KR20050080099A - Install structure of heat sink improved radiating efficiency for power semiconductor and it's install method - Google Patents
Install structure of heat sink improved radiating efficiency for power semiconductor and it's install method Download PDFInfo
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- KR20050080099A KR20050080099A KR1020050062501A KR20050062501A KR20050080099A KR 20050080099 A KR20050080099 A KR 20050080099A KR 1020050062501 A KR1020050062501 A KR 1020050062501A KR 20050062501 A KR20050062501 A KR 20050062501A KR 20050080099 A KR20050080099 A KR 20050080099A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
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Abstract
본 발명은 방열효율을 극대화시킨 전력용 반도체소자의 설치구조 및 그 설치방법에 관한 것으로, 더욱 상세하게는 인쇄회로기판에 실장되어 전력의 흐름을 제어하는 전력용 반도체소자가 다른 회로소자가 설치되지 않은 인쇄회로기판의 후면에 설치되고, 상기 전력용 반도체소자에서 발생되는 열을 외부로 발산하는 방열판도 인쇄회로기판의 후면에 설치되어, 인쇄회로기판에 전면에 설치된 회로소자에 상관없이 방열판의 면적을 최대로 할 수 있게 됨으로써, 방열판의 방열효율을 극대화할 수 있게 한 방열효율을 극대화시킨 전력용 반도체소자의 방열판 설치구조 및 그 설치방법에 관한 것이다. The present invention relates to an installation structure of a power semiconductor device for maximizing heat dissipation efficiency and a method of installing the same. More specifically, the power semiconductor device for controlling the flow of power is mounted on a printed circuit board. The heat sink is installed at the rear of the printed circuit board, and the heat sink for dissipating heat generated by the power semiconductor device to the outside is also installed at the rear of the printed circuit board, regardless of the circuit elements installed at the front of the printed circuit board. Since it can be maximized, the present invention relates to a heat sink installation structure of the power semiconductor device for maximizing the heat radiation efficiency to maximize the heat radiation efficiency of the heat sink and its installation method.
본 발명에 따르면, 인쇄회로기판에 실장된 전력용 반도체소자의 열을 외부로 발산하는 방열판 설치구조에 있어서, 상기 전력용 반도체소자는 회로소자가 설치되지 않은 인쇄회로기판의 후면에 설치되고, 방열판은 인쇄회로기판의 면적과 동일한 크기로 전력용 반도체소자의 일면과 접하도록 인쇄회로기판에 설치된 다수개의 간격유지구로 관통되는 고정볼트에 의해 인쇄회로기판의 후면과 일정간격으로 이격되게 설치됨을 특징으로 한 방열효율을 극대화시킨 전력용 반도체소자의 방열판 설치구조 및 그 설치방법이 제공된다.According to the present invention, in the heat sink installation structure for dissipating heat to the outside of the power semiconductor device mounted on the printed circuit board, the power semiconductor device is installed on the back of the printed circuit board is not installed, the heat sink Is installed to be spaced apart from the rear surface of the printed circuit board by a fixed bolt that is penetrated by a plurality of interval holding holes installed on the printed circuit board to contact the one surface of the power semiconductor device in the same size as the area of the printed circuit board. Provided are a heat sink mounting structure and a method of installing the semiconductor device for power, which maximizes the heat radiation efficiency.
Description
본 발명은 방열효율을 극대화시킨 전력용 반도체소자의 방열판 설치구조 및 그 설치방법에 관한 것으로, 더욱 상세하게는 인쇄회로기판에 실장되어 전력의 흐름을 제어하는 전력용 반도체소자가 다른 회로소자가 설치되지 않은 인쇄회로기판의 후면에 설치되고, 상기 전력용 반도체소자에서 발생되는 열을 외부로 발산하는 방열판도 인쇄회로기판의 후면에 설치되어, 인쇄회로기판에 전면에 설치된 회로소자에 상관없이 상기 방열판의 면적을 최대화할 수 있The present invention relates to a heat sink installation structure and a method of installing the power semiconductor device for maximizing the heat dissipation efficiency, and more particularly, the circuit device is installed on the printed circuit board and other power semiconductor devices for controlling the flow of power The heat sink is installed on the back of the non-printed printed circuit board, the heat sink for dissipating heat generated by the power semiconductor device to the outside is also installed on the back of the printed circuit board, regardless of the circuit elements installed on the front of the printed circuit board. To maximize the area of
게 됨으로써, 방열판의 방열효율을 극대화할 수 있게 한 방열효율을 극대화시킨 전력용 반도체소자의 방열판 설치구조 및 그 설치방법에 관한 것이다. The present invention relates to a heat sink mounting structure and a method for installing the same of the power semiconductor device for maximizing the heat radiation efficiency to maximize the heat radiation efficiency of the heat sink.
일반적으로 전력용 반도체소자는 인쇄회로기판에 실장되어 전류나 전압의 크기와 주파수 및 위상 등을 변환하여 전력의 흐름을 제어하는 것으로, 다양한 종류의 전기전자기기에 널리 사용되고 있다. 상기 전력용 반도체소자는 운용 중에 고온의 열이 자체적으로 발생되는데, 이러한 고온의 열을 충분히 외부로 발산하지 못하게 되면, 온도에 따른 작동 오차로 인해 그 작동을 제대로 할 수 없게 될 뿐만 아니라 그 사용수명도 단축되고, 전기기기장치의 고장원인을 제공하게 된다. 따라서 상기 고온의 열을 외부로 발산하는 방열판이 일면에 접하도록 방열판과 함께 인쇄회로기판에 실장된다. In general, a power semiconductor device is mounted on a printed circuit board to control the flow of power by converting the magnitude, frequency, and phase of current or voltage, and is widely used in various types of electric and electronic devices. The power semiconductor device itself generates a high temperature of heat during operation, if not enough to dissipate such high temperature heat to the outside, due to the operating error due to the temperature not only can not operate properly, but the service life It is also shortened, and provides a cause of failure of the electrical equipment. Accordingly, the heat sink for dissipating the high temperature heat to the outside is mounted on the printed circuit board together with the heat sink.
그러나 이러한 종래의 방열판은 전력용 반도체소자의 일면과 접하게 전력용 반도체소자가 실장된 인쇄회로기판의 전면에 설치되어, 인쇄회로기판의 전면에 설치된 다른 회로소자들로 인해 방열판의 면적이 제한되고, 방열판의 방열효율을 극대화할 수 없는 문제점이 있었다. 이에 따라 방열판의 방열효율을 극대화할 수 있도록 하기 위해 상기 방열판의 면적을 크게 하게 되면, 방열판을 인쇄회로기판에 설치하기 위해 전력용 반도체소자와 다른 회로소자들의 사이에 넓은 공간을 필요로 하기 때문에 인쇄회로기판의 평면크기도 불가피하게 증대시켜야 되는 문제점이 있었다. However, such a conventional heat sink is installed on the front of the printed circuit board on which the power semiconductor device is mounted in contact with one surface of the power semiconductor device, the area of the heat sink is limited due to other circuit elements installed on the front of the printed circuit board, There was a problem that can not maximize the heat radiation efficiency of the heat sink. Accordingly, in order to maximize the heat dissipation efficiency of the heat sink, when the area of the heat sink is increased, a large space is required between the power semiconductor device and the other circuit elements in order to install the heat sink on the printed circuit board. The plane size of the circuit board also has to be inevitably increased.
본 발명은 상기와 같은 문제점을 해결하기 위하여 발명된 것으로, 인쇄회로기판에 실장되어 전류나 전압의 크기와 주파수 및 위상 등을 변환하여 전력의 흐름을 제어하는 전력용 반도체소자에 설치되는 방열판의 방열효율을 극대화시킬 수 있도록 하기 위하여, 인쇄회로기판에 실장된 전력용 반도체소자의 열을 외부로 발산하는 방열판 설치구조에 있어서, 상기 전력용 반도체소자는 회로소자가 설치되지 않은 인쇄회로기판의 후면에 설치되고, 방열판은 인쇄회로기판의 면적과 동일한 크기로 전력용 반도체소자의 일면과 접하도록 인쇄회로기판에 설치된 다수개의 간격유지구로 관통되는 고정볼트에 의해 인쇄회로기판의 후면과 일정간격으로 이격되게 설치됨을 특징으로 한 방열효율을 극대화시킨 전력용 반도체소자의 방열판 설치구조 및 그 설치방법을 제공함에 있다.The present invention has been invented to solve the above problems, the heat sink is mounted on a printed circuit board is installed in the power semiconductor device for controlling the flow of power by changing the magnitude, frequency and phase of the current or voltage, etc. In order to maximize the thermal efficiency, in the heat sink installation structure for dissipating the heat of the power semiconductor device mounted on the printed circuit board to the outside, the power semiconductor device on the back of the printed circuit board is not installed The heat sink is spaced apart from the rear surface of the printed circuit board by a fixed bolt that is penetrated by a plurality of gap retention holes installed in the printed circuit board to contact the one surface of the power semiconductor element with the same size as the printed circuit board. Heat sink installation structure of power semiconductor device for maximizing heat radiation efficiency It provides a method to provide.
이하 본 발명의 바람직한 실시예를 첨부한 도면을 참조하여 상세하게 설명하면 다음과 같다. Hereinafter, described in detail with reference to the accompanying drawings, preferred embodiments of the present invention.
본 발명의 방열효율을 극대화시킨 전력용 반도체소자의 방열판 설치구조는 도 1에 도시된 바와 같이 인쇄회로기판(1)에 실장되어 전류나 전압의 크기와 주파수 및 위상 등을 변환하여 전력의 흐름을 제어하는 전력용 반도체소자(2)와, 상기 전력용 반도체소자(2)에서 발생되는 고온의 열을 외부로 발산하는 방열판(3)에 있어서, 인쇄회로기판(1)에 실장된 전력용 반도체소자(2)의 열을 외부로 발산하는 방열판 설치구조에 있어서, 상기 전력용 반도체소자(2)는 회로소자(4)가 설치되지 않은 인쇄회로기판(1)의 후면에 설치되고, 방열판(3)은 인쇄회로기판(1)의 면적과 동일한 크기로 전력용 반도체소자(2)의 일면과 접하도록 인쇄회로기판(1)에 설치된 다수개의 간격유지구(5)로 관통되는 고정볼트(6)에 의해 인쇄회로기판(7)의 후면과 일정간격으로 이격되게 설치됨을 특징으로 한다. Heat dissipation plate installation structure of the power semiconductor device for maximizing the heat dissipation efficiency of the present invention is mounted on the printed circuit board (1) as shown in Figure 1 to convert the current or voltage size and frequency and phase to flow the power A power semiconductor element mounted on the printed circuit board 1 in the power semiconductor element 2 for controlling and the heat sink 3 for dissipating high temperature heat generated by the power semiconductor element 2 to the outside. In the heat sink mounting structure for dissipating the heat of (2) to the outside, the power semiconductor element (2) is provided on the rear surface of the printed circuit board (1) where the circuit element (4) is not installed, and the heat sink (3) Is fixed to the fixing bolt 6 penetrated by a plurality of gap retention holes 5 installed in the printed circuit board 1 so as to be in contact with one surface of the power semiconductor element 2 in the same size as the area of the printed circuit board 1. Installation spaced apart from the rear of the printed circuit board 7 by a predetermined interval It is characterized by.
상기 인쇄회로기판(1)은 도 2에 도시된 바와 같이 방열판(3)의 측면에 브래킷(7)을 고정설치하여 전기전자기기의 본체부에 설치할 수 있다. As shown in FIG. 2, the printed circuit board 1 may be fixed to the side surface of the heat sink 3 and installed on the main body of the electronic device.
또한, 상기 인쇄회로기판(1)은 도시되지 않았지만 방열판(3)의 측면에 방열판(3)과 일체된 브래킷(7)을 형성하여 전기전자기기의 본체부에 설치할 수도 있다. In addition, although the printed circuit board 1 is not shown, a bracket 7 integrated with the heat sink 3 may be formed on the side of the heat sink 3 to be installed in the main body of the electric and electronic device.
이와 같이 구성된 본 발명의 방열효율을 극대화시킨 전력용 반도체소자의 방열판 설치구조는 인쇄회로기판(1)에 설치되어 전력의 흐름을 제어하고 전류나 전압의 크기와 주파수 및 위상 등을 변환하는 전력용 반도체소자(2)에서 자체적으로 발생되는 고온의 열을 외부로 발산하는 방열판(3)의 방열효율을 극대화시킬 수 있도록 한 것으로, 특히 인쇄회로기판(1)의 전면에 설치된 회로소자(4)에 상관없이 방열판(3)의 면적을 최대로 할 수 있게 된다. The heat sink installation structure of the power semiconductor device maximizing the heat dissipation efficiency of the present invention configured as described above is installed on the printed circuit board 1 to control the flow of power and to convert current, voltage magnitude, frequency and phase, etc. The heat dissipation efficiency of the heat dissipation plate 3 that dissipates high-temperature heat generated by the semiconductor element 2 to the outside is maximized. In particular, the circuit elements 4 installed on the front surface of the printed circuit board 1 Regardless, the area of the heat sink 3 can be maximized.
이는 상기한 바와 같이 인쇄회로기판(1)에 설치되는 전력용 반도체소자(2)를 회로소자(4)가 설치되지 않은 상기 인쇄회로기판(1)의 후면에 설치하고, 상기 전력용 반도체소자(2)의 방열판(3)도 인쇄회로기판(1)의 후면에 설치하여, 인쇄회로기판(1)의 전면에 설치된 회로소자(4)에 상관없이 그 면적을 최대로 하거나 적합한 면적으로 구성할 수 있게 됨으로써, 방열판(3)의 방열효율을 극대화할 수 있고, 이에 따라 방열판(3)의 극대화된 방열효율에 의해 온도에 민감한 전력용 반도체소자(2)를 적정온도로 유지시켜 그 작동을 원활하게 하고, 사용수명도 연장할 수 있게 된다. As described above, the power semiconductor device 2 installed on the printed circuit board 1 is installed on the rear surface of the printed circuit board 1 on which the circuit device 4 is not installed. The heat sink 3 of 2) may also be provided on the rear side of the printed circuit board 1, so that the area thereof may be maximized or may be configured appropriately regardless of the circuit elements 4 installed on the front surface of the printed circuit board 1. As a result, the heat dissipation efficiency of the heat sink 3 can be maximized. Accordingly, the temperature sensitive power semiconductor device 2 is maintained at an appropriate temperature by the maximized heat dissipation efficiency of the heat sink 3 to smoothly operate the same. In addition, the service life can be extended.
그리고 상기 전력용 반도체소자(2)와 방열판(3)이 인쇄회로기판(1)의 후면에 설치됨에 따라, 전력용 반도체소자(2)와 방열판(3)이 전면에 설치된 종래의 인쇄회로기판(1)과는 달리 회로소자(4)와 전력용 반도체소자(2)의 사이에 방열판(3)을 설치하기 위해 필요한 공간을 구비하지 않아도 되기 때문에 인쇄회로기판(1)의 평면크기도 소형화할 수 있게 된다. 따라서 하인쇄회로기판(1)이 설치사용되는 전기전기기기에도 그 설치공간을 많이 차지 않기 때문에 용이하게 설치사용할 수 있게 된다. Since the power semiconductor device 2 and the heat sink 3 are installed on the rear surface of the printed circuit board 1, the conventional printed circuit board having the power semiconductor device 2 and the heat sink 3 installed on the front surface thereof ( Unlike 1), since the space necessary for installing the heat sink 3 between the circuit element 4 and the power semiconductor element 2 does not have to be provided, the plane size of the printed circuit board 1 can be reduced in size. Will be. Therefore, the electric printed circuit board 1 does not take much installation space even in the electric and electric equipment where the installation is used can be easily installed and used.
이와 같이 본 발명의 방열효율을 극대화시킨 전력용 반도체소자의 방열판 설치구조는 전력용 반도체소자(2)와 그 방열판(3)이 인쇄회로기판(1)의 후면에 설치되어, 방열판(3)의 면적을 최대화하여 방열판(3)의 방열효율을 극대화할 수 있게 됨으로써, 온도에 민감한 전력용 반도체소자(2)를 적정온도로 유지시켜 그 작동을 원활하게 하고, 사용수명도 연장할 수 있게 될 뿐만 아니라 다른 회로소자(4)와 전력용 반도체소자(2)의 사이에 방열판(3)을 설치하기 위해 필요한 공간을 구비하지 않아도 됨에 따라 인쇄회로기판(1)의 평면크기도 소형화할 수 있게 된다. As described above, in the heat sink mounting structure of the power semiconductor device maximizing the heat radiation efficiency of the present invention, the power semiconductor device 2 and the heat sink 3 are installed on the rear surface of the printed circuit board 1, By maximizing the area, the heat dissipation efficiency of the heat sink 3 can be maximized, thereby maintaining the temperature-sensitive power semiconductor element 2 at an appropriate temperature to smooth its operation and extend its service life. In addition, since the space necessary for installing the heat sink 3 between the other circuit element 4 and the power semiconductor element 2 does not have to be provided, the planar size of the printed circuit board 1 can be reduced.
상기와 같이 구성된 본 발명은 전력용 반도체소자(2)와 그 방열판(3)이 다른 회로소자가 설치되지 않은 인쇄회로기판(1)의 후면에 설치되어, 방열판(3)의 면적을 최대화하여 방열판(3)의 방열효율을 극대화할 수 있게 됨으로써, 온도에 민감한 전력용 반도체소자(2)를 적정온도로 유지시켜 그 작동을 원활하게 하고, 사용수명도 연장할 수 있게 될 뿐만 아니라 회로소자(4)와 전력용 반도체소자(2)의 사이에 방열판(3)을 설치하기 위해 필요한 공간을 구비하지 않아도 됨에 따라 인쇄회로기판(1)의 평면크기도 소형화할 수 있게 되는 효과가 있다. According to the present invention configured as described above, the power semiconductor device 2 and the heat sink 3 are installed on the rear surface of the printed circuit board 1 on which other circuit devices are not installed, thereby maximizing the area of the heat sink 3 and dissipating the heat sink. By maximizing the heat dissipation efficiency of (3), it is possible not only to maintain the temperature sensitive power semiconductor element 2 at an appropriate temperature, to facilitate its operation, and to extend its service life, as well as to provide circuit elements (4). ), The plane size of the printed circuit board 1 can be reduced in size, since it is not necessary to provide a space necessary for installing the heat sink 3 between the power semiconductor element 2.
도 1은 본 발명의 실시예를 나타낸 분해 사시도1 is an exploded perspective view showing an embodiment of the present invention
도 2는 본 발명의 실시예를 나타낸 수직단면도Figure 2 is a vertical cross-sectional view showing an embodiment of the present invention
※ 도면의 주요부분에 대한 부호의 설명※ Explanation of code for main part of drawing
1: 인쇄회로기판 2: 전력용 반도체소자1: printed circuit board 2: power semiconductor device
3: 방열판 4: 회로소자3: heat sink 4: circuit element
5: 간격유지구 6: 고정볼트5: Spacing area 6: Fixing bolt
7: 브래킷 7: bracket
Claims (2)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050062501A KR20050080099A (en) | 2005-07-12 | 2005-07-12 | Install structure of heat sink improved radiating efficiency for power semiconductor and it's install method |
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020050062501A KR20050080099A (en) | 2005-07-12 | 2005-07-12 | Install structure of heat sink improved radiating efficiency for power semiconductor and it's install method |
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| KR20050080099A true KR20050080099A (en) | 2005-08-11 |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101043478B1 (en) * | 2009-09-11 | 2011-06-23 | 삼성전기주식회사 | Low temperature co-fired ceramics assembling system, and method thereof |
| CN103681523A (en) * | 2012-09-05 | 2014-03-26 | 深圳市艾威迅科技有限公司 | Mounting structure for power tube of sealed power supply product with integral heat radiating function |
| KR101423502B1 (en) * | 2012-05-16 | 2014-07-28 | 주식회사 유나티앤이 | Electronic components mounting structure and the method |
| KR101652904B1 (en) | 2016-01-14 | 2016-08-31 | 주식회사 엠디엠 | Multi-layer pcb having function of dissipating heat from power semiconductor module package and pcb, and the producing method thereof |
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| KR20180016845A (en) | 2016-08-08 | 2018-02-20 | 김구용 | PCB module having multi-directional heat-radiation structure and multi-layer PCB assembly used in the PCB module |
| KR20180016844A (en) | 2016-08-08 | 2018-02-20 | 김구용 | PCB module having multi-directional heat-radiation structure and multi-layer PCB assembly used in the PCB module |
| KR20180024434A (en) | 2016-08-30 | 2018-03-08 | 주식회사 엠디엠 | Multi-layer PCB assembly having multi-directional heat-radiation structure |
| KR20200023851A (en) * | 2018-08-27 | 2020-03-06 | 엘지전자 주식회사 | Heat dissipation device of power semiconductor module |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101043478B1 (en) * | 2009-09-11 | 2011-06-23 | 삼성전기주식회사 | Low temperature co-fired ceramics assembling system, and method thereof |
| KR101423502B1 (en) * | 2012-05-16 | 2014-07-28 | 주식회사 유나티앤이 | Electronic components mounting structure and the method |
| CN103681523A (en) * | 2012-09-05 | 2014-03-26 | 深圳市艾威迅科技有限公司 | Mounting structure for power tube of sealed power supply product with integral heat radiating function |
| KR101652904B1 (en) | 2016-01-14 | 2016-08-31 | 주식회사 엠디엠 | Multi-layer pcb having function of dissipating heat from power semiconductor module package and pcb, and the producing method thereof |
| KR20180005343A (en) | 2016-07-06 | 2018-01-16 | 김구용 | PCB module having multi-directional heat-radiation structure, and radiation plate, multi-layer PCB assembly, and module case used in the same PCB module |
| KR20180016845A (en) | 2016-08-08 | 2018-02-20 | 김구용 | PCB module having multi-directional heat-radiation structure and multi-layer PCB assembly used in the PCB module |
| KR20180016844A (en) | 2016-08-08 | 2018-02-20 | 김구용 | PCB module having multi-directional heat-radiation structure and multi-layer PCB assembly used in the PCB module |
| US10455697B2 (en) | 2016-08-08 | 2019-10-22 | Mdm Inc. | PCB module having multi-sided heat sink structure and multilayer PCB assembly for use in same |
| KR20180024434A (en) | 2016-08-30 | 2018-03-08 | 주식회사 엠디엠 | Multi-layer PCB assembly having multi-directional heat-radiation structure |
| KR20200023851A (en) * | 2018-08-27 | 2020-03-06 | 엘지전자 주식회사 | Heat dissipation device of power semiconductor module |
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