JPH1197871A - Heat-dissipating structure for case - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the heat-dissipating effect of a case causing no low- temperature burn of a human body when contacting the case. SOLUTION: At a bottom surface of a mold case 1, a thick hollow structure part 6 which comprises a cylindrical hollow with it is provided, and a plurality of through-slits 7 are provided at the hollow structure part 6. At a metal heat- dissipating plate 9 attached on an inner surface of the hollow structure part 6, a plurality of protruding parts 11, engaged with the slits 7 respectively, are provided, a tip end of the protruding part 11 is drawn in the slit 7 with a step from the surface of the mold case 1 formed, and no tip end of the protruding part 11 touches a human body, even if he touches the surface of the mold case 1. By connecting a high-temperature heat-generating body 2 to a metal heat- release plate 5 via a thermal interface material 3, the amount of heat generated by the high-temperature heat-generating body 2 is transported to the metal heat-dissipating plate 5, thus heat-dissipation is executed, while being diffused into a wide area owing to the high thermal conductivity of the metal heat- dissipating plate 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating structure of a housing for hermetically closing a built-in heating element and releasing heat in a naturally air-cooled housing, and more particularly to a housing for a portable notebook personal computer. Heat dissipation structure.

[0002]

2. Description of the Related Art FIG. 2 is a cross-sectional view of a conventional heat radiating structure of a housing. The housing is of a personal computer and is hermetically closed and air-cooled.

[0003] A molded case housing a printed circuit board 8 on which electronic components are mounted has a closed interior. Molded housings have the advantage that the perceived temperature at the same temperature is lower than that of metal housings, etc.On the other hand, the high heat resistance of electronic components inside the housing due to the large thermal resistance and the high-temperature heating elements When it is close to the inner surface, there is a problem that the surface temperature of the mold housing near the high-temperature heating element locally becomes high enough to cause a low-temperature burn.

Conventionally, in order to solve such a problem,
A heat dissipation structure of a housing whose cross section is shown in FIG. 2 was used.
This housing is of a personal computer and includes a molded housing 10 containing a printed circuit board 8 on which electronic components are mounted.
Seals the inside. A metal heat radiating plate 5 having a large area is attached to the inner surface of the molded casing 10, and the high heat generating element 2 of the electronic components mounted on the printed circuit board 8 is converted into a thermal interface material 3 having a high thermal conductivity (for example, a heat conductive rubber). ) And the metal heat radiating plate 5 connected to the metal heat radiating plate 5 via the thermal interface material 4 (for example, a copper plate) having high thermal conductivity attached to the metal heat radiating plate 5, thereby transferring the heat generated by the high-temperature heating element 2 to the metal heat radiating plate 5. Then, the high heat conductivity of the metal heat radiating plate 5 diffuses and radiates heat over a wide area. Such a wide range of thermal diffusion promotes a uniform temperature, and alleviates a local increase in temperature near the high-temperature heating element 2.

However, in recent years, the amount of heat generated by the electronic components of the personal computer has been increasing, and as the amount of heat generated by the high-temperature heating element 2 has increased, more heat has to be transported to the metal radiating plate 5 unless the high-temperature heating element 2 is transported. It has become difficult to satisfy the temperature standard that guarantees the reliability of the mold, and the increase in the amount of heat transported to the metal radiator plate 5 has raised the surface temperature over a wide range of the mold housing 10 to such an extent that a low-temperature burn is caused.

[0006]

When the amount of heat generated by the high-temperature heating element inside the housing increases, the surface temperature of the housing locally rises, and there is a danger of causing low-temperature burns.

[0007]

According to the present invention, a heat insulating structure for a housing is provided in a housing (1 in FIG. 1) and a heating element (2 in FIG. 1).
A heat radiating plate (9 in FIG. 1) through which heat is transmitted is exposed to the outside through a slit (7 in FIG. 1) provided in the housing, and the exposed portion of the heat radiating plate is stepped from the surface of the housing. It is characterized by being stored in the slit with
Desirably, the heating element and the heat sink are connected via a thermal interface material (3 in FIG. 1), the heat sink is attached to a heat insulating structure provided in the housing, and the heat sink is connected to the slit. A fitting projection (11 in FIG. 1) is provided.

The heat insulating structure may be a hollow structure (6 in FIG. 1) having a cavity therein, and the heat radiating plate may be formed of a metal plate.

[0009]

Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view of a heat insulating structure of a housing according to an embodiment of the present invention.

The inside of a molded case 1 containing a printed circuit board 8 on which electronic components are mounted is sealed. In the mold housing 1, a cavity structure 6 is provided near the high heat generating element 2 in the electronic components mounted on the printed circuit board 8, in FIG. 6 is provided with a plurality of through slits 7. Hollow structure 6
A metal radiator plate 9 is attached to the inner surface of. The metal radiator plate 9 is provided with a plurality of protrusions 11 that fit into the respective slits 7, and the slits 7 are closed by the protrusions 11.
The tip of the protruding portion 11 is in a state of being stepped with the surface of the mold housing 1 and is drawn into the slit 7 so that even if a person touches the surface of the mold housing, the tip of the protruding portion 11 does not touch the person. Absent.

By connecting the high-temperature heating element 2 to the metal heat radiating plate 5 through the thermal interface material 3 having high thermal conductivity, the heat generated by the high-temperature heating element 2 is transported to the metal heat radiating plate 5, and the metal heat radiation is performed. Due to the high thermal conductivity of the plate 5, the heat is diffused over a wide area and dissipated.

By exposing the metal heat radiating plate 9 to the outside air from the slit 7, the heat radiating action to the outside of the housing is promoted. The heat conductivity of the air is about 1/10 of that of the molded case, and the air hardly convects in the cavity, so that the cavity structure 6 acts as a heat insulating layer, and the heat from the metal heat radiating plate 9 is transferred to the cavity structure 9. The surface of the mold housing 1, which is not transmitted to the outer surface of the case and may come into direct contact with the human body, is kept substantially equal to the outside air temperature.

The present invention can be applied not only to a molded casing but also to other kinds of casings, for example, a wooden casing, and not only a completely sealed casing but also a partly open casing. The present invention can be applied to a case in which the heat radiation plate is radiated. However, when the present invention is applied to a completely sealed housing, the present invention has an effect that heat radiation of the heat radiating plate can be promoted while ensuring the completely sealed housing.

Further, in the present invention, the slit is not limited to a groove-shaped opening whose length is overwhelmingly large with respect to the width, but also includes a through-hole or a round hole.

The heat insulating structure is not limited to the hollow structure, but may be a part of the housing made of a material having a particularly large heat insulating effect. Furthermore, the cavity included in the cavity structure is not limited to a cylindrical one, and may be a rectangular cavity or the like, or the cavity structure may be porous. Air or other gas may be present in these cavities, or reduced pressure or vacuum may be applied.

Further, the heat radiating plate is not necessarily provided with a convex portion, and the heat radiating effect is promoted even if a part of the surface of the heat radiating plate faces the slit. Further, the heat radiating plate does not have to be plate-shaped, and may be, for example, a block provided with fins that fit into the slits.

[0018]

According to the present invention, the housing is locally heated to a high temperature,
Prevents low-temperature burns when human body comes into contact,
In addition, there is an effect that the heat radiation of the housing is enhanced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a heat dissipation concept of a housing according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a heat dissipation structure of a conventional housing.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mold housing 2 High temperature heating element 3 Thermal interface material 4 Thermal interface material 5 Metal radiator plate 6 Cavity structure part 7 Slit 8 Printed circuit board 9 Metal radiator plate 10 Mold housing 11 Convex part

Claims (6)

[Claims] 1. A radiator plate provided in a housing and transmitting heat from a heating element is exposed to the outside through a slit provided in the housing, and an exposed portion of the radiator plate is stepped from a surface of the housing. A heat radiation structure for a housing, wherein the heat radiation structure is housed in the slit. 2. The heat radiating structure for a housing according to claim 1, wherein said heat generating element and said heat radiating plate are connected via a thermal interface material. 3. The heat radiating structure for a housing according to claim 1, wherein a heat insulating structure is provided on the housing, and the heat radiating plate is attached to the heat insulating structure. 4. The heat insulating structure according to claim 1, wherein the heat insulating structure is a hollow structure having a cavity therein.
Heat dissipation structure of the described housing. 5. The heat radiating structure for a housing according to claim 1, wherein said heat radiating plate has a convex portion fitted into said slit. 6. The heat dissipation structure for a housing according to claim 1, wherein the heat dissipation plate is made of a metal plate.