal part 24 for heat radiation. The metal portion 24 may not be exposed on the surface of the resin 23, for example, but is exposed on the lower surface 23a of the resin 23 in the present embodiment. The metal portion 24 protrudes from the resin 23 in a direction along the lower surface 23 a of the resin 23. In the illustrated example, the protruding portion of the metal portion 24 is formed with the hole 25 penetrating therethrough, but the present invention is not limited to this.
金属部24が樹脂23の下面23aに露出しない場合、本体部21は、例えば放熱部材2の配置面2aに直接接触してよい。本実施形態では、金属部24が樹脂23の下面23aに露出するため、本体部21は、電気的な絶縁性を有する絶縁シート6を介して放熱部材2の配置面2aに配される。絶縁シート6は、熱伝導率の高い材料で構成されるとよい。   When the metal part 24 is not exposed on the lower surface 23a of the resin 23, the main body part 21 may directly contact the arrangement surface 2a of the heat radiation member 2, for example. In this embodiment, since the metal part 24 is exposed on the lower surface 23a of the resin 23, the main body part 21 is disposed on the arrangement surface 2a of the heat radiation member 2 via the insulating sheet 6 having electrical insulation. The insulating sheet 6 is preferably made of a material having high thermal conductivity.
発熱部品3のリード22は、本体部21からその下面23aに沿う方向に突出している。具体的に、リード22は本体部21の下面23aに沿って前述した金属部24と逆向きに突出している。リード22は、本体部21を放熱部材2の配置面2aに配した状態で放熱部材2の配置面2aに対して電気的に絶縁されるように間隔をあけて位置する。リード22は、その長手方向の中途部において折り曲げられる。これにより、リード22の突出方向の先端部は、放熱部材2の配置面2aから離れる方向に延びる。リード22の先端部は、後述する回路基板5に接続される。   The lead 22 of the heat generating component 3 protrudes from the main body 21 in a direction along the lower surface 23a. Specifically, the lead 22 projects along the lower surface 23a of the main body 21 in the direction opposite to the above-described metal part 24. The leads 22 are spaced from each other so as to be electrically insulated from the arrangement surface 2a of the heat radiation member 2 in a state where the main body 21 is arranged on the arrangement surface 2a of the heat radiation member 2. The lead 22 is bent at an intermediate portion in the longitudinal direction. As a result, the leading end of the lead 22 in the protruding direction extends in a direction away from the arrangement surface 2 a of the heat radiation member 2. The tips of the leads 22 are connected to a circuit board 5 described later.
図8,9に示すように、本実施形態の発熱部品3は、複数(図示例では三つ)のリード22を備える。複数のリード22は、本体部21から同じ方向に突出している。また、複数のリード22は、本体部21の下面23aに沿ってリード22の突出方向に直交する方向(X軸方向)に互いに間隔をあけて配列される。   As shown in FIGS. 8 and 9, the heat generating component 3 of the present embodiment includes a plurality (three in the illustrated example) of leads 22. The plurality of leads 22 project from the main body 21 in the same direction. The plurality of leads 22 are arranged at intervals along the lower surface 23a of the main body 21 in a direction (X-axis direction) orthogonal to the direction in which the leads 22 protrude.
図1,9に示すように、本実施形態の半導体装置1は、上記した発熱部品3を複数備える。複数の発熱部品3は、少なくとも放熱部材2の配置面2aにおいて互いに間隔をあけて配されればよい。複数の発熱部品3は、例えば放熱部材2の配置面2aに沿う一方向に一列に並べられてもよい。本実施形態において、複数の発熱部品3は、放熱部材2の配置面2aに沿う第一方向(X軸方向)に並べて配列した発熱部品群26を二つ構成している。二つの発熱部品群26は、配置面2aに沿って第一方向に直交する第二方向(Y軸方向)に間隔をあけて並んでいる。同一の発熱部品群26を構成する発熱部品3の数は、任意であってよいが、本実施形態では五つである。   As shown in FIGS. 1 and 9, the semiconductor device 1 of the present embodiment includes a plurality of the heat generating components 3 described above. The plurality of heat generating components 3 may be arranged at least on the arrangement surface 2a of the heat radiating member 2 with an interval therebetween. The plurality of heat generating components 3 may be arranged in a line in one direction along the arrangement surface 2a of the heat radiation member 2, for example. In the present embodiment, the plurality of heat generating components 3 constitute two heat generating component groups 26 arranged side by side in the first direction (X-axis direction) along the arrangement surface 2a of the heat radiating member 2. The two heat generating component groups 26 are arranged at intervals in a second direction (Y-axis direction) orthogonal to the first direction along the arrangement surface 2a. The number of heat generating components 3 constituting the same heat generating component group 26 may be arbitrary, but is five in the present embodiment.
図1〜4に示すように、押付部材4は、放熱部材2に固定されることで本体部21を配置面2aに押し付ける。押付部材4は、電気的な絶縁性を有する樹脂材料からなる。押付部材4を構成する樹脂材料は、任意であってよいが、弾性変形可能な材料であることが好ましい。また、押付部材4を構成する樹脂材料は、温度変化に対して弾性率の変化が小さい材料(弾性率の温度依存が小さい材料)であることがより好ましい。このような樹脂材料としては、例えばポリカーボネート(PC)などが挙げられる。   As shown in FIGS. 1 to 4, the pressing member 4 presses the main body 21 against the arrangement surface 2 a by being fixed to the heat radiation member 2. The pressing member 4 is made of an electrically insulating resin material. The resin material forming the pressing member 4 may be any resin material, but is preferably an elastically deformable material. Further, it is more preferable that the resin material forming the pressing member 4 is a material having a small change in elastic modulus with respect to a change in temperature (a material having a small temperature dependence of the elastic modulus). Examples of such a resin material include polycarbonate (PC).
図1〜7に示すように、本実施形態の押付部材4は、部材本体31と、押付部32と、を備える。
部材本体31は、放熱部材2の配置面2aに固定される部位である。部材本体31は、接着など任意の手法によって放熱部材2の配置面2aに固定されてよい。本実施形態の部材本体31は、ねじ止めによって放熱部材2に対して着脱可能に固定される。具体的に、部材本体31には、ねじ7の軸部を挿通させるねじ挿通孔33が形成されている。部材本体31は、ねじ7の軸部をねじ挿通孔33に通した上で、放熱部材2に形成されて配置面2aに開口する雌ねじ14に噛み合わせることで、放熱部材2の配置面2aとねじ7の頭部との間に挟み込まれる。これにより、部材本体31を放熱部材2に固定できる。
As shown in FIGS. 1 to 7, the pressing member 4 of the present embodiment includes a member main body 31 and a pressing portion 32.
The member main body 31 is a portion fixed to the arrangement surface 2a of the heat radiation member 2. The member main body 31 may be fixed to the arrangement surface 2a of the heat radiation member 2 by an arbitrary method such as bonding. The member main body 31 of the present embodiment is detachably fixed to the heat radiating member 2 by screwing. Specifically, the member main body 31 is formed with a screw insertion hole 33 through which the shaft of the screw 7 is inserted. The member main body 31 is provided with the female screw 14 formed in the heat radiating member 2 and opened in the mounting surface 2a after the shaft portion of the screw 7 is passed through the screw insertion hole 33, and thereby the mounting surface 2a of the heat radiating member 2 It is sandwiched between the head of the screw 7. Thereby, the member main body 31 can be fixed to the heat radiation member 2.
部材本体31は、部材本体31を放熱部材2の配置面2aに配した状態で配置面2aに対向して接触する対向面31aを有する。また、部材本体31は、対向面31aと反対側に向く反対面31bを有する。本実施形態において、反対面31bは対向面31aと平行する。以下の説明では、部材本体31の対向面31aと反対面31bとが並ぶ方向(Z軸方向)を、部材本体31の厚さ方向と呼ぶことがある。
部材本体31には、その反対面31bから窪む収容凹部(凹部)34が形成されている。収容凹部34は、例えば部材本体31の対向面31aに開口するように部材本体31の厚さ方向に貫通してもよいし、しなくてもよい。
The member main body 31 has an opposing surface 31a that opposes and contacts the arrangement surface 2a in a state where the member main body 31 is arranged on the arrangement surface 2a of the heat radiation member 2. The member main body 31 has an opposite surface 31b facing the opposite side to the opposite surface 31a. In the present embodiment, the opposite surface 31b is parallel to the opposite surface 31a. In the following description, the direction in which the opposing surface 31a and the opposite surface 31b of the member main body 31 are aligned (Z-axis direction) may be referred to as the thickness direction of the member main body 31.
An accommodating recess (recess) 34 is formed in the member body 31 from the opposite surface 31b. The housing recess 34 may or may not penetrate in the thickness direction of the member main body 31 so as to open on the facing surface 31a of the member main body 31, for example.
また、図1,5,6に示すように、部材本体31には、放熱部材2の係止部13(図1,10参照)に引っ掛かる被係止部35が形成されている。被係止部35は、例えば部材本体31の対向面31aから突出する突起であってよいが、本実施形態では、部材本体31の対向面31aから窪んで形成され、突起である係止部13を挿入する凹部である。被係止部35は複数形成されている。複数の被係止部35は、互いに間隔をあけて配される。部材本体31を放熱部材2の配置面2aに配した状態では、放熱部材2の複数の係止部13が複数の被係止部35に個別に挿入される。これにより、押付部材4を放熱部材2の配置面2aにおいて位置決めすることができる。   As shown in FIGS. 1, 5, and 6, the member main body 31 is formed with a locked portion 35 which is hooked on the locking portion 13 of the heat radiating member 2 (see FIGS. 1 and 10). The locked portion 35 may be, for example, a protrusion protruding from the facing surface 31a of the member main body 31. In the present embodiment, the locked portion 35 is formed to be recessed from the facing surface 31a of the member main body 31, and is a protrusion. Is a concave portion into which a. A plurality of locked parts 35 are formed. The plurality of locked parts 35 are arranged at intervals from each other. When the member main body 31 is arranged on the arrangement surface 2a of the heat radiating member 2, the plurality of locking portions 13 of the heat radiating member 2 are individually inserted into the plurality of locked portions 35. Thereby, the pressing member 4 can be positioned on the arrangement surface 2a of the heat radiation member 2.
また、図2,5,7に示すように、部材本体31には、後述する回路基板5を押付部材4に対して位置決めする複数の基板位置決め部36が形成されている。各基板位置決め部36は、部材本体31の反対面31bから部材本体31の厚さ方向に突出する。基板位置決め部36は、回路基板5を支持する支持部37と、回路基板5を案内する案内部38と、を有する。支持部37は、部材本体31の反対面31bよりも高く位置して回路基板5を支持する支持面37aを有する。案内部38は、支持面37aから部材本体31の厚さ方向に延びる棒状に形成されている。案内部38は、回路基板5に挿通することで回路基板5を部材本体31上の所定位置に案内する。複数の基板位置決め部36は、反対面31bに沿う方向おいて互いに間隔をあけて位置する。基板位置決め部36の数は、任意であってよいが、本実施形態では二つである。   As shown in FIGS. 2, 5, and 7, the member main body 31 is formed with a plurality of board positioning portions 36 for positioning a circuit board 5 described below with respect to the pressing member 4. Each board positioning portion 36 protrudes from the opposite surface 31 b of the member main body 31 in the thickness direction of the member main body 31. The board positioning section 36 has a support section 37 for supporting the circuit board 5 and a guide section 38 for guiding the circuit board 5. The support portion 37 has a support surface 37 a that is higher than the opposite surface 31 b of the member body 31 and supports the circuit board 5. The guide portion 38 is formed in a rod shape extending in the thickness direction of the member main body 31 from the support surface 37a. The guide portion 38 guides the circuit board 5 to a predetermined position on the member main body 31 by being inserted into the circuit board 5. The plurality of substrate positioning parts 36 are spaced apart from each other in a direction along the opposite surface 31b. The number of the substrate positioning portions 36 may be arbitrary, but is two in the present embodiment.
部材本体31の具体的な形状は任意であってよい。本実施形態の部材本体31は、図1,5,6に示すように、第一方向(X軸方向)に延びる辺を長辺とし、第二方向(Y軸方向)に延びる辺を短辺とする平面視長方形の板状に形成されている。   The specific shape of the member main body 31 may be arbitrary. As shown in FIGS. 1, 5, and 6, the member body 31 of the present embodiment has a long side extending in the first direction (X-axis direction) and a short side extending in the second direction (Y-axis direction). It is formed in a rectangular plate shape in plan view.
図5〜7に示すように、部材本体31のねじ挿通孔33は、部材本体31をその厚さ方向に貫通して形成されている。ねじ挿通孔33は、第一方向に間隔をあけて複数(図示例では三つ)配列されている。複数のねじ挿通孔33は、等間隔に配列されている。具体的に、三つのねじ挿通孔33は、第一方向における部材本体31の中間及び両端に位置する。
ねじ挿通孔33は、ねじ7の頭部を収容するように形成されている。このため、部材本体31を放熱部材2に対してねじ止めによって固定した状態において、ねじ挿通孔33に取り付けたねじ7の頭部が、部材本体31の反対面31bから突出することはない。
As shown in FIGS. 5 to 7, the screw insertion hole 33 of the member main body 31 is formed to penetrate the member main body 31 in the thickness direction. A plurality (three in the illustrated example) of screw insertion holes 33 are arranged at intervals in the first direction. The plurality of screw insertion holes 33 are arranged at equal intervals. Specifically, the three screw insertion holes 33 are located at the middle and both ends of the member main body 31 in the first direction.
The screw insertion hole 33 is formed to accommodate the head of the screw 7. For this reason, when the member main body 31 is fixed to the heat radiating member 2 by screwing, the head of the screw 7 attached to the screw insertion hole 33 does not project from the opposite surface 31b of the member main body 31.
部材本体31の収容凹部34は、部材本体31と同様に、部材本体31の反対面31b側から見た平面視で、第一方向に延びる辺を長辺とし、第二方向に延びる辺を短辺とする長方形に形成されている。収容凹部34は、第一方向において部材本体31の両端に位置する二つのねじ挿通孔33の間に位置する。このため、第一方向において部材本体31の中間に位置するねじ挿通孔33は、収容凹部34の底面に開口する。   Similarly to the member main body 31, the accommodation recess 34 of the member main body 31 has a side extending in the first direction as a long side and a side extending in the second direction as a short side in plan view as viewed from the opposite surface 31b side of the member main body 31. It is formed in a rectangular shape having sides. The accommodation recess 34 is located between the two screw insertion holes 33 located at both ends of the member main body 31 in the first direction. For this reason, the screw insertion hole 33 located in the middle of the member main body 31 in the first direction opens on the bottom surface of the accommodation recess 34.
図1,3,5,6に示すように、部材本体31には、部材本体31の厚さ方向に貫通する貫通孔39が形成されている。本実施形態の貫通孔39は、ねじ挿通孔33に干渉しない範囲で、平面視した収容凹部34の一部領域に形成されている。具体的に、貫通孔39は、平面視した収容凹部34の領域のうち、部材本体31の両端に位置するねじ挿通孔33と部材本体31の中間に位置するねじ挿通孔33との各間に位置する二つの領域に一つずつ形成されている。すなわち、部材本体31には、第一方向に並ぶ二つの貫通孔39が形成されている。   As shown in FIGS. 1, 3, 5, and 6, a through hole 39 is formed in the member main body 31 so as to penetrate the member main body 31 in the thickness direction. The through-hole 39 of the present embodiment is formed in a partial area of the accommodation recess 34 in a plan view within a range that does not interfere with the screw insertion hole 33. Specifically, the through hole 39 is formed between the screw insertion holes 33 located at both ends of the member main body 31 and the screw insertion holes 33 positioned at the middle of the member main body 31 in the area of the accommodation recess 34 viewed in a plan view. One is formed in each of two located regions. That is, the member main body 31 has two through holes 39 arranged in the first direction.
部材本体31の厚みは、例えば収容凹部34及び貫通孔39の形成領域を除いて一定であってよい。本実施形態では、図2〜7に示すように、部材本体31の第二方向の両端部42,43(第一端部42、第二端部43)の厚みが、第二方向の両端部42,43の間に位置する部材本体31の主要部41の厚みよりも小さい。部材本体31の第二方向の両端部42,43は、少なくとも部材本体31の主要部41の対向面31aから部材本体31の厚さ方向に離れて位置すればよい。本実施形態において、部材本体31の第二方向の両端部42,43は、部材本体31の主要部41と共に部材本体31の反対面31bを形成するように、厚さ方向において部材本体31の反対面31b側の端部に寄せて位置する。これにより、押付部材4を放熱部材2の配置面2aに配した状態では、部材本体31の第二方向の両端部42,43を、配置面2aから離れて位置させることができる。
本実施形態において、前述した収容凹部34や貫通孔39は、部材本体31の主要部41に形成されている。また、貫通孔39は、部材本体31の主要部41のうち、部材本体31の第二方向の両端部42,43よりも対向面31a側に位置する部位において、主要部41の第二方向の両端にも開口している。
The thickness of the member main body 31 may be constant, for example, except for a region where the accommodation recess 34 and the through hole 39 are formed. In the present embodiment, as shown in FIGS. 2 to 7, the thickness of both ends 42, 43 (first end 42, second end 43) of the member main body 31 in the second direction is equal to the both ends in the second direction. It is smaller than the thickness of the main part 41 of the member main body 31 located between 42 and 43. Both ends 42 and 43 in the second direction of the member main body 31 may be located at least in the thickness direction of the member main body 31 from the facing surface 31a of the main part 41 of the member main body 31. In the present embodiment, both end portions 42 and 43 in the second direction of the member main body 31 are opposite to the member main body 31 in the thickness direction so as to form the opposite surface 31 b of the member main body 31 together with the main portion 41 of the member main body 31. It is located close to the end on the surface 31b side. Thus, in a state where the pressing member 4 is arranged on the arrangement surface 2a of the heat radiation member 2, both end portions 42 and 43 of the member main body 31 in the second direction can be located away from the arrangement surface 2a.
In the present embodiment, the above-described recess 34 and the through hole 39 are formed in the main portion 41 of the member main body 31. In addition, the through hole 39 is formed in the main portion 41 of the main body 41 in the second direction of the main portion 41 at a position closer to the facing surface 31a than the both ends 42 and 43 of the main body 31 in the second direction. It is open at both ends.
図2〜7に示すように、押付部32は、部材本体31に対して弾性的に撓み変形可能に接続される。押付部32は、放熱部材2の配置面2aに配された発熱部品3の本体部21に重ねて配される。押付部32は、部材本体31が放熱部材2の配置面2aに固定されることで、弾性的に撓み変形して本体部21を配置面2aに押し付ける。   As shown in FIGS. 2 to 7, the pressing portion 32 is connected to the member main body 31 so as to be elastically deformable. The pressing portion 32 is arranged so as to overlap with the main body 21 of the heat generating component 3 arranged on the arrangement surface 2 a of the heat radiation member 2. When the member main body 31 is fixed to the arrangement surface 2a of the heat radiation member 2, the pressing portion 32 elastically bends and deforms to press the main body 21 against the arrangement surface 2a.
押付部32は、部材本体31の対向面31aに沿う方向に向く部材本体31の側部から突出する。押付部32の突出方向は、例えば部材本体31の対向面31aに沿う方向に一致してよい。本実施形態における押付部32の突出方向は、その突出方向の基端から先端に向かうにしたがって、部材本体31の厚さ方向において部材本体31の対向面31aに近づく方向となっている(特に図7参照)。   The pressing portion 32 protrudes from a side portion of the member main body 31 that faces in a direction along the facing surface 31a of the member main body 31. The projecting direction of the pressing portion 32 may coincide with, for example, a direction along the facing surface 31a of the member main body 31. The protruding direction of the pressing portion 32 in the present embodiment is a direction approaching the opposing surface 31a of the member main body 31 in the thickness direction of the member main body 31 from the base end to the distal end in the protruding direction (particularly in FIG. 7).
部材本体31の厚さ方向における押付部32の厚みは、部材本体31(特に主要部41)の厚みよりも小さい。これにより、押付部32は、部材本体31との接続部分を中心に、部材本体31の厚さ方向に弾性的に撓み変形することができる。図7において、二点鎖線で示す押付部32は、押付部32が弾性的に撓み変形した状態を示している。
また、押付部32は、部材本体31の対向面31aから部材本体31の厚さ方向に離れて位置する。本実施形態において、押付部32は、部材本体31の厚さ方向において部材本体31の反対面31b側の端部に寄せて位置する。これにより、押付部材4を放熱部材2の配置面2aに配した状態では、押付部32を配置面2aから離れて位置させることができる。
The thickness of the pressing portion 32 in the thickness direction of the member main body 31 is smaller than the thickness of the member main body 31 (particularly, the main portion 41). Thereby, the pressing portion 32 can be elastically deformed in the thickness direction of the member main body 31 around the connection portion with the member main body 31. In FIG. 7, a pressing portion 32 indicated by a two-dot chain line shows a state where the pressing portion 32 is elastically bent and deformed.
The pressing portion 32 is located away from the facing surface 31 a of the member main body 31 in the thickness direction of the member main body 31. In the present embodiment, the pressing portion 32 is positioned close to the end of the member main body 31 on the side opposite to the surface 31b in the thickness direction of the member main body 31. Thus, in a state where the pressing member 4 is disposed on the arrangement surface 2a of the heat radiation member 2, the pressing portion 32 can be positioned away from the arrangement surface 2a.
押付部32は、例えば同一の部材本体31に対して一つだけ設けられてよい。本実施形態では、図1〜6に示すように、複数の押付部32が同一の部材本体31に対して設けられる。複数の押付部32は、放熱部材2の配置面2aに配された複数の発熱部品3の本体部21に各々重ねて配される。複数の押付部32は、部材本体31が放熱部材2の配置面2aに固定されることで、それぞれ弾性的に撓み変形して複数の本体部21を配置面2aに押し付ける。
部材本体31の厚さ方向における押付部32の厚みは、例えば複数の押付部32の間で等しくてもよいが、本実施形態では複数の押付部32の間で異なっている。なお、押付部32の厚みは、押付部32が弾性的に撓む方向、発熱部品3の本体部21に対して押付部32が重なる方向に対応する押付部32の寸法である。
For example, only one pressing portion 32 may be provided for the same member main body 31. In the present embodiment, as shown in FIGS. 1 to 6, a plurality of pressing portions 32 are provided for the same member main body 31. The plurality of pressing portions 32 are arranged so as to overlap with the main body portions 21 of the plurality of heat generating components 3 arranged on the arrangement surface 2 a of the heat radiation member 2. When the member main body 31 is fixed to the arrangement surface 2a of the heat radiating member 2, each of the plurality of pressing portions 32 elastically bends and deforms and presses the plurality of main bodies 21 to the arrangement surface 2a.
The thickness of the pressing portion 32 in the thickness direction of the member main body 31 may be equal between the plurality of pressing portions 32, for example, but is different between the plurality of pressing portions 32 in the present embodiment. The thickness of the pressing portion 32 is a dimension of the pressing portion 32 corresponding to a direction in which the pressing portion 32 elastically bends and a direction in which the pressing portion 32 overlaps the main body 21 of the heat generating component 3.
具体的に、各押付部32は、部材本体31の側部をなす第一端部42や第二端部43から主に第二方向に突出する。部材本体31の第一端部42や第二端部43は、押付部32と同様に部材本体31の主要部41よりも薄く形成されている。このため、部材本体31の第一端部42や第二端部43は、例えば押付部32と共に部材本体31の主要部41に対して部材本体31の厚さ方向に弾性的に撓み変形してもよいし、例えば撓み変形しなくてもよい。
部材本体31の第一端部42及び第二端部43には、それぞれ複数(図示例では五つ)の押付部32が第一方向に間隔をあけて配列されている。第一端部42から突出する五つの押付部32は、一方の発熱部品群26を構成する五つの発熱部品3に対応する。第二端部43から突出する五つの押付部32は、他方の発熱部品群26を構成する五つの発熱部品3に対応する。
Specifically, each pressing portion 32 protrudes mainly in the second direction from the first end portion 42 or the second end portion 43 that forms a side portion of the member main body 31. The first end portion 42 and the second end portion 43 of the member main body 31 are formed to be thinner than the main portion 41 of the member main body 31 like the pressing portion 32. For this reason, the first end portion 42 and the second end portion 43 of the member main body 31 are elastically bent and deformed in the thickness direction of the member main body 31 with respect to the main portion 41 of the member main body 31 together with the pressing portion 32, for example. Alternatively, for example, there is no need to bend and deform.
At the first end 42 and the second end 43 of the member body 31, a plurality of (five in the illustrated example) pressing portions 32 are arranged at intervals in the first direction. Five pressing portions 32 protruding from the first end portion 42 correspond to the five heat generating components 3 constituting one heat generating component group 26. The five pressing parts 32 protruding from the second end 43 correspond to the five heat generating components 3 constituting the other heat generating component group 26.
第一方向に配列された五つの押付部32においては、これらの配列方向の両端に位置する二つの第一押付部32Aの厚みが最も小さく、配列方向の中間に位置する一つの第二押付部32Bの厚みが最も大きい。配列方向において第一押付部32Aと第二押付部32Bの間に位置する第三押付部32Cの厚みは、第一押付部32Aの厚みよりも大きく、かつ、第二押付部32Bの厚みよりも小さい。すなわち、押付部32の厚みは、複数の押付部32の配列方向の両端から中間に向かうにしたがって大きくなっている。
図示例においては、第二押付部32Bの厚みが部材本体31の両端部42,43の厚みと等しく、また、第一、第三押付部32A,32Cの厚みが部材本体31の両端部42,43の厚みよりも小さいが、これに限ることはない。また、第一方向に配列された五つの押付部32は、いずれも部材本体31の両端部42,43のうち部材本体31の対向面31aと同じ方向に向く面と同一平面をなすように形成されているが、これに限ることはない。
In the five pressing portions 32 arranged in the first direction, the thickness of the two first pressing portions 32A located at both ends in the arrangement direction is the smallest, and one second pressing portion located in the middle in the arrangement direction. 32B has the largest thickness. The thickness of the third pressing portion 32C located between the first pressing portion 32A and the second pressing portion 32B in the arrangement direction is larger than the thickness of the first pressing portion 32A and larger than the thickness of the second pressing portion 32B. small. That is, the thickness of the pressing portion 32 increases from both ends in the arrangement direction of the plurality of pressing portions 32 toward the middle.
In the illustrated example, the thickness of the second pressing portion 32B is equal to the thickness of both ends 42, 43 of the member main body 31, and the thickness of the first and third pressing portions 32A, 32C is equal to the both ends 42, 43 of the member main body 31. 43, but is not limited to this. Further, the five pressing portions 32 arranged in the first direction are formed so as to be flush with the surface of the both ends 42 and 43 of the member main body 31 facing in the same direction as the facing surface 31a of the member main body 31. But it is not limited to this.
図1〜9に示すように、本実施形態の押付部材4には、同一の発熱部品3に備える複数のリード22を挿通させるリード挿通孔45が形成されている。リード挿通孔45は、押付部材4の厚さ方向(Z軸方向)に貫通して形成されている。リード挿通孔45には、複数のリード22の先端部が挿通される。
リード挿通孔45は、例えば同一の発熱部品3の複数のリード22を一括して通すように、同一の発熱部品3に対して一つだけ形成されてよい。本実施形態のリード挿通孔45は、同一の発熱部品3の複数のリード22を個別に通すように、同一の発熱部品3に対して複数(図示例では三つ)形成されている。
As shown in FIGS. 1 to 9, the pressing member 4 of the present embodiment has a lead insertion hole 45 through which a plurality of leads 22 provided on the same heat generating component 3 are inserted. The lead insertion hole 45 is formed to penetrate the pressing member 4 in the thickness direction (Z-axis direction). The tips of the plurality of leads 22 are inserted into the lead insertion holes 45.
For example, only one lead insertion hole 45 may be formed for the same heat generating component 3 so as to collectively pass the plurality of leads 22 of the same heat generating component 3. A plurality (three in the example shown) of the same heat-generating component 3 is formed in the same heat-generating component 3 so as to individually pass through the leads 22 of the same heat-generating component 3.
同一の発熱部品3に対応する複数のリード挿通孔45同士の間隔は、例えば同一の発熱部品3の複数のリード22同士の間隔と同じであってよい。本実施形態では、図8に示すように、複数のリード挿通孔45同士の間隔が、複数のリード22同士の間隔よりも広い。このため、複数のリード22を複数のリード挿通孔45に個別に挿通すると、複数のリード22同士の間隔が広がるように一部のリード22が弾性的に撓み変形する。これにより、押付部材4のうちリード挿通孔45の間に位置する部位がリード22の間に挟まれ、発熱部品3を押付部材4に保持することができる。   The interval between the plurality of lead insertion holes 45 corresponding to the same heat generating component 3 may be, for example, the same as the interval between the leads 22 of the same heat generating component 3. In the present embodiment, as shown in FIG. 8, the interval between the plurality of lead insertion holes 45 is wider than the interval between the plurality of leads 22. For this reason, when the plurality of leads 22 are individually inserted into the plurality of lead insertion holes 45, some of the leads 22 are elastically deformed and deformed so as to increase the interval between the plurality of leads 22. Accordingly, a portion of the pressing member 4 located between the lead insertion holes 45 is sandwiched between the leads 22, and the heat generating component 3 can be held by the pressing member 4.
リード挿通孔45は、押付部材4の任意の部位に形成されてよい。本実施形態のリード挿通孔45は、図5〜7に示すように、押付部材4の部材本体31と押付部32との境界部分に形成される。境界部分には、部材本体31と押付部32との境界、及び、当該境界の近傍に位置する部材本体31や押付部32の部位が含まれる。具体的に、境界部分には、部材本体31の第一、第二端部42,43や、押付部32の突出方向の基端部が含まれる。図示例において、リード挿通孔45は、部材本体31の第一、第二端部42,43に形成されている。   The lead insertion hole 45 may be formed at any part of the pressing member 4. As shown in FIGS. 5 to 7, the lead insertion hole 45 of the present embodiment is formed at a boundary between the member body 31 of the pressing member 4 and the pressing portion 32. The boundary portion includes a boundary between the member main body 31 and the pressing portion 32 and a portion of the member main body 31 and the pressing portion 32 located near the boundary. Specifically, the boundary portion includes the first and second ends 42 and 43 of the member main body 31 and the base end of the pressing portion 32 in the protruding direction. In the illustrated example, the lead insertion holes 45 are formed in the first and second ends 42 and 43 of the member main body 31.
図2〜4,9に示すように、各発熱部品3のリード22は、部材本体31の第一、第二端部42,43のうち部材本体31の対向面31aと同じ方向に向く面側からリード挿通孔45に挿入され、リード挿通孔45から部材本体31の反対面31b側に突出する。このように発熱部品3が押付部材4に取り付けられた状態では、発熱部品3のリード22と本体部21とが、押付部32の突出方向に順番に配列される。   As shown in FIGS. 2 to 4 and 9, the lead 22 of each heat-generating component 3 is located on the surface side of the first and second end portions 42 and 43 of the member body 31 which faces in the same direction as the facing surface 31 a of the member body 31. From the lead insertion hole 45, and protrudes from the lead insertion hole 45 toward the opposite surface 31 b of the member main body 31. In a state where the heat generating component 3 is attached to the pressing member 4 in this manner, the leads 22 and the main body 21 of the heat generating component 3 are arranged in order in the protruding direction of the pressing portion 32.
図2〜4,10に示すように、回路基板5は、放熱部材2の配置面2aに配された発熱部品3及び押付部材4よりも上側に重ねて配される。
回路基板5には、発熱部品3のリード22の先端部を個別に挿通させるリード用貫通孔51や、押付部材4の基板位置決め部36の案内部38を挿通させる位置決め用貫通孔52が形成されている。リード用貫通孔51及び位置決め用貫通孔52は、いずれも回路基板5の板厚方向に貫通している。
また、回路基板5には、発熱部品3と共の回路を構成する回路部品53が搭載されている。回路部品53は、例えば押付部材4に対向する回路基板5の対向面5aにのみ搭載されてよい。本実施形態において、回路部品53は、回路基板5の両面(対向面5a及び対向面5aと反対側に向く面)に搭載されている。
As shown in FIGS. 2 to 4 and 10, the circuit board 5 is arranged above the heat generating component 3 and the pressing member 4 arranged on the arrangement surface 2 a of the heat radiating member 2.
The circuit board 5 is provided with a lead through hole 51 for individually inserting the tips of the leads 22 of the heat generating component 3 and a positioning through hole 52 for inserting the guide part 38 of the board positioning part 36 of the pressing member 4. ing. Each of the lead through-hole 51 and the positioning through-hole 52 penetrates in the thickness direction of the circuit board 5.
The circuit board 5 has mounted thereon a circuit component 53 that forms a circuit with the heat-generating component 3. The circuit component 53 may be mounted only on the facing surface 5a of the circuit board 5 facing the pressing member 4, for example. In the present embodiment, the circuit components 53 are mounted on both surfaces (the opposing surface 5a and the surface facing the opposite side of the opposing surface 5a) of the circuit board 5.
図2〜4に示すように、回路基板5を押付部材4上に配した状態では、回路基板5が基板位置決め部36の支持部37の支持面37a上に配される。このため、回路基板5は、部材本体31の対向面31aに対して間隔をあけて配される。また、回路基板5を押付部材4上に配した状態では、リード挿通孔45を通して部材本体31の反対面31b側から突出したリード22の先端部がリード用貫通孔51に挿通される。これにより、各発熱部品3と回路基板5とを電気的に接続することができる。また、回路基板5の対向面5aに搭載された回路部品53が押付部材4の収容凹部34に収容される。   As shown in FIGS. 2 to 4, when the circuit board 5 is arranged on the pressing member 4, the circuit board 5 is arranged on the support surface 37 a of the support portion 37 of the board positioning section 36. For this reason, the circuit board 5 is arranged at an interval with respect to the facing surface 31 a of the member main body 31. When the circuit board 5 is disposed on the pressing member 4, the tip of the lead 22 projecting from the opposite surface 31 b of the member main body 31 through the lead insertion hole 45 is inserted into the lead through hole 51. Thereby, each heat generating component 3 and the circuit board 5 can be electrically connected. Further, the circuit component 53 mounted on the facing surface 5 a of the circuit board 5 is housed in the housing recess 34 of the pressing member 4.
本実施形態の半導体装置1は、例えば図2〜4に示すように、放熱部材2に収容された発熱部品3、押付部材4及び回路基板5を封止する封止樹脂8を備えてよい。封止樹脂8は、例えば発熱部品3、押付部材4及び回路基板5を放熱部材2に収容した状態で、放熱部材2内に流し込むことで形成されてよい。   The semiconductor device 1 of the present embodiment may include, for example, as shown in FIGS. 2 to 4, a heat generating component 3, a pressing member 4, and a sealing resin 8 that seals the circuit board 5 housed in the heat radiating member 2. The sealing resin 8 may be formed, for example, by flowing the heat generating component 3, the pressing member 4, and the circuit board 5 into the heat radiating member 2 in a state of being housed in the heat radiating member 2.
次に、本実施形態に係る半導体装置1を製造する方法(製造方法)の一例について説明する。
半導体装置1を製造する際には、はじめに図9に示すように、発熱部品3を押付部材4に取り付ける(取付工程)。取付工程では、発熱部品3の複数のリード22を押付部材4の複数のリード挿通孔45に個別に挿通させればよい。具体的には、発熱部品3のリード22を、部材本体31の対向面31a側からリード挿通孔45に挿通させればよい。これにより、発熱部品3の本体部21を、押付部材4の押付部32に対して部材本体31の対向面31a側に配置することができる。また、発熱部品3のリード22をリード挿通孔45に挿通させた状態では、発熱部品3を押付部材4に保持することができる。また、この状態において、押付部材4の反対面31bから突出するリード22の突出長さは、押付部材4の反対面31bから突出する基板位置決め部36の突出長さよりも小さい。本実施形態の取付工程では、複数の発熱部品3を押付部材4に取り付ける。
Next, an example of a method (manufacturing method) for manufacturing the semiconductor device 1 according to the present embodiment will be described.
When manufacturing the semiconductor device 1, first, as shown in FIG. 9, the heat generating component 3 is attached to the pressing member 4 (attaching step). In the mounting step, the plurality of leads 22 of the heat generating component 3 may be individually inserted into the plurality of lead insertion holes 45 of the pressing member 4. Specifically, the lead 22 of the heat generating component 3 may be inserted into the lead insertion hole 45 from the side of the facing surface 31 a of the member main body 31. Thereby, the main body 21 of the heat generating component 3 can be disposed on the side of the facing surface 31 a of the member main body 31 with respect to the pressing portion 32 of the pressing member 4. When the leads 22 of the heat generating component 3 are inserted through the lead insertion holes 45, the heat generating component 3 can be held by the pressing member 4. In this state, the projecting length of the lead 22 projecting from the opposite surface 31b of the pressing member 4 is smaller than the projecting length of the board positioning portion 36 projecting from the opposite surface 31b of the pressing member 4. In the mounting step of the present embodiment, the plurality of heat generating components 3 are mounted on the pressing member 4.
その後、図2〜4,10,11に示すように、押付部材4を放熱部材2に固定する(固定工程)。固定工程では、はじめに、押付部材4の部材本体31の対向面31aが放熱部材2の配置面2aに対向するように押付部材4を放熱部材2の配置面2a上に配する。この際、押付部材4の被係止部35を放熱部材2の係止部13に引っ掛けることで、放熱部材2に対する押付部材4及び発熱部品3の位置決めを容易に行うことができる。押付部材4を放熱部材2の配置面2aに配した状態では、図11に示すように、発熱部品3の本体部21が放熱部材2の配置面2aと押付部材4の押付部32との間に位置する。   Thereafter, as shown in FIGS. 2 to 4, 10, and 11, the pressing member 4 is fixed to the heat radiation member 2 (fixing step). In the fixing step, first, the pressing member 4 is arranged on the arrangement surface 2a of the heat radiating member 2 such that the opposing surface 31a of the member body 31 of the pressing member 4 faces the arrangement surface 2a of the heat radiating member 2. At this time, by hooking the locked part 35 of the pressing member 4 on the locking part 13 of the heat radiating member 2, the positioning of the pressing member 4 and the heat generating component 3 with respect to the heat radiating member 2 can be easily performed. In a state where the pressing member 4 is arranged on the arrangement surface 2a of the heat radiating member 2, as shown in FIG. 11, the main body 21 of the heat generating component 3 is located between the arrangement surface 2a of the heat radiating member 2 and the pressing portion 32 of the pressing member 4. Located in.
次いで、押付部材4を放熱部材2の配置面2aに固定すればよい。本実施形態では、ねじ止めによって押付部材4の部材本体31を放熱部材2の配置面2aに固定する。これにより、押付部材4の押付部32が弾性的に撓み変形し、これに伴う押付部32の弾性力によって、発熱部品3の本体部21が放熱部材2の配置面2aに押し付けられる。以上により、固定工程が完了する。
なお、本実施形態の製造方法では、上記の固定工程を実施する前に、図10に示すように、予め絶縁シート6を放熱部材2の配置面2aに配置しておく。これにより、放熱部材2と発熱部品3との間に絶縁シート6を介在させて、放熱部材2と発熱部品3とを電気的に絶縁させることができる。
Next, the pressing member 4 may be fixed to the arrangement surface 2a of the heat radiation member 2. In the present embodiment, the member main body 31 of the pressing member 4 is fixed to the arrangement surface 2a of the heat radiation member 2 by screwing. As a result, the pressing portion 32 of the pressing member 4 is elastically bent and deformed, and the main body 21 of the heat generating component 3 is pressed against the disposition surface 2 a of the heat radiating member 2 by the elastic force of the pressing portion 32. Thus, the fixing step is completed.
In the manufacturing method according to the present embodiment, before performing the fixing step, the insulating sheet 6 is previously arranged on the arrangement surface 2a of the heat radiating member 2, as shown in FIG. Thereby, the heat radiating member 2 and the heat generating component 3 can be electrically insulated from each other with the insulating sheet 6 interposed between the heat radiating member 2 and the heat generating component 3.
例えば、上記の固定工程が完了することで半導体装置1の製造方法が完了してよい。本実施形態では、固定工程後に、基板取付工程を実施する。基板取付工程では、はじめに図2〜4に示すように、回路基板5を押付部材4上に配置する。この際、回路基板5には、はじめに、押付部材4の基板位置決め部36の案内部38が挿通され、その後、発熱部品3のリード22が挿通される。すなわち、回路基板5が押付部材4に対して位置決めされた後に、発熱部品3のリード22が回路基板5に挿通される。これにより、複数の発熱部品3のリード22を容易かつ確実に回路基板5に挿通させることができる。回路基板5を配置した後に、はんだ付け等によって発熱部品3のリード22が回路基板5と電気接続されることで、基板取付工程が完了する。   For example, the method of manufacturing the semiconductor device 1 may be completed by completing the fixing step. In the present embodiment, after the fixing step, the board mounting step is performed. In the board mounting step, the circuit board 5 is first placed on the pressing member 4 as shown in FIGS. At this time, first, the guide portion 38 of the board positioning portion 36 of the pressing member 4 is inserted into the circuit board 5, and then the lead 22 of the heat generating component 3 is inserted. That is, after the circuit board 5 is positioned with respect to the pressing member 4, the leads 22 of the heat generating component 3 are inserted into the circuit board 5. Thereby, the leads 22 of the plurality of heat generating components 3 can be easily and reliably inserted into the circuit board 5. After the circuit board 5 is arranged, the leads 22 of the heat generating component 3 are electrically connected to the circuit board 5 by soldering or the like, thereby completing the board mounting process.
以上説明したように、本実施形態の半導体装置1によれば、押付部材4が絶縁性を有する樹脂材料である。このため、発熱部品3のリード22が押付部材4の近くに位置していても、リード22と放熱部材2との電気的な絶縁性を確保できる。リード22を押付部材4の近くに配置できることで、配置面2aにおける発熱部品3及び押付部材4の配置領域を小さくすることができる。したがって、半導体装置1の小型化を図ることができる。
また、押付部材4が樹脂製であることで、押付部材4が樹脂製よりも硬い金属製である場合と比較して、発熱部品3の本体部21に傷がつくことを抑制することもできる。
As described above, according to the semiconductor device 1 of the present embodiment, the pressing member 4 is a resin material having an insulating property. For this reason, even if the lead 22 of the heat generating component 3 is located near the pressing member 4, electrical insulation between the lead 22 and the heat radiating member 2 can be ensured. Since the lead 22 can be arranged near the pressing member 4, the area where the heat generating component 3 and the pressing member 4 are arranged on the arrangement surface 2a can be reduced. Therefore, the size of the semiconductor device 1 can be reduced.
Further, since the pressing member 4 is made of resin, it is possible to suppress the main body 21 of the heat generating component 3 from being damaged as compared with the case where the pressing member 4 is made of metal harder than resin. .
また、本実施形態の半導体装置1によれば、押付部材4には発熱部品3の複数のリード22を個別に挿通させる複数のリード挿通孔45が形成されている。このため、リード22をリード挿通孔45に通すだけで、発熱部品3を押付部材4に対して簡単に位置決めすることができる。また、発熱部品3が押付部材4に対して位置決めされることで、押付部材4を放熱部材2に固定する際に、押付部材4に対する発熱部品3の位置ずれが生じることを抑制又は防止できる。したがって、押付部材4を放熱部材2に固定するだけで、発熱部品3を放熱部材2に対して簡単に位置決めすることができる。特に本実施形態では、複数の発熱部品3が同一の押付部材4に取り付けられるため、複数の発熱部品3を放熱部材2に対して同時に位置決めすることができる。   Further, according to the semiconductor device 1 of the present embodiment, the pressing member 4 is formed with the plurality of lead insertion holes 45 through which the plurality of leads 22 of the heat generating component 3 are individually inserted. Therefore, the heating component 3 can be easily positioned with respect to the pressing member 4 only by passing the lead 22 through the lead insertion hole 45. Further, by positioning the heat generating component 3 with respect to the pressing member 4, when the pressing member 4 is fixed to the heat radiating member 2, it is possible to suppress or prevent the displacement of the heat generating component 3 with respect to the pressing member 4. Therefore, the heat generating component 3 can be easily positioned with respect to the heat radiating member 2 only by fixing the pressing member 4 to the heat radiating member 2. In particular, in the present embodiment, since the plurality of heat generating components 3 are attached to the same pressing member 4, the plurality of heat generating components 3 can be simultaneously positioned with respect to the heat radiating member 2.
また、押付部材4にリード挿通孔45が形成されていることで、放熱部材2の配置面2a上において、発熱部品3のリード22と押付部材4とが重ねて位置する。このため、放熱部材2の配置面2aにおける発熱部品3及び押付部材4の配置領域をさらに小さくすることができる。したがって、半導体装置1の小型化をさらに図ることができる。   Further, since the lead insertion hole 45 is formed in the pressing member 4, the lead 22 of the heat generating component 3 and the pressing member 4 are positioned on the arrangement surface 2 a of the heat radiating member 2. For this reason, the arrangement area of the heat generating component 3 and the pressing member 4 on the arrangement surface 2a of the heat radiation member 2 can be further reduced. Therefore, the size of the semiconductor device 1 can be further reduced.
また、本実施形態の半導体装置1によれば、押付部材4のリード挿通孔45が、押付部材4の部材本体31と押付部32との境界部分に形成されている。このため、発熱部品3のリード22も部材本体31と押付部32との境界部分に位置するため、放熱部材2の配置面2aにおける発熱部品3及び押付部材4の配置領域をさらに小さくすることができる。したがって、半導体装置1の小型化をさらに図ることができる。   Further, according to the semiconductor device 1 of the present embodiment, the lead insertion hole 45 of the pressing member 4 is formed at the boundary between the member main body 31 and the pressing portion 32 of the pressing member 4. For this reason, since the lead 22 of the heat generating component 3 is also located at the boundary between the member main body 31 and the pressing portion 32, the area where the heat generating component 3 and the pressing member 4 are disposed on the mounting surface 2 a of the heat radiating member 2 can be further reduced. it can. Therefore, the size of the semiconductor device 1 can be further reduced.
また、本実施形態の半導体装置1によれば、押付部材4の押付部32の厚みが、複数の押付部32の間で異なっていることで、複数の押付部32の押付力(発熱部品3の本体部21を押し付ける押付力)の均一化を図ることができる。
具体的に説明すれば、第一方向に配列された複数の押付部32の厚みが同じである場合、押付部32の押付力は、複数の押付部32の配列方向の中間から両端に向かうにしたがって大きくなってしまう。これに対し、本実施形態では、第一方向に配列された複数の押付部32の厚みが、複数の押付部32の配列方向の中間から両端に向かうにしたがって小さくなっている。そして、押付部32の押付力は、押付部32の厚みを小さくするほど小さくなる。これにより、第一方向に配列された複数の押付部32の間で、押付部32の押付力の均一化を図ることができる。
Further, according to the semiconductor device 1 of the present embodiment, since the thickness of the pressing portion 32 of the pressing member 4 is different between the plurality of pressing portions 32, the pressing force of the plurality of pressing portions 32 (the heat generating component 3). (A pressing force for pressing the main body portion 21) can be made uniform.
More specifically, when the thickness of the plurality of pressing portions 32 arranged in the first direction is the same, the pressing force of the pressing portion 32 increases from the middle in the arrangement direction of the plurality of pressing portions 32 to both ends. Therefore, it becomes large. On the other hand, in the present embodiment, the thickness of the plurality of pressing portions 32 arranged in the first direction decreases from the middle in the arrangement direction of the plurality of pressing portions 32 toward both ends. The pressing force of the pressing portion 32 decreases as the thickness of the pressing portion 32 decreases. Thereby, the pressing force of the pressing portions 32 can be made uniform among the plurality of pressing portions 32 arranged in the first direction.
また、本実施形態の半導体装置1によれば、押付部材4の部材本体31には、その反対面31bから窪む収容凹部34が形成されている。このため、発熱部品3と共に回路を構成する回路部品53を、回路基板5のうち押付部材4に対向する対向面5aに搭載しても、この回路部品53を部材本体31の収容凹部34に収容することができる。これにより、回路基板5を含む半導体装置1の厚みを小さく抑えることができる。したがって、半導体装置1の小型化(特に薄型化)を図ることができる。
また、回路基板5に搭載される回路部品53を発熱部品3のリード22の近くに配置することで、発熱部品3から回路部品53に至る回路基板5の配線を短くすることができる。これにより、発熱部品3及び回路部品53を含む回路のインピーダンスを低く抑えることもできる。
Further, according to the semiconductor device 1 of the present embodiment, the housing body 34 of the pressing member 4 is formed with the housing recess 34 that is recessed from the opposite surface 31b. For this reason, even if the circuit component 53 forming a circuit together with the heat generating component 3 is mounted on the opposing surface 5 a of the circuit board 5 facing the pressing member 4, the circuit component 53 is stored in the storage recess 34 of the member main body 31. can do. Thus, the thickness of the semiconductor device 1 including the circuit board 5 can be reduced. Therefore, it is possible to reduce the size (particularly, the thickness) of the semiconductor device 1.
Further, by arranging the circuit component 53 mounted on the circuit board 5 near the lead 22 of the heating component 3, the wiring of the circuit board 5 from the heating component 3 to the circuit component 53 can be shortened. Thereby, the impedance of the circuit including the heat-generating component 3 and the circuit component 53 can be reduced.
また、本実施形態の半導体装置1の製造方法によれば、発熱部品3を押付部材4に取り付ける取付工程後に、押付部材4を放熱部材2に固定する固定工程を実施する。そして、取付工程においては、発熱部品3の複数のリード22を押付部材4の複数のリード挿通孔45に個別に挿通させる。このため、取付工程では、発熱部品3を押付部材4に対して簡単に位置決めすることができる。さらに、固定工程では、押付部材4に対する発熱部品3の位置ずれが生じることを抑制又は防止できる。したがって、押付部材4を放熱部材2に固定するだけで、発熱部品3を放熱部材2に対して簡単に位置決めすることができる。   Further, according to the method of manufacturing the semiconductor device 1 of the present embodiment, a fixing step of fixing the pressing member 4 to the heat radiation member 2 is performed after the attaching step of attaching the heat generating component 3 to the pressing member 4. Then, in the mounting step, the plurality of leads 22 of the heat generating component 3 are individually inserted into the plurality of lead insertion holes 45 of the pressing member 4. Therefore, in the mounting step, the heat generating component 3 can be easily positioned with respect to the pressing member 4. Further, in the fixing step, it is possible to suppress or prevent the displacement of the heat generating component 3 with respect to the pressing member 4. Therefore, the heat generating component 3 can be easily positioned with respect to the heat radiating member 2 only by fixing the pressing member 4 to the heat radiating member 2.
また、本実施形態の半導体装置1によれば、押付部材4に形成される貫通孔39が、部材本体31の主要部41のうち、部材本体31の第二方向の両端部42,43よりも対向面31a側に位置する部位において、主要部41の第二方向の両端に開口している。このため、発熱部品3、押付部材4及び回路基板5を放熱部材2の配置面2a上に配した状態で、放熱部材2の配置面2a上に封止樹脂8を流し込む際に、封止樹脂8は、部材本体31の貫通孔39を通して放熱部材2の配置面2aと部材本体31の第二方向の両端部42,43との隙間に到達することができる。したがって、放熱部材2の配置面2aと部材本体31の第二方向の両端部42,43との間に位置する発熱部品3のリード22を封止樹脂8によって確実に封止することができる。   Further, according to the semiconductor device 1 of the present embodiment, the through-hole 39 formed in the pressing member 4 is larger than the two ends 42 and 43 of the main part 41 of the member main body 31 in the second direction. At the portion located on the side of the facing surface 31a, the main portion 41 is open at both ends in the second direction. For this reason, when the sealing resin 8 is poured onto the disposition surface 2a of the heat dissipating member 2 in a state where the heat generating component 3, the pressing member 4, and the circuit board 5 are disposed on the disposition surface 2a of the dissipating member 2, 8 can reach the gap between the arrangement surface 2a of the heat radiating member 2 and both ends 42 and 43 of the member main body 31 in the second direction through the through hole 39 of the member main body 31. Therefore, the leads 22 of the heat generating component 3 located between the arrangement surface 2 a of the heat radiating member 2 and both ends 42, 43 of the member main body 31 in the second direction can be reliably sealed by the sealing resin 8.
以上、本発明の詳細について説明したが、本発明は上述した実施形態に限定されるものではなく、本発明の主旨を逸脱しない範囲において種々の変更を加えることができる。   Although the details of the present invention have been described above, the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the gist of the present invention.
本発明の半導体装置において、押付部材4のリード挿通孔45は、例えば押付部32の突出方向の先端部側に形成されてよい。リード挿通孔45は、例えば発熱部品3の本体部21に向けて押し付けられる押付部32の先端からさらに延長する延長部に形成されてよい。   In the semiconductor device of the present invention, the lead insertion hole 45 of the pressing member 4 may be formed, for example, on the tip end side of the pressing portion 32 in the protruding direction. The lead insertion hole 45 may be formed in, for example, an extension part that further extends from the tip of the pressing part 32 pressed toward the main body part 21 of the heat generating component 3.
本発明の半導体装置において、押付部材4には、例えばリード挿通孔45、収容凹部34、被係止部35、基板位置決め部36、貫通孔39が形成されなくてもよい。   In the semiconductor device of the present invention, for example, the lead insertion hole 45, the accommodation recess 34, the locked portion 35, the substrate positioning portion 36, and the through hole 39 may not be formed in the pressing member 4.
本発明の半導体装置において、押付部材4の押付部32は、例えば部材本体31の第一、第二端部42,43のいずれか一方のみから突出してもよい。   In the semiconductor device of the present invention, the pressing portion 32 of the pressing member 4 may protrude from, for example, only one of the first and second ends 42 and 43 of the member main body 31.
1 半導体装置
2 放熱部材
2a 配置面
3 発熱部品
4 押付部材
5 回路基板
5a 対向面
6 絶縁シート
8 封止樹脂
21 本体部
22 リード
31 部材本体
31a 対向面
31b 反対面
32,32A,32B,32C 押付部
34 収容凹部(凹部)
39 貫通孔
41 主要部
42 第一端部
43 第二端部
45 リード挿通孔
53 回路部品
DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Heat radiating member 2a Arrangement surface 3 Heat generating component 4 Pressing member 5 Circuit board 5a Opposing surface 6 Insulating sheet 8 Sealing resin 21 Main body 22 Lead 31 Member main body 31a Opposing surface 31b Opposite surface 32, 32A, 32B, 32C Part 34 accommodation recess (recess)
39 Through-hole 41 Main part 42 First end 43 Second end 45 Lead insertion hole 53 Circuit component

Claims (6)

  1. 配置面を有する放熱部材と、前記配置面に配される本体部及び前記本体部から突出するリードを有する発熱部品と、前記放熱部材に固定されることで前記本体部を前記配置面に押し付ける押付部材と、を備え、
    前記押付部材が、電気的な絶縁性を有する樹脂材料からなる半導体装置。
    A heat dissipating member having an arrangement surface, a heat generating component having a main body disposed on the disposition surface and a lead protruding from the main body, and pressing the main body against the disposition surface by being fixed to the heat dissipating member And a member,
    A semiconductor device, wherein the pressing member is made of a resin material having electrical insulation.
  2. 前記発熱部品が、複数の前記リードを備え、
    前記押付部材には、複数の前記リードを個別に挿通させる複数のリード挿通孔が形成されている請求項1に記載の半導体装置。
    The heat generating component includes a plurality of the leads,
    The semiconductor device according to claim 1, wherein the pressing member has a plurality of lead insertion holes through which the plurality of leads are individually inserted.
  3. 前記押付部材が、前記配置面に固定される部材本体と、前記部材本体に対して弾性的に撓み変形可能に接続されると共に前記本体部に重ねて配され、前記部材本体が前記配置面に固定されることで弾性的に撓み変形して前記本体部を前記配置面に押し付ける押付部と、を備え
    前記リード挿通孔が、前記部材本体と前記押付部との境界部分に形成されている請求項2に記載の半導体装置。
    The pressing member is connected to the member main body fixed to the arrangement surface and the member main body so as to be elastically deformable and deformable, and is arranged on the main body portion, and the member main body is disposed on the arrangement surface. A pressing portion that elastically bends and deforms by being fixed to press the main body portion against the arrangement surface, wherein the lead insertion hole is formed at a boundary portion between the member main body and the pressing portion. Item 3. The semiconductor device according to item 2.
  4. 複数の前記発熱部品を備え、
    前記押付部材が、前記配置面に固定される部材本体と、前記部材本体に対して弾性的に撓み変形可能に接続されると共に複数の前記本体部に各々重ねて配され、前記部材本体が前記配置面に固定されることで弾性的に撓み変形して複数の前記本体部をそれぞれ前記配置面に押し付ける複数の押付部と、を備え、
    前記押付部の厚みが、複数の前記押付部の間で異なる請求項1から請求項3のいずれか一項に記載の半導体装置。
    Comprising a plurality of the heat generating components,
    The pressing member is a member main body fixed to the arrangement surface, and connected to the member main body so as to be elastically deformable and deformable, and is disposed on each of a plurality of the main body portions, and the member main body is the A plurality of pressing portions that elastically bend and deform by being fixed to the arrangement surface and press a plurality of the main body portions against the arrangement surface, respectively.
    4. The semiconductor device according to claim 1, wherein a thickness of the pressing portion differs between the plurality of pressing portions. 5.
  5. 前記押付部材が、前記配置面に固定される部材本体と、前記部材本体に対して弾性的に撓み変形可能に接続されると共に前記本体部に重ねて配され、前記部材本体が前記配置面に固定されることで弾性的に撓み変形して前記本体部を前記配置面に押し付ける押付部と、を備え
    前記部材本体には、前記部材本体のうち前記配置面と反対側に向く面から窪む凹部が形成されている請求項1から請求項4のいずれか一項に記載の半導体装置。
    The pressing member is connected to the member main body fixed to the arrangement surface and the member main body so as to be elastically deformable and deformable, and is arranged on the main body portion, and the member main body is disposed on the arrangement surface. A pressing portion that elastically bends and deforms by being fixed to press the main body portion against the arrangement surface, wherein the member main body is depressed from a surface of the member main body facing the opposite side to the arrangement surface. The semiconductor device according to claim 1, wherein a concave portion is formed.
  6. 請求項1から請求項5のいずれか一項に記載の半導体装置を製造する半導体装置の製造方法であって、
    前記発熱部品の複数の前記リードを前記押付部材に形成された複数のリード挿通孔に個別に挿通させることで、前記発熱部品を前記押付部材に取り付ける取付工程と、
    前記取付工程の後に、前記押付部材を前記放熱部材に固定する固定工程と、
    を備える半導体装置の製造方法。
    A method of manufacturing a semiconductor device according to claim 1, wherein the method comprises:
    An attaching step of attaching the heating component to the pressing member by individually inserting the plurality of leads of the heating component into a plurality of lead insertion holes formed in the pressing member;
    After the attaching step, a fixing step of fixing the pressing member to the heat radiating member,
    A method for manufacturing a semiconductor device comprising:
JP2018155376A 2018-08-22 2018-08-22 Semiconductor device and manufacturing method thereof Pending JP2020031122A (en)

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Country Link
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