KR102592659B1 - PCB module having multi-directional heat-radiation structure and multi-layer PCB assembly used in the PCB module - Google Patents

Abstract

According to one embodiment of the present invention, a printed circuit board (PCB) module having a multi-faceted heat dissipation structure includes a multi-layer PCB assembly including a heat dissipation plate layer and an upper and lower PCB respectively attached to the upper and lower surfaces of the heat dissipation plate layer; and an upper case and a lower case respectively covering the upper and lower surfaces of the multilayer PCB assembly, wherein the heat dissipation plate layer includes a plurality of electrically insulating heat dissipation plates arranged on the same plane, and the plurality of heat dissipation plates are arranged on the same plane. a first heat pole in which at least one of the heat dissipation plates is in thermal contact with an electronic circuit element mounted on the upper PCB or lower PCB; and a second heat pole thermally contacting the inner surface of at least one of the upper and lower cases. A PCB module having a multi-faceted heat dissipation structure is provided.

Description

PCB module having multi-directional heat-radiation structure and multi-layer PCB assembly used in the PCB module {PCB module having multi-directional heat-radiation structure and multi-layer PCB assembly used in the PCB module}

The present invention relates to a multi-layer PCB module, and more specifically, to a PCB module with a multi-layer heat dissipation structure that can effectively dissipate heat generated from a multi-layer PCB to the outside, and to a multi-layer PCB assembly used in this module. will be.

In general, the structure of a multilayer PCB on which a power semiconductor module package is mounted is a circuit made of copper on both sides of the substrate 1a, such as FR-4, CEM-1, CEM-3, and Al METAL-PCB, as shown in Figure 1. A plurality of printed circuit boards (PCBs) 1 with printed patterns 1a and 1b are stacked in multiple layers, and each PCB is electrically insulated by a prepreg 2. Electronic circuit elements such as IC chips and power semiconductor module packages are mounted on the circuit pattern of the outermost PCB, and a heat dissipation structure is additionally installed on the surface of the multi-layer PCB structure to radiate heat generated from these electronic circuit elements to the outside. .

However, according to this general multi-layer PCB structure, as each PCB is sequentially stacked in multiple layers, heat generated from the circuit pattern of the PCB located on the inside cannot be effectively discharged, and the structure of the PCB module becomes complicated due to the heat dissipation structure installed on the surface of the multi-layer PCB. There is a disadvantage in that it becomes bulky.

Republic of Korea Patent Publication No. 10-2005-0080099 Republic of Korea Patent Publication No. 10-2015-0053874

According to one embodiment of the present invention, the purpose is to provide a multilayer PCB module structure that can quickly dissipate heat generated from a multilayer PCB to the outside through the case to improve cooling efficiency and make the PCB module compact and slim. .

According to one embodiment of the present invention, a printed circuit board (PCB) module having a multi-faceted heat dissipation structure includes a multi-layer PCB assembly including a heat dissipation plate layer and an upper and lower PCB respectively attached to the upper and lower surfaces of the heat dissipation plate layer; and an upper case and a lower case respectively covering the upper and lower surfaces of the multilayer PCB assembly, wherein the heat dissipation plate layer includes a plurality of electrically insulating heat dissipation plates arranged on the same plane, and the plurality of heat dissipation plates are arranged on the same plane. a first heat pole in which at least one of the heat dissipation plates is in thermal contact with an electronic circuit element mounted on the upper PCB or lower PCB; and a second heat pole thermally contacting the inner surface of at least one of the upper and lower cases. A PCB module having a multi-faceted heat dissipation structure is provided.

According to one embodiment of the present invention, a printed circuit board (PCB) module having a multi-faceted heat dissipation structure includes a multi-layer PCB assembly including a heat dissipation plate layer and an upper and lower PCB respectively attached to the upper and lower surfaces of the heat dissipation plate layer; and an upper case and a lower case respectively covering the upper and lower surfaces of the multilayer PCB assembly, wherein the heat dissipation plate layer includes a plurality of electrically insulating heat dissipation plates arranged on the same plane, and the plurality of heat dissipation plates are arranged on the same plane. At least one of the heat dissipation plates includes a first heat pole in thermal contact with an electronic circuit element mounted on the upper PCB or lower PCB, and at least one of the upper and lower cases, the at least one A PCB module having a multi-faceted heat dissipation structure is provided, characterized in that it includes a second heat pole in thermal contact with the heat dissipation plate.

According to one embodiment of the present invention, a printed circuit board (PCB) module having a multi-faceted heat dissipation structure includes: a multi-layer PCB assembly having a stacked structure in which a plurality of electrically insulating heat dissipation plates and a plurality of PCBs are alternately stacked one layer at a time; and an upper case and a lower case respectively covering the upper and lower surfaces of the multilayer PCB assembly, wherein at least one of the uppermost layer or the lowermost layer of the multilayer PCB assembly is a PCB layer, and at least one of the plurality of heat dissipation plates a first heat pole in which a heat dissipation plate is in thermal contact with an electronic circuit element mounted on a top or bottom PCB layer of the multilayer PCB assembly; and a second heat pole thermally contacting the inner surface of at least one of the upper and lower cases. A PCB module having a multi-faceted heat dissipation structure is provided.

According to one embodiment of the present invention, a multilayer PCB assembly used in a printed circuit board (PCB) module having a multi-faceted heat dissipation structure, comprising: an upper PCB including a first circuit pattern of the multilayer PCB assembly; a lower PCB including a second circuit pattern of the multilayer PCB assembly; and a heat dissipation plate layer interposed between the upper PCB and the lower PCB and including a plurality of electrically insulating heat dissipation plates arranged on the same plane, wherein at least one heat dissipation plate among the plurality of heat dissipation plates is, a first heat pole in thermal contact with an electronic circuit element mounted on the upper or lower PCB; and a second heat pole thermally contacting the surface of the case covering the upper or lower PCB.

According to one embodiment of the present invention, it is a multi-layer PCB assembly used in a printed circuit board (PCB) module having a multi-faceted heat dissipation structure, wherein the multi-layer PCB assembly includes a plurality of electrically insulating heat dissipation plates and a plurality of PCBs, one layer at a time. It has a stacked stacked structure, wherein at least one of the uppermost or lowermost layer of the multilayer PCB assembly is a PCB layer, and at least one heat dissipation plate of the plurality of heat dissipation plates is mounted on the uppermost or lowermost PCB layer of the multilayer PCB assembly. A first heat pole in thermal contact with the electronic circuit element; and a second heat pole thermally contacting the inner surface of at least one of the upper and lower cases covering the upper and lower surfaces of the multilayer PCB assembly, respectively. do.

According to an embodiment of the present invention, a heat dissipation plate is interposed between the upper and lower PCBs and the heat dissipation plate is configured to be in direct thermal contact with the case, thereby quickly discharging heat generated from the PCB to the outside and making the PCB module compact and slim. It has the advantage of being able to realize.

Figure 1 is a cross-sectional view of the laminated structure of a conventional multilayer PCB;
Figure 2 is a perspective view of a multilayer PCB module according to the first embodiment of the present invention;
Figure 3 is an exploded perspective view of a multilayer PCB module according to the first embodiment;
4 is a diagram for explaining an exemplary cross-sectional structure of a PCB module according to the first embodiment;
Figure 5 is a bottom perspective view of the upper case according to the first embodiment;
6 to 8 are diagrams for explaining an exemplary cross-sectional structure of a PCB module according to a modification of the first embodiment;
Figure 9 is an exploded perspective view of a multilayer PCB module according to the second embodiment;
10 is a diagram for explaining an exemplary cross-sectional structure of a PCB module according to the second embodiment;
Figure 11 is an exploded perspective view of a multilayer PCB module according to the third embodiment;
Figure 12 is a diagram for explaining an exemplary cross-sectional structure of a PCB module according to the third embodiment.

The above objects, other objects, features and advantages of the present invention will be easily understood through the following preferred embodiments related to the attached drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosure will be thorough and complete and so that the spirit of the invention can be sufficiently conveyed to those skilled in the art. In this specification, when an element is referred to as being on another element, it means that it may be formed directly on the other element or that a third element may be interposed between them.

The terminology used herein is for describing embodiments and is not intended to limit the invention. As used herein, singular forms also include plural forms, unless specifically stated otherwise in the context. As used in the specification, 'comprises' and/or 'comprising' does not exclude the presence or addition of one or more other elements.

Hereinafter, the present invention will be described in detail with reference to the drawings. In describing the specific embodiments below, various specific details have been written to explain the invention in more detail and to aid understanding. However, a reader with sufficient knowledge in the field to understand the present invention can recognize that it can be used without these various specific details. In some cases, it is mentioned in advance that when describing the invention, parts that are commonly known but are largely unrelated to the invention are not described to prevent confusion in explaining the invention.

First, the multilayer PCB module 100 according to the first embodiment will be described with reference to FIGS. 2 to 5.

Figure 2 is a perspective view of the multilayer PCB module 100 according to the first embodiment of the present invention, and Figure 3 is an exploded perspective view. And Figure 4 is a diagram for explaining an exemplary cross-sectional structure of the multilayer PCB module 100 according to the first embodiment. However, it should be noted in advance that Figure 4 is a schematic representation of the components of the PCB module 100 to easily explain them, and does not correspond to the structure of Figure 3.

First, referring to Figure 2, the multilayer PCB module 100 according to the first embodiment may be packaged in a substantially hexahedral shape, and in one embodiment, the upper case 10 and the lower case 70 are manufactured by combining them. The upper and lower cases 10 and 70 may be coupled with fastening means 15 and 16 such as bolts. Although not shown in FIG. 2, a plurality of pins (25 in FIG. 3) may protrude from the outside of the multilayer PCB module 100, and may be electrically connected to an external electronic device through these pins 25.

Referring to FIGS. 3 and 4 , the PCB module 100 may have a structure in which an upper case 10 and a lower case 70 are combined with a multilayer PCB assembly 80 interposed therebetween. The multilayer PCB assembly 80 includes a heat dissipation plate layer 40 and an upper printed circuit board (PCB) 20 and a lower printed circuit board (PCB) 60 respectively coupled to the upper and lower surfaces of the heat dissipation plate layer 40. Includes.

The upper PCB 20 includes at least one layer of circuit patterns and is generally a board with a multi-layer circuit pattern. In one embodiment, the upper PCB 20 may be manufactured with a substrate such as FR-4, CEM-1, CEM-3, Al Metal-PCB, etc., but the type of substrate is not limited thereto.

A penetrating portion 21 is formed in the upper PCB 20 so that the heat poles 411 and 412 protruding from the heat dissipation plate layer 40 can pass through. The shape or location of the penetrating portion 21 may vary depending on the circuit design of the PCB 20 in a specific embodiment. A plurality of electronic circuit elements 23 and 24 may be mounted on the upper surface of the upper PCB 20, and one or more pins 25 may protrude vertically from the surface of the board to be electrically coupled to an external electronic device. there is. Here, “electronic circuit device” may mean, for example, various passive devices or active devices, and various types of IC chips in which they are integrated.

The lower PCB 60 has the same or similar structure as the upper PCB 20. The lower PCB 60 has at least one layer of circuit patterns and may generally have a multi-layer circuit pattern. A penetrating portion 61 may be formed in the lower PCB 60 so that the heat poles 411 and 412 protruding from the heat dissipation plate layer 40 can penetrate, and the shape and location of the penetrating portion 61 are determined by the PCB 60. It may vary depending on the circuit design. A plurality of electronic circuit elements 23 and 64 may also be mounted on the surface of the lower PCB 60.

The upper PCB 20 and the lower PCB 60 may be combined with a heat dissipation plate layer 40 therebetween to form a single multi-layer PCB assembly 80. At this time, an electrically insulating prepreg 30 may be interposed between the upper PCB 20 and the heat dissipation plate layer 40, and an electrically insulating prepreg 30 may also be interposed between the lower PCB 60 and the heat dissipation plate layer 40. 50) may be interposed and combined. The prepregs 30 and 50 may be made of a material that has electrical insulation but no or little thermal insulation properties, and thus heat generated from the upper or lower PCBs 20 and 60 is well transmitted to the heat dissipation plate layer 40. desirable.

The heat dissipation plate layer 40 may be composed of a plurality of electrically insulating heat dissipation plates 41, 42, 43, and 44 arranged on the same plane. For example, in Figure 3, the heat dissipation plate layer 40 is made up of four heat dissipation plates 41 to 44, each of which has a substantially rectangular plate shape. Depending on the specific embodiment, the number and shape of heat dissipation plates forming the heat dissipation plate layer 40 may vary.

Each heat dissipation plate (41 to 44) is disposed between the upper PCB (20) and the lower PCB (60) and absorbs heat generated from each PCB (20, 60) through various paths to the case (10, 70). It performs the function of discharging. To this end, each heat dissipation plate may be made of materials with excellent thermal conductivity, such as copper (Cu), aluminum (Al), silicon carbide (SiC), and aluminum nitride (AlN). In one embodiment, a heat dissipation plate that has electrical insulation and excellent thermal conductivity can be manufactured by anodizing an aluminum plate.

At least one of the plurality of heat dissipation plates 41 to 44 may include one or more heat poles 411 and 412 formed on upper and lower surfaces. The heat poles 411 and 412 are pillar-shaped protrusions with a circular or polygonal cross-section that protrude perpendicularly from the upper and lower surfaces of the heat dissipation plate.

In the illustrated embodiment, the heat pole includes a first heat pole 411 and a second heat pole 412. The first heat pole 411 is a protrusion having a predetermined first height that protrudes from the surface of the heat dissipation plate. As shown in FIG. 4, in one embodiment, the first heat pole 411 is formed through the penetration portions 21 and 61 of the upper and lower PCBs 20 and 60 when the upper and lower PCBs 20 and 60 are coupled to the heat dissipation plate. It is formed to protrude through to have the same height as the PCB surface, and thus can be in thermal contact with the electronic circuit element 23 mounted on the surface of the upper or lower PCB (20, 60).

The second heat pole 412 is a protrusion having a predetermined second height that protrudes from the surface of the heat dissipation plate, and generally protrudes higher than the first heat pole 411. As shown in FIG. 4, the second heat pole 412 is formed through the penetration portion 21 of the PCB 20, 60 when the upper and lower PCBs 20, 60 and the upper and lower cases 10, 70 are combined. 61) and protrudes to a height that allows thermal contact with the inner surfaces of the cases 10 and 70.

According to the configuration of the first and second heat poles 411 and 412, the heat generated in the electronic circuit element 23 is absorbed by the first heat pole 411 and transferred to the heat dissipation plates 41 to 44, and this heat is transmitted to the heat dissipation plates 41 to 44. It may be transmitted to the cases 10 and 70 through the second heat pole 412 and discharged to the outside.

Some of the plurality of heat dissipation plates may be configured to include only one of the first heat pole 411 or the second heat pole 412, and other portions of the plurality of heat dissipation plates may include the first and second heat poles 411 and 412. It can be configured to include all. The number and shape of the first heat poles 411 and/or second heat poles 412 formed on each heat dissipation plate may be determined according to the specific circuit design.

In the illustrated embodiment, at least one heat dissipation plate 43 or 44 among the plurality of heat dissipation plates may further include one or more penetration areas 413 penetrating the upper and lower surfaces of the heat dissipation plate. This penetrating area 413 may be provided to provide a contact point or contact area where electronic circuit elements mounted on the upper PCB 20 and the lower PCB 60 can physically or electrically contact each other.

For example, referring to Figures 3 and 4, the electronic circuit element 24 mounted on the upper PCB 20 and the electronic circuit element 64 mounted on the lower PCB 60 are each part of the coil and heat dissipation. When the upper PCB (20) and lower PCB (60) are combined with the plates (43, 44) in between, the two circuit elements (24, 64) are physically exposed through the penetration area (413) of the heat dissipation plates (43, 44). It can function as a coil by being in electrical or electrical contact.

Therefore, from this point of view, at least some of the electronic circuit elements mounted on the upper PCB 20 or the lower PCB 60 may have been assembled into a multilayer PCB assembly 80 by combining the upper PCB 20 and the lower PCB 60. Only then can a specific function be performed. That is, the existing upper PCB (20) and lower PCB (60) performed a complete circuit function in a multi-layer PCB state combined with each other, but in the present invention, the middle of this multi-layer PCB structure is separated and divided into an upper PCB and a lower PCB, and these are separated. By interposing the heat dissipation plate layer 40 between the PCBs and reconnecting the upper and lower PCBs, a multilayer PCB assembly 80 having an internal heat dissipation structure as in the present invention is implemented.

Now, the upper and lower cases 10 and 70 will be described in detail with reference to FIGS. 3 to 5. Figure 5 is a bottom perspective view of the upper case 10 according to an embodiment, showing the upper case 10 of Figure 3 viewed from bottom up.

The upper and lower cases 10 and 70 are combined to cover the surfaces of the upper PCB 20 and the lower PCB 60, respectively, so that the heat generated from each PCB 20 and 60 and transmitted from the heat dissipation plate layer 40 Absorbs heat and releases it to the outside. The upper and lower cases 10 and 70 may perform the function of a heat sink by themselves or may be combined with another external heat sink to transfer heat to this external heat sink.

To this end, the upper and lower cases 10 and 70 may be made of materials with excellent thermal conductivity, such as copper (Cu), aluminum (Al), silicon carbide (SiC), and aluminum nitride (AlN). In one embodiment, cases 10 and 70 that have electrical insulation and excellent thermal conductivity can be made by anodizing aluminum cases.

The upper case 10 covers a portion of the top and sides of the multilayer PCB assembly 80 and the lower case 70 covers a portion of the bottom and sides of the multilayer PCB assembly 80.

Each of the upper and lower cases (10, 70) has a first contact thermally contacting the electronic circuit elements (23, 24, 64) mounted on the upper PCB (20) or lower PCB (60) on the inner surface of the case. It may include areas (14, 16, 17, 74, 76).

In the upper case 10, the first contact areas 14 and 16 are areas that contact the electronic circuit element 23 mounted on the upper PCB 20, for example, the contact areas 14 and 16 in Figure 6. ) is a protrusion protruding from the inner surface 13 of the case 10. The contact areas 14 and 16 in the form of such protrusions may extend integrally with the inner surface 13 of the case 10 and protrude above the surface, as shown in FIG. 4 .

As another example, as shown in FIG. 4, another contact area 17 of the first contact areas may be a groove whose height is lower than the inner surface of the case 10, and may be used for a relatively bulky electronic circuit such as a coil. It may be in contact with the element 24. In this way, whether the first contact area is a protrusion or a groove is related to the volume (or height) of the electronic circuit element in contact with this contact area, so specific specifications such as the shape, number, and location of the first contact area depending on the specific embodiment. Of course, this may change.

Referring to Figure 3, first contact areas 74 and 76 may be formed in the lower case 70 as well. In the illustrated embodiment, the contact area 74 has the shape of a protrusion and the contact area 76 has the shape of a groove. You can see that it is. In addition, as shown in FIGS. 3 and 4, the protrusion-shaped contact area 74 may be formed by attaching a member made of a different material from the lower case 70 to the surface 73 of the lower case 70, e.g. For example, it can be implemented as a thermally conductive member such as a thermal pad.

In addition, as shown in Figures 3 and 5, each of the upper and lower cases 10 and 70 has second contact areas 15 and 75 that are in thermal contact with the second heat pole 412 protruding from the heat dissipation plate. Includes more on the inner surface of the case. The second contact areas 15 and 75 may protrude with steps from the inner surfaces 13 and 73 of the cases 10 and 70 depending on the height and shape of the second heat pole 412, or may protrude from the inner surfaces 13 and 73 of the cases 10 and 70, respectively. 73), it may have the same surface height, and it will be understood that the shape, number, and location of the second contact areas may vary depending on the specific embodiment.

According to the configuration of the multilayer PCB assembly 80 and the cases 10 and 70 surrounding it as described above, heat generated from the PCB can be discharged to the outside of the PCB module 100 through various paths as follows.

First, the heat generated from the electronic circuit elements 23, 24, and 64 mounted on the upper PCB 20 and the lower PCB 60 is generated by the first heat formed on the heat dissipation plates 41 to 44 of the heat dissipation plate layer 40. It is sent to Paul (411). Since the first heat pole 411 penetrates the PCB (20, 60) substrate and is in direct thermal contact with the electronic circuit elements (23, 24, 64), it can absorb the heat of the electronic circuit elements much more quickly than before. there is.

Second, the heat absorbed by the heat dissipation plates (41 to 44) from the upper and lower PCBs (20, 60) is transferred to the upper and lower cases (10, 70) through the second heat poles (412) of the heat dissipation plate to the PCB module. (100) Can be released to the outside. The second heat pole 412 also penetrates the PCB (20,60) substrate and is in direct thermal contact with the upper and lower cases (10,70), so the heat of the heat dissipation plate is dissipated into the case (10,70) much more quickly than before. ) can be discharged.

Third, the heat generated from the electronic circuit elements mounted on the upper PCB 20 and the lower PCB 60 is generated not only by the first heat pole 411 but also by the first contact areas 14, It is also delivered to case (10, 70) through 16, 17, 74, 76). As shown in Figure 4, one side of the electronic circuit element is in contact with the first heat pole 411 to discharge heat to the first heat pole 411, and the opposite side is in contact with the first heat pole 411. Since it is in direct thermal contact with the areas 14, 17, 74, and 76, heat can be discharged through the first contact area. That is, since both sides of the electronic circuit elements mounted on the PCBs 20 and 60 are in contact with the heat transfer member, heat can be discharged much more quickly than before.

In this way, by configuring the multilayer PCB assembly 80 and the cases 10 and 70 according to the present invention, the PCB module 100 has a multi-layer heat dissipation structure capable of discharging heat through various paths. In addition, as an additional effect of this configuration, the internal space of the PCB module 100 can be significantly reduced, which has the technical effect of producing a compact and slim PCB module.

For example, assuming that a TO-220 chip is mounted as an electronic circuit element to be mounted on the PCB (20, 60), conventionally, the TO-220 chip was mounted vertically on a multi-layer PCB board, and the heat generated from the chip was It was transferred to the case through the (air-filled) space inside the case and released outside the case.

However, according to an embodiment of the present invention described above, the TO-220 chip is laid horizontally and mounted on the PCB (20, 60), but one side of the chip is in contact with the first heat pole 411 and the other side is in contact with the first contact area. It can be mounted by contacting (14,74). Therefore, since the chip can be placed horizontally, the empty space inside the PCB module 100 can be significantly reduced, the thickness of the module 100 can be made thin, and the heat generated from the chip can be dissipated through the heat dissipation plate layer 40 on both sides of the chip. ) and case (10,70) can be used to discharge more quickly.

Therefore, if the present invention is applied to, for example, a high-power power device package, integration of power devices becomes possible. For example, as a result of the present inventor's experiment applying the configuration of the PCB module 100 of the present invention described above to an automobile OBC (On Board Charger), the volume of the 13KW OBC device was 20 liters when the existing multi-layer PCB structure was used, but the volume of the 13KW OBC device was 20 liters. It was confirmed that when the invention's PCB module configuration was applied, the volume was significantly reduced to 6 liters and the heat dissipation effect was increased by 30-40% compared to the previous version.

Now, several modifications of the PCB module 100 of the present invention will be briefly described with reference to FIGS. 6 to 8.

Figure 6 is a diagram schematically showing an exemplary cross-sectional structure of a PCB module 200 according to another modification. Compared to the PCB module 100 of FIG. 4, the internal structure of the module 200 of FIG. 6 is almost the same or similar to the module 100, so description is omitted. However, in the embodiment of Figure 6, the upper and lower cases 10 and 70 of the PCB module 200 do not cover the sides of the multilayer PCB assembly 80, but cover the upper and lower surfaces of the multilayer PCB assembly 80. .

The area of the multilayer PCB assembly 80 that is not covered by the cases 10 and 70 protrudes to the side of the cases 10 and 70 as shown, and a through hole 85, for example, may be formed in the protruding portion. You can. The through hole 85 is for connection with another device, for example, and the multilayer PCB assembly 80 can be electrically or physically connected to other electronic devices outside the PCB module 200 through the through hole 85. there is.

Figure 7 is a diagram schematically showing an exemplary cross-sectional structure of a PCB module 300 according to another modification. Compared to the PCB module 100 of FIG. 4, the internal structure of the module 300 of FIG. 7 is almost the same or similar to the module 100, so description is omitted. However, in the embodiment of Figure 7, the first uneven shape 79 is formed on the outer surface of the lower case 70 of the PCB module 300, and an additional heat dissipation structure 90 is formed on the outer surface of the lower case 70. This is attached. A second uneven shape 91 that engages and contacts the first uneven shape 79 is formed on the surface of the heat dissipation structure 90, and according to this configuration, the heat of the lower case 70 can be discharged to the outside more quickly. You can.

7 illustrates that the heat dissipation structure 90 is attached to the lower case 70, but for example, the heat dissipation structure 90 may also be attached to the upper case 10. Additionally, concavo-convex shapes 79 and 91 may be formed between the cases 10 and 70 and the heat dissipation structure 90, but these concavo-convex shapes may not be present.

Figure 8 is a diagram schematically showing an exemplary cross-sectional structure of a PCB module 400 according to another modification. Compared to the PCB module 100 of FIG. 4, the internal structure of the module 400 of FIG. 8 is almost the same or similar to that of the module 100. However, in the embodiment of Figure 8, a second heat pole is in thermal contact with at least one heat dissipation plate of the heat dissipation plate layer 40 on the inner surface of at least one of the upper and lower cases 10 and 70 of the PCB module 400. (412) is formed. That is, in the PCB module 400 of Figure 8, the second heat pole 412 connecting the heat dissipation plate layer 40 and the cases 10 and 70 is formed on the side of the cases 10 and 70.

Therefore, the second heat pole 412 that thermally connects the heat dissipation plate layer 40 and the cases 10 and 70 may be formed on either the heat dissipation plate or the case. As an alternative embodiment, the second heat pole 412 ) will be formed as an independent member separate from the heat dissipation plate or case 10, 70, and then both end surfaces may be manufactured by combining them with the heat dissipation plate and the case, respectively.

Figure 9 is an exploded perspective view of the multilayer PCB module 500 according to the second embodiment, and Figure 10 is a diagram for explaining an exemplary cross-sectional structure of the PCB module 500.

Referring to FIGS. 9 and 10 , the PCB module 500 of the second embodiment may have a structure in which an upper case 10 and a lower case 70 are combined with a multilayer PCB assembly 80 interposed therebetween. The multilayer PCB assembly 80 includes a heat dissipation plate layer 40 and an upper printed circuit board (PCB) 20 and a lower printed circuit board (PCB) 60 respectively coupled to the upper and lower surfaces of the heat dissipation plate layer 40. Includes.

Compared with the module 100 of the first embodiment of FIGS. 3 and 4, the configuration of the module 500 of the second embodiment and the configuration of the multilayer PCB assembly 80 are the same or similar to those of the module 100 of the first embodiment. And detailed description of the multilayer PCB assembly 80, upper case 10, and lower case 70 will be omitted.

However, as shown in Figure 9, in the module 500 of the second embodiment, the heat dissipation plate layer 40 includes a plurality of heat dissipation plates 41, 43, and 44 and at least one heat dissipation plate arranged on the same plane. Includes a PCB (45). That is, compared to the first embodiment, it can be seen that some of the plurality of heat dissipation plates have been replaced with PCBs.

This replaced PCB 45 may be a board with at least one layer of circuit patterns formed on the surface and/or inside the board.

Although not shown in the drawing, some circuit patterns of the PCB 45 interposed between the upper PCB 20 and the lower PCB 60 are connected to the upper and/or It can be electrically connected to some circuit patterns of the lower PCBs 20 and 60.

FIG. 11 is an exploded perspective view of the multilayer PCB module 600 according to the third embodiment, and FIG. 12 is a diagram for explaining an exemplary cross-sectional structure of the PCB module 600.

Referring to Figures 11 and 12, the PCB module 600 of the third embodiment may have a structure in which an upper case 10 and a lower case 70 are combined with a multi-layer PCB assembly 80 in between, and the upper case 10 and the lower case 70 are combined. Since the case 10 and the lower case 70 are the same or similar to those of the first embodiment, detailed descriptions are omitted.

However, as shown in Figures 11 and 12, in the module 600 of the third embodiment, the multi-layer PCB assembly 80 may have a structure in which several layers of PCB and several layers of heat dissipation plates are stacked. That is, in the illustrated embodiment, the multilayer PCB assembly 80 has a stacked structure in which a plurality of electrically insulating heat dissipation plates 410 and 420 and a plurality of PCBs 210, 220 and 610 are alternately stacked one layer at a time. And in this laminated structure of the heat dissipation plate and the PCB, prepreg layers 310, 320, 330, and 340 may be disposed between the heat dissipation plates 410 and 420 and the PCBs 210, 220 and 610.

In one embodiment, at least one of the top layer or bottom layer of the multilayer PCB assembly 80 may be a PCB layer. For example, in the illustrated embodiment, the uppermost and lowermost layers of the multilayer PCB assembly 80 are composed of PCBs 210 and 610, and one or more electronic circuit elements 23, 24, and 64 are disposed on the surfaces of the uppermost and lowermost PCBs 210 and 610. It can be installed.

At this time, the heat dissipation plate 410 disposed below the top layer PCB 210 is in thermal contact with the electronic circuit elements 23 and 24 mounted on the top layer PCB 210 and the first heat pole 411 and the upper case. It may include a second heat pole 412 in thermal contact with the inner surface of (10).

Likewise, the heat dissipation plate 420 disposed on the lowest layer PCB 610 is the first heat pole 411 and the lower case 70 that are in thermal contact with the electronic circuit elements 23 and 64 mounted on the lowest layer PCB 610. ) may include a second heat pole 412 in thermal contact with the inner surface of the.

In addition, in the illustrated embodiment, at least one heat dissipation plate 410 of the heat dissipation plates is provided with one or more third heat dissipation plates 420 that are in thermal contact with the adjacent heat dissipation plate 420 with the PCB 220 interposed therebetween. It may further include a hit pole (414). In the drawing, the third heat pole 414 is shown formed on the upper heat dissipation plate 410, but alternatively, the third heat pole 414 may be formed on the lower plate 420. One or more penetration portions 21 and 61 are formed in the uppermost or lowermost layer of the PCB of the multilayer PCB assembly 80 so that the first heat pole 411 and/or the second heat pole 412 can be inserted therethrough. The first heat pole 411 is formed to protrude at the same height as the surface of the top or bottom layer PCB (210,610), and thus thermally contacts the electronic circuit element 23 mounted on the surface of the PCB (210,610) to form an electronic circuit. It can absorb the heat of the device.

In addition, the second heat pole 412 may be formed to protrude to a height that contacts the inner surface of the upper case 10 or the lower case 70, thereby dissipating heat from the heat dissipation plates 410 and 420 into the upper and lower cases 10. ,70).

As described above, those skilled in the art will understand that various modifications and variations can be made from the description in the above specification. For example, as in the first and second embodiments of FIGS. 3 to 10, a configuration in which the heat dissipation plate layer 40 is composed of a plurality of heat dissipation plates arranged on the same plane can be applied to the third embodiment. In this case, at least one PCB layer among each PCB (210, 220, 610) of Figure 11 or Figure 12 may be composed of a plurality of heat dissipation plates.

Additionally, the configuration of the modified examples of FIGS. 6 to 8 may be applied to the third embodiment. For example, in Figure 12, an additional heat dissipation structure is attached to the outer surface of at least one of the upper and lower cases 10 and 70, and an uneven shape may be formed between the at least one case and the heat dissipation structure.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the claims and equivalents thereof as well as the claims described later.

100, 200, 300, 400, 500, 600: Multilayer PCB modules
10, 70: case
20, 40, 45, 210, 220, 610: PCB
30, 50, 310, 320, 330, 340: prepreg
40: Heat dissipation plate layer
41, 42, 43, 44, 410, 420: Heat dissipation plate
80: Multilayer PCB assembly
90: Heat dissipation structure

Claims (27)

A printed circuit board (PCB) module with a multi-faceted heat dissipation structure,
A multi-layer PCB assembly (80) including a heat dissipation plate layer (40) and an upper PCB (20) and a lower PCB (60) attached to the upper and lower surfaces of the heat dissipation plate layer, respectively; and
It includes an upper case 10 and a lower case 70 that cover the upper and lower surfaces of the multilayer PCB assembly, respectively,
The heat dissipation plate layer 40 includes a plurality of electrically insulating heat dissipation plates 41, 42, 43, and 44 arranged on the same plane,
At least one heat dissipation plate among the plurality of heat dissipation plates,
a first heat pole in thermal contact with an electronic circuit element mounted on the upper PCB (20) or lower PCB (60); and
A second heat pole thermally contacting the inner surface of at least one of the upper and lower cases 10 and 70,
A contact area on the inner surface of at least one of the upper case and the lower case is in thermal contact with an electronic circuit element mounted on the upper PCB or lower PCB, wherein the contact area is an inner surface of the upper case or lower case. A PCB module with a multi-faceted heat dissipation structure, characterized in that it is formed as a protrusion protruding from or as a groove lower in height than the inner surface of the upper case or lower case.
delete According to claim 1,
A PCB module with a multi-faceted heat dissipation structure, wherein the contact area includes a thermal pad. According to claim 1,
One or more penetrating areas penetrating the upper and lower surfaces of the at least one heat dissipation plate are formed,
wherein the multilayer PCB assembly (80) includes one or more contact points or contact areas that establish physical or electrical contact between the upper PCB and the lower PCB through a penetration area of the at least one heat dissipation plate. A PCB module with a structure. According to claim 1,
An electrically insulating upper prepreg (30) interposed between the heat dissipation plate layer (40) and the upper PCB (20); and
A PCB module having a multi-faceted heat dissipation structure, characterized in that it further comprises an electrically insulating lower prepreg (50) interposed between the heat dissipation plate layer (40) and the lower PCB (60). According to claim 1,
An outer surface of at least one of the upper and lower cases is formed into a first concave-convex shape,
A PCB module having a multi-faceted heat dissipation structure, characterized in that it further comprises a heat dissipation structure attached to the outer surface of the at least one case and having a second uneven shape in contact with the first uneven shape. According to claim 1,
The heat dissipation plate layer 40 further includes at least one PCB 45 arranged on the same plane as the plurality of heat dissipation plates,
A PCB module having a multi-faceted heat dissipation structure, characterized in that at least one layer of circuit pattern is formed on the at least one PCB. A printed circuit board (PCB) module with a multi-faceted heat dissipation structure,
A multi-layer PCB assembly (80) including a heat dissipation plate layer (40) and an upper PCB (20) and a lower PCB (60) attached to the upper and lower surfaces of the heat dissipation plate layer, respectively; and
It includes an upper case 10 and a lower case 70 that cover the upper and lower surfaces of the multilayer PCB assembly, respectively,
The heat dissipation plate layer 40 includes a plurality of electrically insulating heat dissipation plates 41, 42, 43, and 44 arranged on the same plane,
At least one heat dissipation plate among the plurality of heat dissipation plates includes a first heat pole in thermal contact with an electronic circuit element mounted on the upper PCB 20 or lower PCB 60,
At least one of the upper and lower cases (10, 70) includes a second heat pole in thermal contact with the at least one heat dissipation plate,
It further includes a contact area on the inner surface of at least one of the upper case and the lower case, in thermal contact with an electronic circuit element mounted on the upper PCB or lower PCB, wherein the contact area is inside the upper case or lower case. A PCB module having a multi-faceted heat dissipation structure, characterized in that it is formed as a protrusion protruding from the surface or as a groove whose height is lower than the inner surface of the upper case or lower case.
delete According to claim 8,
A PCB module having a multi-faceted heat dissipation structure, characterized in that one or more penetration parts through which the first heat pole or the second heat pole is inserted are formed in at least one of the upper PCB and the lower PCB. According to claim 8,
An electrically insulating upper prepreg (30) interposed between the heat dissipation plate layer (40) and the upper PCB (20); and
A PCB module having a multi-faceted heat dissipation structure, characterized in that it further comprises an electrically insulating lower prepreg (50) interposed between the heat dissipation plate layer (40) and the lower PCB (60). According to claim 8,
The heat dissipation plate layer 40 includes the plurality of heat dissipation plates and Further comprising at least one PCB (45) arranged on the same plane,
A PCB module having a multi-faceted heat dissipation structure, characterized in that at least one layer of circuit pattern is formed on the at least one PCB. A printed circuit board (PCB) module with a multi-faceted heat dissipation structure,
A multi-layer PCB assembly (80) having a stacked structure in which a plurality of electrically insulating heat dissipation plates and a plurality of PCBs are alternately stacked one layer at a time. and
It includes an upper case 10 and a lower case 70 that cover the upper and lower surfaces of the multilayer PCB assembly, respectively,
At least one of the top layer or bottom layer of the multilayer PCB assembly 80 is a PCB layer,
At least one heat dissipation plate among the plurality of heat dissipation plates,
a first heat pole in thermal contact with an electronic circuit element mounted on the uppermost or lowermost PCB layer of the multilayer PCB assembly; and
A second heat pole thermally contacting the inner surface of at least one of the upper and lower cases 10 and 70,
A contact area is included on the inner surface of at least one of the upper case and the lower case, in thermal contact with an electronic circuit element mounted on the uppermost or lowermost PCB layer, and the contact area is inside the upper case or lower case. A PCB module with a multi-faceted heat dissipation structure, characterized in that it is formed as a protrusion protruding from the surface or as a groove whose height is lower than the inner surface of the upper case or lower case.
delete According to claim 13,
At least one penetration part through which the first heat pole or the second heat pole is inserted is formed in the uppermost or lowermost PCB layer,
The first heat pole is formed to protrude at the same height as the surface of the uppermost or lowermost PCB layer, and the second heat pole is formed to protrude to a height that contacts the inner surface of the upper case or lower case. , PCB module with multi-faceted heat dissipation structure. According to claim 13,
A PCB module having a multi-faceted heat dissipation structure, characterized in that, in the laminate structure of the heat dissipation plate and the PCB, a prepreg layer is interposed between the heat dissipation plate and the PCB. According to claim 13,
An outer surface of at least one of the upper and lower cases is formed into a first concave-convex shape,
A PCB module having a multi-faceted heat dissipation structure, characterized in that it further comprises a heat dissipation structure attached to the outer surface of the at least one case and having a second uneven shape in contact with the first uneven shape. It is a multi-layer PCB assembly used in a printed circuit board (PCB) module with a multi-faceted heat dissipation structure,
an upper PCB (20) including a first circuit pattern of the multilayer PCB assembly;
a lower PCB (60) including a second circuit pattern of the multilayer PCB assembly; and
It includes a heat dissipation plate layer (40) interposed between the upper PCB and the lower PCB and including a plurality of electrically insulating heat dissipation plates (41, 42, 43, 44) arranged on the same plane,
At least one heat dissipation plate among the plurality of heat dissipation plates,
a first heat pole in thermal contact with an electronic circuit element mounted on the upper PCB or lower PCB; and
It includes a second heat pole that thermally contacts the surface of the case covering the upper PCB or lower PCB,
The case further includes a contact area on the inner surface of the case that thermally contacts an electronic circuit element mounted on the upper PCB or lower PCB, wherein the contact area is a protrusion protruding from the inner surface of the case or an inner surface of the case. A multilayer PCB assembly characterized in that it is formed with a groove of lower height.
According to claim 18,
One or more penetration portions through which the first heat pole or second heat pole is inserted are formed in the upper or lower PCB,
The first heat pole is formed to protrude at the same height as the surface of the upper or lower PCB, and the second heat pole is formed to protrude to a height that contacts the inner surface of the case. According to claim 18,
The first heat pole absorbs heat generated from electronic circuit elements mounted on the upper or lower PCB, and the second heat pole is configured to radiate heat from the heat dissipation plate to the case. According to claim 18,
An electrically insulating upper prepreg (30) interposed between the heat dissipation plate layer and the upper PCB; and
A multilayer PCB assembly further comprising an electrically insulating lower prepreg (50) interposed between the heat dissipation plate layer and the lower PCB. According to claim 18,
A multilayer PCB assembly, wherein the heat dissipation plate layer (40) further includes at least one PCB (45) arranged on the same plane as the plurality of heat dissipation plates. It is a multi-layer PCB assembly used in a printed circuit board (PCB) module with a multi-faceted heat dissipation structure,
The multilayer PCB assembly has a stacked structure in which a plurality of electrically insulating heat dissipation plates and a plurality of PCBs are alternately stacked one layer at a time,
At least one of the top layer or bottom layer of the multilayer PCB assembly is a PCB layer,
At least one heat dissipation plate among the plurality of heat dissipation plates,
a first heat pole in thermal contact with an electronic circuit element mounted on the uppermost or lowermost PCB layer of the multilayer PCB assembly; and
A second heat pole thermally contacting the inner surface of at least one of the upper and lower cases covering the upper and lower surfaces of the multilayer PCB assembly, respectively,
The inner surface of at least one of the upper case and the lower case further includes a contact area in thermal contact with an electronic circuit element mounted on the uppermost PCB or the lowermost PCB, wherein the contact area is inside the upper case or lower case. A multilayer PCB assembly characterized in that it is formed as a protrusion protruding from the surface or as a groove whose height is lower than the inner surface of the upper case or lower case.
According to claim 23,
At least one penetration part through which the first heat pole or the second heat pole is inserted is formed in the uppermost or lowermost PCB layer,
The first heat pole is formed to protrude at the same height as the surface of the uppermost or lowermost PCB layer, and the second heat pole is formed to protrude to a height that contacts the inner surface of the at least one case. PCB assembly. According to claim 23,
The first heat pole absorbs heat generated from electronic circuit elements mounted on the upper or lower PCB, and the second heat pole is configured to radiate heat from the heat dissipation plate to the case. According to claim 23,
A multilayer PCB assembly, characterized in that at least one heat dissipation plate among the plurality of heat dissipation plates further includes a third heat pole in thermal contact with an adjacent heat dissipation plate with one layer of PCB interposed therebetween. According to claim 23,
A multilayer PCB assembly, characterized in that, in the laminated structure of the heat dissipation plate and the PCB, a prepreg layer is interposed between the heat dissipation plate and the PCB.

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