JP4656047B2 - Electronic device casing structure and power supply device - Google Patents

Description

  The present invention relates to a housing structure and a power supply device for an electronic device, and more particularly to a housing structure and a power supply device for an electronic device for housing an electronic device body in the housing.

  When an electronic device is driven by a commercial power source, generally, an AC voltage from the commercial power source is converted into a DC voltage by an AC adapter.

  The AC adapter incorporates heat-generating components such as a transformer and a power transistor, and has a configuration in which the amount of heat generated is locally increased. In recent years, the AC adapter is required to be downsized, and the distance between the apparatus main body and the housing tends to be very close. For this reason, the heat generated locally in the apparatus main body is directly transmitted to the casing, and the casing also generates heat locally.

For this reason, an electronic device has been proposed in which an air layer is provided between the case and the heat source via a barrier film so that heat from the heat source is not transmitted to the case (see, for example, Patent Document 1).
JP-A-2005-45121

  However, if the structure is such that heat from the heat source is not transferred to the case by simply providing an air layer between the case and the heat source via a barrier film as in the prior art, the heat from the heat source will not be dissipated and the internal temperature There was a problem such as extremely rising.

  The present invention has been made in view of the above points, and an object thereof is to provide a casing structure of an electronic apparatus and a power supply device that can improve discharge efficiency by making the temperature distribution of the casing uniform. .

  The present invention relates to a housing structure of an electronic device for housing the electronic device main body (111) in the housing (112, 113), and is disposed on the inner surface of the housing (112, 113) to dissipate heat. 115), insulating plates (116, 117) interposed between the heat sinks (114, 115) and the electronic device body (111), heat sinks (114, 115), and insulating plates (116, 117). And a heat insulating layer (A1) provided between the two. The heat insulating layer (A1) is characterized by being composed of an air layer formed by disposing the heat radiating plates (114, 115) and the insulating plates (116, 117) apart from each other.

  In the present invention, an air layer is formed between the heat sink (114, 115) and the housing (112, 113) at a predetermined portion, and the heat sink (114, 115) and the insulating plate (116, 117). It is characterized by having adhered closely. The predetermined part is a part facing a position where the heat-generating component (122) of the electronic device main body (111) is mounted.

  Further, the present invention provides a power supply device in which the apparatus main body (111) is housed in a housing (112, 113), and is disposed on the inner surface of the housing (112, 113) and dissipates heat, (114, 115), Insulating plates (116, 117) interposed between the heat sinks (114, 115) and the electronic device body (111), and formed between the heat sinks (114, 115) and the insulating plates (116, 117). And a heat insulating layer (A1). The heat insulating layer (A1) is characterized by being composed of an air layer formed by disposing the heat radiating plates (114, 115) and the insulating plates (116, 117) apart from each other.

  In the present invention, an air layer is formed between the heat sink (114, 115) and the housing (112, 113) at a predetermined portion, and the heat sink (114, 115) and the insulating plate (116, 117). It is characterized by having adhered closely. Further, the predetermined part is a part facing the transformer (122) mounted on the apparatus main body (111).

  The above reference signs are for reference only and do not limit the scope of the claims.

  According to the present invention, by providing an insulating plate and a heat radiating plate between the electronic device main body and the housing, and forming an air layer between the heat radiating plate and the insulating plate, the heat from the electronic device main body is Heat can be prevented from being diffused and directly transmitted to the heat sink by the insulating plate and the air layer between the insulating plate and the heat sink. can do. Moreover, since the heat transmitted to the heat radiating plate is further diffused by the heat radiating plate and transmitted to the housing, the temperature on the surface of the housing can be made uniform. This makes it possible to efficiently dissipate heat from the housing. Moreover, since local heat generation of the housing can be prevented, the maximum temperature of the housing surface can be lowered.

  In addition, in a predetermined part where the amount of heat generated is large, the heat sink can be brought into close contact with the insulating plate, and an air layer can be provided between the heat sink and the housing, so that heat from the predetermined part can be efficiently released to the heat sink. Since the heat transmitted to the heat radiating plate can be prevented from being directly exposed to the housing surface, the temperature of the housing surface can be made uniform. This makes it possible to efficiently dissipate heat from the housing. Moreover, since local heat generation of the housing can be prevented, the maximum temperature of the housing surface can be lowered.

  FIG. 1 is an exploded perspective view of an embodiment of the present invention, and FIG. 2 is a sectional view of the embodiment of the present invention.

  In this embodiment, an AC adapter will be described as an electronic device.

  The AC adapter 100 according to the present embodiment includes an apparatus main body 111, a case 112, a cover 113, heat sinks 114 and 115, and insulating plates 116 and 117. The AC voltage supplied from the power cable 118 is a constant voltage DC. The voltage is converted and output to the power cable 119.

  The apparatus main body 111 is configured such that a transformer 122, a capacitor 123, an electronic component 125 such as a transistor 124, a heat sink 126, and the like are mounted on a printed wiring board 121. Power cables 118 and 119 are connected to the printed circuit board 121. The apparatus main body 111 converts the AC voltage supplied from the power cable 118 into a constant DC voltage and outputs it to the power cable 119.

  FIG. 3 shows a configuration diagram of the heat sink 114. 3A is a plan view of the heat sink 114, and FIG. 3B is a side view of the heat sink 114. FIG.

  The heat radiating plate 114 is formed by punching and bending a metal plate made of copper, aluminum or the like and shaping it into a predetermined shape, and includes a bottom surface portion 114a, a convex bent portion 114b, and a protruding portion 114c. .

  A first hole portion 114d and a second hole portion 114e are formed in the bottom surface portion 114a. The first hole 114 d engages with the first pin 131 formed on the bottom surface of the case 112. The second hole portion 114 e engages with the second pin 132 formed on the bottom surface of the case 112.

  The case 112 is formed by molding a resin material, and the first pin 131 and the second pin 132 are formed on the bottom surface of the case 112 so as to protrude integrally with the case 112 in the arrow Z1 direction. The first pin 131 is formed in a shape that engages with the first hole 114d substantially without loosening.

  The second pin 132 has a first engaging portion 132a and a second engaging portion 132b. The first engaging portion 132a is formed in a shape that engages with the second hole portion 114e without loosening. The second engaging portion 132a is formed so as to have a smaller diameter than the first engaging portion 132a.

  The heat radiating plate 114 is positioned on the bottom surface of the case 112 by engaging the first hole 114 d and the second hole 114 e with the first pin 131 and the second pin 132 of the case 112.

  The convex bent portion 114b is configured to protrude from the bottom surface portion 114a in the direction of the apparatus main body 111 and in the arrow Z1 direction when the heat radiating plate 114 is attached to the bottom surface of the case 112. As a result, the convex bent portion 114 b is disposed away from the bottom surface of the case 112, and an air layer A <b> 1 is formed between the convex bent portion 114 b and the bottom surface of the case 112. The convex bent portion 114 b is formed at a position corresponding to the transformer 122 of the apparatus main body 111 and the heat radiating plate 126 erected on the printed wiring board 121.

  The projecting portions 114 c are formed at both ends of the heat radiating plate 114, and are configured to project from the bottom surface of the case 112 in the arrow Z1 direction. The projecting portion 114 c engages with the side surface projecting portion 112 a of the case 112 and acts to stably hold the heat radiating plate 114 in the case 112.

  In addition, by providing the protrusion 114c, a heat radiating surface can be provided on the side surface of the case 112, and thus the heat radiating efficiency can be improved.

  FIG. 4 shows a cross-sectional view of the main part of one embodiment of the present invention.

  After the heat sink 114 is positioned on the bottom surface of the case 112 by engaging the first hole 114d with the first pin 131 of the case 112, the tip of the first pin 131 is moved as shown in FIG. It is fixed to the bottom surface of the case 112 by being thermally deformed so as to have a shape larger than the diameter of the first hole 114d. Thereby, it is possible to prevent the heat sink 114 from dropping from the case 112 in the direction of the arrow Z1.

  FIG. 5 shows a configuration diagram of the insulating plate 116. 5A is a plan view and FIG. 5B is a side view.

  The insulating plate 116 is formed by molding a black resin material into a plate shape, punching it into a desired shape, and is arranged between the apparatus main body 111 and the heat radiating plate 114. The insulating plate 116 is mounted so as to overlap the heat radiating plate 114, and a hole 116 a is formed at a position corresponding to the second hole 114 e of the heat radiating plate 114.

  The second engaging portion 132b of the second pin 132 formed on the bottom surface of the case 112 is engaged with the hole portion 116a. The insulating plate 116 is positioned in the case 112 when the hole 116 a engages with the second engaging portion 132 b of the second pin 132. The insulating plate 116 is positioned in the case 112 in a state where the hole 116d is engaged with the second engagement part 132b of the second pin 132, and then the second engagement part 132b is made larger than the diameter of the hole 116d. It is fixed on the heat radiating plate 114 of the case 112 by being thermally deformed so as to have a large shape.

  At this time, as shown in FIG. 4, an air layer A <b> 2 is formed between the heat radiating plate 114 and the insulating plate 116 by the first engaging portion 132 a of the second pin 132 provided on the bottom surface of the case 112. Further, the insulating plate 116 is fixed in contact with the convex bent portion 114b of the heat radiating plate 114.

  FIG. 6 is a configuration diagram of the heat sink 115, FIG. 7 is a plan view of the cover 113, and FIG. 6A is a plan view and FIG. 6B is a side view.

  Like the heat sink 114, the heat sink 115 is formed by punching and bending a metal plate made of copper, aluminum or the like and shaping it into a predetermined shape. The bottom plate 115a, the convex bent portion 115b, the protrusion Part 115c.

  The bottom surface portion 115a and the convex bent portion 115b are formed with a first hole portion 115d, a second hole portion 115e, and an engaging groove portion 115f. The first hole 115 d engages with a first pin 141 formed on the bottom surface of the cover 113. The second hole 115 e engages with the second pin 142 formed on the bottom surface of the cover 113.

  The cover 113 is formed by molding a resin material, and the first pin 141, the second pin 142, and the holding portion 143 are formed on the bottom surface of the cover 113 so as to protrude integrally with the cover 113 in the arrow Z2 direction. Has been. The first pin 141 is formed in a shape that engages with the first hole 115d substantially without looseness.

  The second pin 142 has a first engaging portion 142a and a second engaging portion 142b. The first engaging portion 142a is formed in a shape that engages with the second hole 115e without loosening. The second engaging portion 142a is formed to have a smaller diameter than the first engaging portion 142a.

  The holding unit 143 engages with the transformer 122, the capacitor 123, the electronic component 125, the heat sink 126, and the like of the apparatus main body 111 to fix the apparatus main body 111 inside the cover 113.

  After the first hole 115d is engaged with the first pin 141 of the cover 113 and positioned on the bottom surface of the cover 113, the tip of the first pin 141 is moved to the first hole as shown in FIG. It is fixed to the bottom surface of the cover 113 by thermal deformation so as to have a shape larger than the diameter of 114d. As a result, the heat sink 115 can be prevented from falling off from the cover 113 in the direction of the arrow Z2.

  After the heat sink 115 is positioned on the bottom surface of the cover 113 by engaging the first hole 115d with the first pin 141 of the cover 113, the tip of the first pin 141 is moved as shown in FIG. The cover 113 is fixed to the bottom surface by being thermally deformed so as to have a shape larger than the diameter of the first hole 115d. As a result, the heat sink 115 can be prevented from falling off from the cover 113 in the direction of the arrow Z2.

  FIG. 9 shows a plan view of the insulating plate 117.

  The insulating plate 117 is formed by molding a black resin material into a plate shape, punched into a desired shape, and is arranged between the apparatus main body 111 and the heat dissipation plate 115. The insulating plate 117 is mounted so as to overlap the heat radiating plate 115, and a hole portion 117 a is formed at a position corresponding to the second hole portion 115 e of the heat radiating plate 115. An engagement groove 117b is formed corresponding to the engagement groove 115f of the heat sink 115.

  The second engagement portion 142b of the second pin 142 formed on the bottom surface of the cover 113 is engaged with the hole portion 117a. The insulating plate 117 is positioned on the cover 113 when the hole 117a is engaged with the second engaging portion 142b of the second pin 142. The insulating plate 117 is positioned on the cover 113 in a state where the hole 117a is engaged with the second engagement part 142b of the second pin 142, and then the second engagement part 142b is moved from the diameter of the hole 117a. The cover 113 is fixed on the heat radiating plate 115 by being thermally deformed to have a large shape. A holding portion 143 formed on the bottom surface of the cover 113 is engaged with the engaging groove portion 117b.

  At this time, as shown in FIG. 8, an air layer A <b> 2 is formed between the heat dissipation plate 115 and the insulating plate 117 by the first engaging portion 142 a of the second pin 142 provided on the bottom surface of the cover 113. The insulating plate 117 is fixed in contact with the convex bent portion 115b of the heat sink 115.

  The cover 113 is fixed to the case 112 by screwing screws 151 into screw holes 144 formed on the bottom surface of the cover 113 via the case 112.

  According to the present embodiment, the insulating plates 116 and 117 and the heat sinks 114 and 115 are provided between the apparatus main body 111 and the case 112 and the cover 113, and between the heat sinks 114 and 115 and the insulating plates 116 and 117. By forming the air layers A1 and A2 in the air, the heat from the apparatus main body 111 is heated by the insulating plates 116 and 117 and the air layers A1 and A2 between the insulating plates 116 and 117 and the heat radiating plates 114 and 115. Can be prevented from being directly transmitted to the heat sinks 114 and 115, so that the heat from the apparatus main body 111 can be uniformly transferred to the heat sinks 114 and 115. Further, since the heat transmitted to the heat sinks 114 and 115 is further diffused by the heat sinks 114 and 115 and transmitted to the case 112 and the cover 113, the surface temperature of the case 112 and the cover 113 is made uniform. Can be. Therefore, the efficiency of heat radiation from the case 112 and the cover 113 can be improved. Further, since local heat generation of the case 112 and the cover 113 can be prevented, the maximum temperature of the surface of the case 112 and the cover 113 can be lowered.

  Next, the result of verifying the effect of the AC adapter adopting the structure of the present embodiment by experiment will be described.

  FIG. 10 is a diagram showing the temperature distribution on the surface of the AC adapter having the conventional structure, FIG. 11 is a diagram showing the temperature distribution on the surface of the AC adapter adopting the structure of this embodiment, and FIG. 12 is the surface of the AC adapter having the conventional structure. FIG. 13 is a diagram showing the temperature at a predetermined measurement point on the surface of the AC adapter having the structure of the present embodiment. FIGS. 10 and 11 are screens obtained by imaging the AC adapter with a thermal camera. The black color indicates that the temperature is high and the white color indicates that the temperature is low.

  On the screen obtained by imaging the conventional AC adapter shown in FIG. 10 with a thermal camera, the shade is large, that is, the temperature difference is large depending on the position, whereas the AC adapter of the present embodiment shown in FIG. It can be seen that the temperature difference depending on the position is small.

  Furthermore, in the screen obtained by imaging the conventional AC adapter shown in FIG. 10 with the thermal camera, there is a black portion, that is, a portion where the temperature is high, whereas in the AC adapter of this embodiment shown in FIG. It can be seen that it is not present and the temperature is relatively low.

  FIG. 12A shows the time changes of the measurement points P1 to P5 and the ambient temperature shown in FIG. 10, and FIG. 12B shows the measurement points P1 to P5 and the ambient temperature at a predetermined time. ing.

  FIG. 13A shows the time changes of the measurement points P1 to P5 and the ambient temperature shown in FIG. 11, and FIG. 13B shows the measurement points P1 to P5 and the ambient temperature at a predetermined time. ing.

  When the measurement points P1 to P5 of the conventional AC adapter shown in FIG. 12A are compared with the measurement points P1 to P5 of the AC adapter of this embodiment shown in FIG. 13A, the book shown in FIG. The time change of the temperature of the measurement points P1 to P5 of the AC adapter in the embodiment spreads, that is, the temperature difference of the measurement points P1 to P5 is the temperature of the measurement points P1 to P5 of the conventional AC adapter shown in FIG. It can be seen that it is narrower than the difference. This indicates that the surface temperature distribution of the AC adapter of this example is uniform.

  It can also be seen that the temperature itself at the measurement points P1 to P5 is smaller in the AC adapter of this embodiment shown in FIG. 13A than in the conventional AC adapter shown in FIG.

  By adopting the structure of this embodiment in this way, the surface temperature can be made uniform and low.

  In addition, although the present Example demonstrated the example which comprised the heat insulation layer by the air layer formed by arrange | positioning the heat sinks 114 and 115 and the insulation plates 116 and 117 spaced apart, a heat insulation layer is limited to an air layer. However, a configuration in which a liquid, a foamed resin, or the like is interposed may be used.

  In the present embodiment, the AC adapter is described as an example of the electronic device. However, the electronic device is not limited to the AC adapter, and can be applied to general electronic devices including a component that generates heat locally.

  In addition, this invention is not limited to the said Example, It cannot be overemphasized that a various modified example can be considered in the range which does not deviate from the summary of this invention.

It is a disassembled perspective view of one Example of this invention. It is sectional drawing of one Example of this invention. It is a block diagram of the heat sink. It is sectional drawing of the principal part of one Example of this invention. 2 is a configuration diagram of an insulating plate 116. FIG. It is a block diagram of the heat sink. 4 is a plan view of a cover 113. FIG. It is sectional drawing of the other principal part of one Example of this invention. 3 is a plan view of an insulating plate 117. FIG. It is a figure which shows the temperature distribution of the surface of the AC adapter of the conventional structure. It is a figure which shows the temperature distribution of the AC adapter surface which employ | adopted the structure of a present Example. It is a figure which shows the temperature in the predetermined | prescribed measurement point of the surface of the AC adapter of the conventional structure. It is a figure which shows the temperature in the predetermined | prescribed measurement point of the surface of the AC adapter of the structure of a present Example.

Explanation of symbols

100 AC adapter 111 Device body, 112 Case, 113 Cover 114, 115 Heat sink, 116, 117 Insulation plate 118, 119 Power cable 121 Printed wiring board, 122 Transformer, 123 Capacitor 124 Transistor, 125 Electronic component, 126 Heat sink 131 141 First pin, 132, 142 Second pin 132a First engagement portion, 132b Second engagement portion 143 Holding portion, 144 Screw hole 151 Screw A1, A2 Air layer

Claims (8)

In the housing structure of the electronic device for housing the electronic device body in the housing,
A heat radiating plate disposed on the inner surface of the housing for radiating heat;
An insulating plate interposed between the heat radiating plate and the electronic device main body;
A housing structure for an electronic device, comprising: a heat insulating layer provided between the heat radiating plate and the insulating plate.   2. The housing structure for an electronic device according to claim 1, wherein the heat insulating layer is formed of an air layer formed by arranging the heat radiating plate and the insulating plate apart from each other.   3. The electronic device according to claim 1, wherein an air layer is formed between the heat radiating plate and the housing at a predetermined portion, and the heat radiating plate and the insulating plate are in close contact with each other. Enclosure structure.   4. The electronic device casing structure according to claim 3, wherein the predetermined portion is a portion facing a position where the heat-generating component of the electronic device main body is mounted. In the power supply unit that houses the device body
A heat radiating plate disposed on the inner surface of the housing for radiating heat;
An insulating plate interposed between the heat radiating plate and the electronic device main body;
A housing structure for an electronic device, comprising: a heat insulating layer formed between the heat radiating plate and the insulating plate.   6. The power supply device according to claim 5, wherein the heat insulating layer is formed of an air layer formed by disposing the heat radiating plate and the insulating plate apart from each other.   The power supply apparatus according to claim 5 or 6, wherein an air layer is formed between the heat radiating plate and the housing at a predetermined portion, and the heat radiating plate and the insulating plate are brought into close contact with each other.   The power supply apparatus according to claim 7, wherein the predetermined part is a part facing a transformer mounted on the apparatus main body.