CN106231863A - Pcb board assembly and there is its mobile terminal - Google Patents
Pcb board assembly and there is its mobile terminal Download PDFInfo
- Publication number
- CN106231863A CN106231863A CN201610608543.0A CN201610608543A CN106231863A CN 106231863 A CN106231863 A CN 106231863A CN 201610608543 A CN201610608543 A CN 201610608543A CN 106231863 A CN106231863 A CN 106231863A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- electronic component
- board assembly
- heat
- heat abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
Abstract
The invention discloses a kind of pcb board assembly and there is its mobile terminal.Described pcb board assembly, including: pcb board, described pcb board is provided with electronic component；For the heat abstractor that described electronic component is dispelled the heat, being located at least partially on described pcb board of described heat abstractor, described electronic component contacts with described heat abstractor, and described heat abstractor is around all or part of outward flange setting of described electronic component.Pcb board assembly according to the present invention, by making heat abstractor contact with electronic component, and heat abstractor is around all or part of outward flange setting of electronic component, the heat that electronic component operationally produces can be quickly transmitted to heat abstractor, the radiating efficiency of electronic component is higher, such that it is able to improve electronic component and the reliability of running of mobile terminal.
Description
Technical field
The present invention relates to technical field of mobile terminals, especially relate to a kind of pcb board assembly and there is this pcb board assembly
Mobile terminal.
Background technology
Along with people are more and more higher to the performance requirement of mobile terminal, the speed of service of the internal various devices of mobile terminal is also
Increasingly faster, the power consumption of various devices also sharply increases, and causes mobile terminal operationally, some electricity on its internal circuit plate
Sub-element, such as processor chips, transistor, resistor and capacitor etc., all can produce substantial amounts of heat.When accumulation of heat,
Electronic component can be caused to operate abnormal, circuit board and electronic component thereon is burned or is short-circuited.Therefore, to circuit
Electronic component on plate dispels the heat most important fast and effectively.
In correlation technique, generally accelerate dissipating of electronic component and circuit board by arranging multiple louvre on circuit boards
Heat, or in louvre fill heat sink material, such as, graphite, heat conductive silica gel and epoxy resin etc., accelerate electronic component and
The heat radiation of circuit board.By arranging louvre and filling heat sink material on circuit boards, electronic component and circuit board are dissipated
Heat, drilling technology is complicated, and radiating effect is poor.
Summary of the invention
It is contemplated that one of technical problem solved the most to a certain extent in correlation technique.To this end, the present invention carries
Going out a kind of pcb board assembly, described pcb board assembly is by making heat abstractor contact with electronic component, and heat abstractor is around electronics
The all or part of outward flange of element is arranged, and the heat that electronic component operationally produces can be quickly transmitted to heat radiation dress
Putting, the radiating efficiency of electronic component is higher, such that it is able to improve electronic component and the reliability of running of mobile terminal.
The present invention also proposes a kind of mobile terminal with above-mentioned pcb board assembly.
Embodiment pcb board assembly according to a first aspect of the present invention, including: pcb board, described pcb board is provided with electronic component；
For the heat abstractor that described electronic component is dispelled the heat, being located at least partially on described pcb board of described heat abstractor,
Described electronic component contacts with described heat abstractor, and described heat abstractor around described electronic component all or part of outside
Edge is arranged.
Pcb board assembly according to the present invention, by making heat abstractor contact with electronic component, and heat abstractor is around electronics
The all or part of outward flange of element is arranged, and the heat that electronic component operationally produces can be quickly transmitted to heat radiation dress
Putting, the radiating efficiency of electronic component is higher, thus improves the reliability of electronic component and running of mobile terminal.
It addition, the pcb board assembly of the present invention can also have a following additional technical feature:
According to some embodiments of the present invention, described heat abstractor is formed as the housing with cavity, described housing interior
Wall is provided with wick, is adsorbed with the liquid for transmitting heat in described wick.
According to some embodiments of the present invention, described housing includes head and extension, described head and described extension
Being connected, described head is located on described pcb board, and described extension extends to outside described pcb board, and described head is around described electronics
The all or part of outward flange of element is arranged.
According to some embodiments of the present invention, described head has the enclosed shape through hole running through its thickness, described electronics unit
Part be contained in described through hole and with the contact internal walls of described through hole.
According to some embodiments of the present invention, the edge of described head is provided with the recessed of the central concave of described head
Groove, the side of described groove opens wide, described electronic component be embedded in described groove and with the contact internal walls of described groove.
According to some embodiments of the present invention, a described electronic component part is stretched out from the open end of described groove, described
Another part of electronic component and the contact internal walls of described groove.
According to some embodiments of the present invention, described housing is metalwork.
According to some embodiments of the present invention, described heat abstractor and described pcb board are for being welded to connect.
The mobile terminal of embodiment according to a second aspect of the present invention, including: pcb board assembly, according to described pcb board assembly
The pcb board assembly of the present invention above-mentioned first aspect embodiment.
Mobile terminal according to embodiments of the present invention, by arranging the pcb board group of embodiment according to a first aspect of the present invention
Part, perfect heat-dissipating, operational reliability is high.
The additional aspect of the present invention and advantage will part be given in the following description, and part will become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or the additional aspect of the present invention and advantage are from combining the accompanying drawings below description to embodiment and will become
Substantially with easy to understand, wherein:
Fig. 1 is the structural representation of pcb board assembly according to an embodiment of the invention；
Fig. 2 is the structural representation of pcb board assembly in accordance with another embodiment of the present invention.
Reference:
Pcb board assembly 100；
Pcb board 1；Electronic component 11；
Housing 2；Head 21；Extension 22；Through hole 201；Groove 202.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached
The embodiment that figure describes is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In describing the invention, it is to be understood that term " " center ", " thickness ", " on ", D score, "front", "rear",
Orientation or the position relationship of the instruction such as "left", "right", " top ", " end ", " interior ", " outward " are based on orientation shown in the drawings or position
Relation, is for only for ease of the description present invention and simplifies description rather than instruction or imply that the device of indication or element must have
Have specific orientation, with specific azimuth configuration and operation, be therefore not considered as limiting the invention.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " is installed ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be fixing connection, it is also possible to be to removably connect, or be integrally connected；Can
To be mechanical connection, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, Ke Yishi
The connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, permissible
Understand above-mentioned term concrete meaning in the present invention as the case may be.
The pcb board assembly 100 of embodiment according to a first aspect of the present invention is described below with reference to Fig. 1-Fig. 2.According to the present invention
The pcb board assembly 100 of embodiment includes: pcb board 1 and heat abstractor.
Pcb board 1 is provided with electronic component 11, and heat abstractor is for dispelling the heat to electronic component 11, and heat abstractor is extremely
A few part is located on pcb board 1, say, that can be that a part of structure of heat abstractor is located on pcb board 1, it is also possible to be
The entire infrastructure of heat abstractor is each provided on pcb board 1, and electronic component 11 contacts with heat abstractor, and heat abstractor is around electronics
The all or part of outward flange of element 11 is arranged.By making electronic component 11 contact with heat abstractor, electronics so can be made
Element 11 be in operation produce heat be directly passed to heat abstractor, transferred heat away from by heat abstractor, additionally, dissipate
Thermal is arranged around all or part of outward flange of electronic component 11, so can increase electronic component 11 and heat abstractor
Contact area so that electronic component 11 be in operation produce heat can more be quickly transmitted to heat abstractor,
Radiating efficiency is higher.
It should be noted that electronic component 11 described herein refers generally to the heater members being located on pcb board 1, example
As being processor chips, power management chip, transistor, resistor, capacitor and light emitting diode etc..
Pcb board 1 according to embodiments of the present invention, by making heat abstractor contact with electronic component 11, and heat abstractor encloses
All or part of outward flange around electronic component 11 is arranged, and the heat that electronic component 11 operationally produces can pass rapidly
Passing heat abstractor, the radiating efficiency of electronic component 11 is higher, such that it is able to improve electronic component 11 and running of mobile terminal
Reliability.
In some embodiments of the invention, heat abstractor is formed as the housing 2 with cavity, and the inwall of housing 2 sets
Having wick, be adsorbed with the liquid for transmitting heat in wick, electronic component 11 contacts with housing 2, utilizes the steaming of liquid
Send out and the heat radiation of condensation quickening electronic component 11.Apply as a example by mobile terminal by electronic component 11, when mobile terminal works,
Electronic component 11 starts heating, and the side that housing 2 contacts with electronic component 11 is heat side, absorbs in electronic component 11 and produces
Heat, and transfer heat to be located in the wick of housing 2 inwall the liquid adsorbed, liquid heat absorption evaporation is transformed into
Steam, steam diffuses to the side condensation heat release that in housing 2, temperature is relatively low under differential pressure action, is changed into again liquid, after condensation
Liquid backflow, the wick being arranged on housing 2 inwall absorption, then liquid absorbs heat evaporation once more, so circulates, passes through
The evaporation of liquid and condensation in housing 2, be quickly transferred to the heat produced in electronic component 11 by the heat absorbing side of housing 2 entirely
The housing 2 in portion, increasing heat radiation area, substantially increase radiating efficiency.
Alternatively, housing 2 is metalwork, good heat dissipation effect, and radiating efficiency is higher.
In some embodiments of the invention, as Figure 1-Figure 2, housing 2 includes head 21 and extension 22, head 21
Being connected with extension 22, head 21 is located on pcb board 1, and extension 22 extends to outside pcb board 1, and head 21 is around electronic component 11
All or part of outward flange arrange.Electronic component 11 contacts with the head 21 of housing 2, and the head 21 of housing 2 is for being heated
Side, absorbs the heat produced in electronic component 11, and transfers heat to be located at the liquid adsorbed in the wick of its inwall
Body, liquid heat absorption evaporation is transformed into steam, and steam diffuses to the extension 22 of housing 2 under differential pressure action and condenses heat release, turns again
Being turned into liquid, condensed liquid refluxes, the wick absorption being arranged on head 21 inwall, so circulates, housing 2 head
21 absorb the heats that electronic components 11 work produces, and are transferred heat to the extension of housing 2 by the evaporation of liquid and condensation
Portion 22, heat is quickly passed by extension 22.Extension 22 extends to outside pcb board 1, so can greatly reduce PCB
The plate 1 absorption to heat, reduces the heat radiation load of pcb board 1.It addition, the extension 22 of housing 2 extends pcb board 1, it is permissible
Only with air contact, transfer heat in air, or can contact with the shell of mobile terminal, so that electronics is first
The heat produced in part 11 is quickly passed by mobile terminal case.Certainly, the present invention is not limited to this, prolonging of housing 2
Extending portion 22 can also be by contacting with radome or heat radiation pallet, and to transfer heat away from, this is not limited by the present invention.
In some embodiments of the invention, as it is shown in figure 1, the head 21 of housing 2 has the enclosed shape running through its thickness
Through hole 201, in electronic component 11 is contained in through hole 201 and with the contact internal walls of through hole 201.The heat produced in electronic component 11
Being directly passed to the inwall of through hole 201, the inwall of through hole 201 is heat side.The shape of through hole 201 can be entered according to actual needs
Row is arbitrarily selected, it is preferable that the shape of through hole 201 and the mating shapes of electronic component 11, so can be greatly increased electronics
Element 11 and the contact area of housing 2, the heat produced in electronic component 11 can quickly be transferred to heat abstractor, improves and dissipates
The thermal efficiency.Such as, in FIG shown in concrete example in, electronic component 11 is projected as rectangle, through hole on pcb board 1
201 projections on pcb board 1 are also rectangle, and the projected area that electronic component 11 is on pcb board 1 and through hole 201 are at PCB
Projected area on plate 1 is roughly equal, and the head 21 of such housing 2 can increase around the surrounding sidewall of electronic component 11
Add the contact area of electronic component 11 and housing 2, improve radiating efficiency.
Preferably, above-mentioned through hole 201 can be located at the center of the head 21 of housing 2, such head 21 housing 2 and electricity
Side that sub-element 11 contacts absorbs the heat produced in electronic component 11, heat by the center of head 21 to its periphery
Radiation, radiating efficiency is higher.
In other embodiments of the present invention, as in figure 2 it is shown, the edge of the head 21 of housing 2 is provided with head 21
The groove 202 of central concave, the side of groove 202 opens wide, electronic component 11 be embedded in groove 202 and with groove 202
Contact internal walls.The heat produced in electronic component 11 is directly passed to the inwall of groove 202, and the inwall of groove 202 is heat side.
As shown in Figure 2, groove 202 is located on the right side wall of head 21, and the position of certain groove 202 can be carried out according to actual needs
Arbitrarily selected, such as, groove 202 can also be located on the diapire of head 21, front-rear side walls or right side wall.By at housing 2
Head 21 be provided with groove 202, the side of groove 202 is opened wide, and electronic component 11 can be embedded by the open side of groove 202
In groove 202, electronic component 11 is more diversified with the fit system of groove 202.
Alternatively, in the entire infrastructure of electronic component 11 is contained in groove 202；Or alternatively, electronic component 11 1
Part is stretched out from the open end of groove 202, another part of electronic component 11 and the contact internal walls of groove 202.Such as, in Fig. 2
Shown in, it is positioned at the electronic component 11 on front side of pcb board 1 and is entirely accommodated in groove 202, be positioned at the electronic component 11 on rear side of pcb board 1
The contact internal walls of left part and groove 202, the right part of electronic component 11 is stretched out from the open end of groove 202.
In some embodiments of the invention, heat abstractor and pcb board 1 are for being welded to connect, and Joining Technology is simple, and connection can
High by property.
The mobile terminal of embodiment according to a second aspect of the present invention is described below, including pcb board assembly 100, described pcb board
Assembly 100 is the pcb board assembly 100 according to the present invention above-mentioned first aspect embodiment.
Wherein, mobile terminal can be the electronic equipments such as smart mobile phone, computer, digital camera, and the present invention is to mobile terminal
Type be not particularly limited.
Pcb board assembly 100 according to the present invention, by arranging the pcb board assembly of embodiment according to a first aspect of the present invention
100, perfect heat-dissipating, operational reliability is high.
In the description of this specification, reference term " embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " concrete example " or " some examples " etc. means to combine this embodiment or the specific features of example description, knot
Structure, material or feature are contained at least one embodiment or the example of the present invention.In this manual, to above-mentioned term
Schematic representation is not necessarily referring to identical embodiment or example.And, the specific features of description, structure, material or spy
Point can combine in any one or more embodiments or example in an appropriate manner.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
These embodiments can be carried out multiple change in the case of departing from the principle of the present invention and objective, revise, replace and modification, this
The scope of invention is limited by claim and equivalent thereof.
Claims (9)
1. a pcb board assembly, it is characterised in that including:
Pcb board, described pcb board is provided with electronic component；
For the heat abstractor that described electronic component is dispelled the heat, described heat abstractor be located at described PCB at least partially
On plate, described electronic component contacts with described heat abstractor, and described heat abstractor around the whole of described electronic component or
Partial outer edge is arranged.
Pcb board assembly the most according to claim 1, it is characterised in that described heat abstractor is formed as the shell with cavity
Body, the inwall of described housing is provided with wick, is adsorbed with the liquid for transmitting heat in described wick.
Pcb board assembly the most according to claim 2, it is characterised in that described housing includes head and extension, described head
Portion is connected with described extension.Described head is located on described pcb board, and described extension extends to outside described pcb board, described head
Portion is arranged around all or part of outward flange of described electronic component.
Pcb board assembly the most according to claim 3, it is characterised in that described head has the enclosed shape running through its thickness
Through hole, described electronic component be contained in described through hole and with the contact internal walls of described through hole.
Pcb board assembly the most according to claim 3, it is characterised in that the edge of described head is provided with described head
The groove of central concave, the side of described groove opens wide, described electronic component be embedded in described groove and with described groove
Contact internal walls.
Pcb board assembly the most according to claim 5, it is characterised in that a described electronic component part is from described groove
Open end stretches out, another part of described electronic component and the contact internal walls of described groove.
Pcb board assembly the most according to claim 2, it is characterised in that described housing is metalwork.
Pcb board assembly the most according to claim 1, it is characterised in that described heat abstractor is the company of welding with described pcb board
Connect.
9. a mobile terminal, it is characterised in that include according to the pcb board assembly according to any one of claim 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610608543.0A CN106231863A (en) | 2016-07-28 | 2016-07-28 | Pcb board assembly and there is its mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610608543.0A CN106231863A (en) | 2016-07-28 | 2016-07-28 | Pcb board assembly and there is its mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106231863A true CN106231863A (en) | 2016-12-14 |
Family
ID=57535184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610608543.0A Pending CN106231863A (en) | 2016-07-28 | 2016-07-28 | Pcb board assembly and there is its mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106231863A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107613171A (en) * | 2017-09-26 | 2018-01-19 | 广东欧珀移动通信有限公司 | Camera module and mobile terminal |
| CN108617083A (en) * | 2018-06-11 | 2018-10-02 | Oppo广东移动通信有限公司 | A kind of electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102819300A (en) * | 2011-06-08 | 2012-12-12 | 技嘉科技股份有限公司 | Radiator and electronic device structure |
| CN104596334A (en) * | 2013-10-30 | 2015-05-06 | 东芝家电技术股份有限公司 | Mobile terminal |
| CN204377305U (en) * | 2014-12-16 | 2015-06-03 | 中兴通讯股份有限公司 | A kind of heat abstractor, circuit board and terminal |
| CN104735956A (en) * | 2013-12-24 | 2015-06-24 | 东芝家电技术股份有限公司 | Sheet-type heat pipe |
-
2016
- 2016-07-28 CN CN201610608543.0A patent/CN106231863A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102819300A (en) * | 2011-06-08 | 2012-12-12 | 技嘉科技股份有限公司 | Radiator and electronic device structure |
| CN104596334A (en) * | 2013-10-30 | 2015-05-06 | 东芝家电技术股份有限公司 | Mobile terminal |
| CN104735956A (en) * | 2013-12-24 | 2015-06-24 | 东芝家电技术股份有限公司 | Sheet-type heat pipe |
| CN204377305U (en) * | 2014-12-16 | 2015-06-03 | 中兴通讯股份有限公司 | A kind of heat abstractor, circuit board and terminal |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107613171A (en) * | 2017-09-26 | 2018-01-19 | 广东欧珀移动通信有限公司 | Camera module and mobile terminal |
| CN108617083A (en) * | 2018-06-11 | 2018-10-02 | Oppo广东移动通信有限公司 | A kind of electronic device |
| CN108617083B (en) * | 2018-06-11 | 2020-01-17 | Oppo广东移动通信有限公司 | Electronic device |
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| PB01 | Publication | ||
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Application publication date: 20161214 |