CN108617083B - Electronic device - Google Patents

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Publication number
CN108617083B
CN108617083B CN201810597228.1A CN201810597228A CN108617083B CN 108617083 B CN108617083 B CN 108617083B CN 201810597228 A CN201810597228 A CN 201810597228A CN 108617083 B CN108617083 B CN 108617083B
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CN
China
Prior art keywords
heat
heat pipe
electronic
source chip
groove
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Application number
CN201810597228.1A
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Chinese (zh)
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CN108617083A (en
Inventor
田汉卿
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201810597228.1A priority Critical patent/CN108617083B/en
Publication of CN108617083A publication Critical patent/CN108617083A/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference

Abstract

The application provides an electronic device. The electronic device comprises a circuit board, a heat source chip, a heat pipe and a heat dissipation frame, wherein the heat source chip is welded on the circuit board and electrically connected with the circuit board, an evaporation area of the heat pipe covers the heat source chip to perform electrostatic shielding on the heat source chip and absorb heat of the heat source chip, and the heat dissipation frame is connected with the heat pipe to absorb heat of the heat pipe. The heat pipe can not only carry out electrostatic shielding on the heat source chip, but also absorb the heat of the heat source chip.

Description

Electronic device
Technical Field
The present disclosure relates to heat dissipation technologies, and particularly to an electronic device.
Background
With the popularization of smart phones, users can obviously feel the heat of the smart phones in the long-time use process of the smart phones, and through detection, the heat of mobile phone CPUs is the main reason when the smart phones work. The mobile phone CPU is a highly integrated SOC chip, not only a CPU central chip and a GPU graphic processing chip are integrated in the mobile phone CPU, but also a series of key chip modules such as Bluetooth, GPS, radio frequency and the like are used as chips with the highest integration level in the smart phone chip, and the modules can dissipate a large amount of heat when running at high speed. At present, various solutions are provided for the heat dissipation problem of the mobile phone, but the heat dissipation effect is not ideal.
Content of application
The application provides an electronic device, this electronic device includes circuit board, heat source chip, heat pipe and heat dissipation frame, the heat source chip weld on the circuit board in order with circuit board electric connection, the evaporation zone cover of heat pipe is established on the heat source chip to carry out electrostatic shielding and absorb the heat of heat source chip to the heat source chip, the heat dissipation frame is connected with the heat pipe in order to absorb the heat of heat pipe. The heat pipe can not only carry out electrostatic shielding on the heat source chip, but also absorb the heat of the heat source chip.
The utility model provides an electron device includes the circuit board, the heat source chip, heat pipe and heat dissipation frame, heat source chip and circuit board electric connection, the heat source chip produces a large amount of heats when operating condition, and the heat source chip can produce electromagnetic interference to parts around or parts around produce electromagnetic interference to it, the heat pipe has electrostatic shield function and heat conduction function, the evaporation zone cover of heat pipe is when establishing on the heat source chip, can carry out electrostatic shield and the heat of absorption heat source chip to the heat source chip simultaneously, thereby can save a shield cover that sets up between heat pipe and heat source chip, make heat pipe and heat source chip direct contact, the radiating effect is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of an electronic device provided in the present application;
FIG. 2 is a schematic structural diagram of an embodiment of a heat pipe provided herein;
FIG. 3 is a schematic structural diagram of another embodiment of a heat pipe provided herein;
FIG. 4 is a schematic structural diagram of another embodiment of an electronic device provided in the present application;
FIG. 5 is a schematic structural diagram of another embodiment of an electronic device provided in the present application;
FIG. 6 is a schematic structural diagram of another embodiment of an electronic device provided in the present application;
FIG. 7 is a schematic structural diagram of another embodiment of an electronic device provided herein;
fig. 8 is a schematic structural diagram of another embodiment of an electronic device provided in the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The electronic device provided by the embodiment of the application comprises electronic equipment such as a smart phone, a tablet personal computer, intelligent wearable equipment, a digital audio and video player, an electronic reader, a handheld game machine and vehicle-mounted electronic equipment.
The terms "first" and "second" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. Such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of an electronic device provided in the present application.
In the present embodiment, the electronic device includes a circuit board 10, a heat source chip 20, a heat pipe 30, and a heat dissipation frame 40.
The heat source chip 20 is soldered on the circuit board 10 to be electrically connected to the circuit board 10, the heat source chip 20 includes a cpu, a GPU, a radio frequency chip or a GPS chip, etc., which generate a large amount of heat in a working state, and the temperature near the heat source chip 20 may affect the working efficiency and the service life when the temperature rises to above 55 ℃.
The heat pipe 30 is comprised of a copper shell, wick and end caps. The copper tube shell is pumped into a negative pressure state and filled with proper liquid, and the liquid has a low boiling point and is easy to volatilize. The inner wall of the tube shell is provided with a liquid absorbing core which is made of capillary porous materials. When one end of the heat pipe 30 is heated, the liquid in the heat pipe 30 is rapidly vaporized, the vapor flows to the other end under the power of heat diffusion, and is condensed at the cold end to release heat, and the liquid flows back to the evaporation area 301 along the porous material by capillary action, so that the circulation is not stopped until the temperatures at the two ends of the heat pipe 30 are equal.
In the present embodiment, the evaporation area 301 of the heat pipe 30 is covered on the heat source chip 20 and connected to the heat dissipation frame 40, and the material of the heat pipe 30 is a metal material, such as copper, aluminum, and the like. The heat pipe 30 is covered on the heat source chip 20 to perform an electrostatic shielding function on the heat source chip 20, so as to prevent the heat source chip 20 from being electrostatically interfered by the outside or the heat source chip 20 from being electrostatically interfered by the outside. Meanwhile, the heat pipe 30 can conduct heat, and the working principle of the heat pipe 30 is to utilize the phase change process of the medium evaporating in the evaporation area 301 to absorb heat and then condensing in the condensation area 302 to dissipate heat, so that the heat is quickly conducted from the high temperature position to the low temperature position. The heat pipe 30 is covered on the heat source chip 20 to absorb heat of the heat source chip 20 and conduct the heat of the heat source chip 20 to the heat dissipation frame 40.
The heat dissipation frame 40 may be a SIM card accommodating frame, a middle frame border, a middle frame bottom plate or a rear housing, etc., and fig. 1 shows the case where the heat dissipation frame 40 is a middle frame.
The middle frame 10 is a casing assembly of the electronic device, and includes two opposite side surfaces, wherein a display screen assembly is arranged on the front side surface, a circuit board, a battery and other components are arranged on the rear side surface, then the front side surface is connected with the front casing, and the rear side surface is connected with the rear casing to form an electronic device main body. The center frame 10 is generally made of a metal alloy material, such as steel plate, magnesium aluminum alloy, or the like.
Referring to fig. 1 and fig. 2, fig. 2 is a schematic structural diagram of an embodiment of a heat pipe 30 provided in the present application.
The evaporation area 301 of the heat pipe 30 is provided with a shielding groove 303, and the shielding groove 303 is used for accommodating the heat source chip 20 to perform electrostatic shielding on the heat source chip 20. In addition, the heat generated by the heat source chip 20 in the operating state can be absorbed by the walls of the shielding groove 303 and transferred to the heat dissipation frame 40.
The shielding groove 303 may be filled with heat dissipation silicone or heat dissipation silicone grease, and the heat dissipation silicone or heat dissipation silicone grease is filled between the heat pipe 30 and the heat dissipation chip to increase the thermal conductivity between the heat source chip 20 and the heat pipe 30.
The heat-dissipating silicone grease is also called as heat-dissipating paste, and is a paste prepared by using special silicone oil as base oil, using novel metal oxide as filler and adding various functional additives and processing the mixture by a specific process, wherein the color of the paste has different appearances due to different materials. The material has good heat conduction, temperature resistance and insulation performance, is an ideal medium material for heat-resistant devices, has stable performance, does not generate corrosive gas in use, and does not influence contacted metals. High purity fillers and silicones ensure smooth, uniform and high temperature insulation of the product. The coating is coated on the assembly surfaces of the power device and the radiator, helps to eliminate air gaps of contact surfaces, increases heat circulation, reduces thermal resistance, reduces the working temperature of the power device, improves reliability and prolongs service life.
Referring to fig. 3, fig. 3 is a schematic structural diagram of another embodiment of a heat pipe 30 provided in the present application.
The heat pipe 30 of the present embodiment is different from the heat pipe 30 of the above-mentioned embodiment in that the width of the end of the heat pipe 30 where the shielding groove 303 is opened is larger than that of the other end of the heat pipe 30. That is, the area of the heat pipe 30 not used for housing the heat source chip 20 may be smaller than the area of the heat pipe 30 used for housing the heat source chip 20, so as to reduce the internal space of the electronic device occupied by the heat pipe 30.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.
The heat pipe 30 may include a first heat pipe 31 and a second heat pipe 32, the evaporation area 301 of the first heat pipe 31 is located corresponding to the heat source chip 20 to absorb heat generated by the heat source chip 20, the number of the first heat pipes 31 may be 1, 2, 3, 4, 8, etc., and the number of the first heat pipes 31 shown in fig. 4 is one. The second heat pipe 32 is connected to the condensation area 302 of the first heat pipe 31 to absorb the heat of the first heat pipe 31 and diffuse the heat of the first heat pipe 31 to the heat dissipation frame 40 of the electronic device, such as a SIM card accommodating frame, which is made of metal material and has excellent thermal conductivity, and the SIM card accommodating frame is used for accommodating a SIM card of the electronic device, and the heat generated in the operating state of the SIM card accommodating frame is less than the heat generated by the heat source chip 20.
Optionally, the SIM card receiving frame is provided with a temperature controller 41, and the temperature controller 41 is used for monitoring the temperature of the SIM card receiving frame. When the value of the temperature controller 41 exceeds a certain threshold (the threshold may be any temperature within a range of 38 degrees celsius to 50 degrees celsius, and the user sets the threshold according to the needs of the user), the SIM card accommodating frame automatically ejects the SIM card to disconnect the communication connection of the electronic device, so as to force the running application in the electronic device to pause, and accordingly, the workload of the heat source chip 20 is correspondingly reduced, and the generation of heat in the heat source chip 20 is reduced. A part of heat can be brought out after the SIM card is popped up, and at the moment, the electronic device is directly communicated and contacted with the outside air through the SIM card opening of the SIM card accommodating frame, so that the heat is accelerated to be diffused to the outside of the electronic device.
The copper shell of heat pipe 30 has the best thermal conductivity in the unfolded state because the wick is the most intact and the capillary porosity of the wick is not destroyed by the folding.
The first heat pipe 31 and the second heat pipe 32 are matched with each other, so that the heat pipe 30 extends to any position of the electronic device with a good heat dissipation effect on the premise of avoiding bending the heat pipe 30 too much, the first heat pipe 31 absorbs heat of the heat source chip 20, and the second heat pipe 32 absorbs heat of the first heat pipe 31 and diffuses the heat of the first heat pipe 31 to other positions of the electronic device with lower temperature, so that the efficiency of transferring heat at the heat source chip 20 to other positions with lower temperature is greatly improved. Optionally, the first heat pipe 31 and the second heat pipe 32 are both of an unbent structure.
The condensation area 302 of the first heat pipe 31 is provided with at least one matching groove 304, the evaporation area of the second heat pipe 32 is provided with a corresponding number of protrusions 305, and the protrusions 305 are inserted into the matching grooves 304 to connect the first heat pipe 31 and the second heat pipe 32 together; or the condensation area 302 of the first heat pipe 31 is provided with at least one protrusion 305, the evaporation area of the second heat pipe 32 is provided with a corresponding number of matching grooves 304, and the protrusions 305 are inserted into the matching grooves 304 to connect the first heat pipe 31 and the second heat pipe 32 together. It should be noted that the end of the first heat pipe 31 and the end of the second heat pipe 32 may be a protrusion 305, and the condensation area and the evaporation area of the heat pipe 30 respectively include the peripheral wall of the heat pipe and the end of the heat pipe.
The matching groove 304 is filled with heat-dissipating silicone or heat-dissipating silicone grease to increase the thermal conductivity of the first heat pipe 31 and the second heat pipe 32. Fig. 4 illustrates the case where the condensation area 302 of the first heat pipe 31 is provided with at least one fitting groove 304 and the evaporation area of the second heat pipe 32 is provided with a corresponding number of protrusions 305.
Optionally, the electronic device further comprises a third heat pipe 33, the third heat pipe 33 being connected to the condensation area of the second heat pipe 32. The third heat pipe 33 can connect a plurality of second heat pipes 32 together, and heat flows in the first heat pipe 31, the second heat pipe 32 and the third heat pipe 33, so that heat diffusion is more uniform, and a local overheating phenomenon cannot occur. Especially, when the heat dissipation frame 40 is a rear case, the user's touch experience may be degraded due to the uneven heat of the rear case.
In addition, the third heat pipe 33 connects the plurality of second heat pipes 32 together, the third heat pipe 33, the first heat pipe 31 and the second heat pipe 32 together form a net-shaped heat dissipation structure, and the first heat pipe 31, the second heat pipe 32 and the third heat pipe 33 are laid in the electronic device, so that the overall strength of the electronic device is greatly enhanced. Optionally, the third heat pipe 33 is of an unbent structure.
Optionally, the sleeve 70 may be sleeved at the contact position between the first heat pipe 31 and the second heat pipe 32, and the contact position between the second heat pipe 32 and the third heat pipe 33, and the sleeve 70 is coated with heat-dissipating silicone grease, so that heat is transferred in the sleeve 70, and the heat is prevented from being uncontrollably diffused to other parts in the electronic device, such as a camera, which generates a large amount of heat when working, and the normal operation of the electronic device is affected by an excessively high temperature.
Referring to fig. 5, fig. 5 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.
The electronic device further comprises a battery 50, and the battery 50 is electrically connected with the circuit board 10.
The heat dissipation frame 40 may be a middle frame, the middle frame includes a bottom plate 42 and a side plate 43, the side plate 43 is disposed around the bottom plate 42 to form a receiving groove 44 with the bottom plate 42, the circuit board 10 and the battery 50 are received in the receiving groove 44 and connected to the middle frame, and the heat source chip 20 is disposed on a side of the circuit board 10 facing the bottom plate 42.
The heat dissipation frame 40 is provided with the clip 45, the heat pipe 30 can be clipped in the clip 45 to be assembled on the heat dissipation frame 40, the evaporation area 301 of the heat pipe 30 is covered on the heat source chip 20 to absorb the heat of the heat source chip 20, the heat dissipation area of the middle frame is large and the middle frame has sufficient contact with the air to rapidly diffuse the heat of the condensation area 302 of the heat pipe 30, thereby preventing the local temperature of the heat source chip 20 from being too high.
Buckle 45 and heat dissipation frame 40 can be integrated into one piece structure, and buckle 45 includes main part 451 and joint portion 452, and main part 451 is connected with heat dissipation frame 40, and joint portion 452 extends the setting perpendicular to main part 451, and heat pipe 30 joint is in the space that main part 451, joint portion 452 and heat dissipation frame 40 enclose and establish. The clip 45 may be a separate component that is mounted to the heat dissipation frame 40. Alternatively, a heat-dissipating silicone grease, or a copper foil is disposed between the heat pipe 30 and the heat source chip 20 to increase heat transfer efficiency.
The heat pipe 30 may be clamped on the bottom plate 42 of the middle frame to divide the accommodating groove 44 into a first accommodating groove 441 and a second accommodating groove 442, the circuit board 10 is accommodated in the first accommodating groove 441, and the battery 50 is accommodated in the second accommodating groove 442. Therefore, a baffle plate for separating the accommodating groove 44 is arranged on the bottom plate 42, the spatial position of the baffle plate is reserved for the heat pipe 30, and the spatial utilization rate of the electronic device is improved.
The heat pipe 30 may be connected to the heat source chip 20 in a bent manner, and may be clamped on the bottom plate 42 of the middle frame to divide the accommodating groove 44 into the first accommodating groove 441 and the second accommodating groove 442. The heat pipe 30 can also be split into a first heat pipe 31 and a second heat pipe 32 to be spliced to realize the technical scheme.
Optionally, the bottom plate 42 of the first receiving groove 441 is provided with a through hole, and the heat source chip 20 and the like sink into the through hole to reduce the thickness of the electronic device in the direction perpendicular to the circuit board.
Optionally, the electronic device further comprises a thermal insulation foam 60, the thermal insulation foam 60 being disposed on a side of the battery 50 facing the heat pipe 30 to prevent heat of the heat pipe 30 from being conducted to the battery 50.
Referring to fig. 6, fig. 6 is a schematic structural diagram of another embodiment of an electronic device provided in the present application.
The heat dissipation assembly includes a circuit board 10, a heat source chip 20, a heat pipe 30, and a heat dissipation frame 40.
The heat dissipating frame 40 is a middle frame, the middle frame includes a first region and a second region opposite to each other, the circuit board 10 is disposed in the first region, the heat source chip 20 is soldered on the circuit board 10 and located between the circuit board 10 and the middle frame, and the battery 50 is accommodated in the second accommodating groove 442 of the second region. The heat pipe 30 includes an evaporation area 301 and a condensation area 302, wherein the evaporation area 301 houses the heat source chip 20, and the condensation area 302 is connected to the second region of the middle frame to conduct heat of the heat source chip 20 to the second region of the middle frame.
A first embedding groove (not labeled) is formed at the bottom of the second accommodating groove 442 of the second region, and the condensation area 302 of the heat pipe 30 is disposed in the first embedding groove; a second embedding groove (not shown) is formed in the first region corresponding to the heat source chip 20, and the evaporation region 301 of the heat pipe 30 is disposed in the second embedding groove.
Optionally, the middle frame is provided with a third embedding groove (not labeled), the third embedding groove is used for communicating the first embedding groove and the second embedding groove, the heat pipe 30 forms a first bending portion at the joint of the first embedding groove and the third embedding groove, and the heat pipe 30 forms a second bending portion at the joint of the third embedding groove and the second embedding groove.
Referring to fig. 7, fig. 7 is a schematic structural diagram of an electronic device according to another embodiment of the disclosure.
The heat dissipation frame 40 is a middle frame, the middle frame includes a first region and a second region opposite to each other, the second region forms a second receiving groove 442 (see fig. 6) for receiving the battery 50, the circuit board 10 is disposed in the first region, and the heat source chip 20 is soldered on the circuit board 10 and located between the circuit board 10 and the middle frame. The heat pipe 30 includes an evaporation area 301 and a condensation area 302, wherein the evaporation area 301 houses the heat source chip 20, and the condensation area 302 is connected to the second region of the middle frame to conduct heat of the heat source chip 20 to the second region of the middle frame.
The condensation area 302 at least comprises a plurality of sub-condensation areas 302 which are connected in sequence, wherein one sub-condensation area 302 is connected with the evaporation area 301, and the extending directions of every two adjacent sub-condensation areas 302 are different to form a bending structure, so that the plurality of sub-condensation areas 302 are uniformly distributed on the first embedded groove. Optionally, the extending directions of every two adjacent sub-condensation areas 302 are perpendicular to each other, and the plurality of sub-condensation areas 302 form a rectangle and are uniformly distributed at the bottom of the first embedding groove.
Referring to fig. 8, fig. 8 is a schematic structural diagram of another embodiment of the electronic device according to the present application, different from the above embodiment, in the present embodiment, the condensation area 302 is an arc-shaped structure, one end of the arc-shaped structure is connected to the evaporation area 301, and the arc-shaped structure is uniformly distributed on the first embedding groove.
In the embodiment of fig. 7 and 8, the condensation areas 302 of the heat pipes 30 are distributed in a bent (zigzag) manner, so that the contact area between the evaporation area 301 of the heat pipe 30 and the heat source chip 20 is increased, and the contact area between the condensation area 302 of the heat pipe 30 and the second receiving groove 442 is increased, which can better absorb and release heat, and accelerate the heat dissipation speed.
Optionally, in an embodiment, since the area of the second receiving groove 442 is larger than that of the heat source chip 20, and a large number of positions on the second receiving groove 442 can be used for heat dissipation, the shape of the heat pipe 30 can be changed to make the width of the condensation area 302 larger than that of the evaporation area 301, so as to accelerate the heat release efficiency of the condensation area 302.
The above description is only for the purpose of illustrating embodiments of the present invention and is not intended to limit the scope of the present invention, and all modifications, equivalents, and equivalent structures or equivalent processes that can be used directly or indirectly in other related fields of technology shall be encompassed by the present invention.

Claims (10)

1. An electronic device, comprising:
a circuit board;
the heat source chip is welded on the circuit board and electrically connected with the circuit board;
the evaporation area of the heat pipe covers the heat source chip so as to perform electrostatic shielding on the heat source chip and absorb the heat of the heat source chip, and the heat pipe is used for diffusing the heat to the SIM card accommodating frame; and
a heat dissipation frame connected with the heat pipe to absorb heat of the heat pipe;
the temperature controller is arranged on the SIM card accommodating frame and used for monitoring the temperature of the SIM card accommodating frame;
when the numerical value of the temperature controller exceeds a certain threshold value, the SIM card accommodating frame automatically ejects the SIM card.
2. The electronic device of claim 1,
the heat pipe is made of copper, a shielding groove is formed in the evaporation area of the heat pipe, and the heat source chip is contained in the shielding groove to conduct electrostatic shielding on the heat source chip.
3. The electronic device of claim 2,
and heat dissipation silica gel or heat dissipation silicone grease is filled in the shielding groove so as to increase the heat conductivity between the heat source chip and the heat pipe.
4. The electronic device of claim 2,
the width of one end of the heat pipe, provided with the shielding groove, is larger than that of the other end of the heat pipe.
5. The electronic device of claim 1,
the heat pipe comprises a first heat pipe and a second heat pipe, the position of the evaporation area of the first heat pipe corresponds to the heat source chip, and the second heat pipe is connected with the condensation area of the first heat pipe so as to diffuse the heat of the first heat pipe.
6. The electronic device of claim 5,
the condensation area of the first heat pipe is provided with at least one matching groove, the evaporation area of the second heat pipe is provided with a corresponding convex part, and the convex part is inserted into the matching groove; or
The condensation area of the first heat pipe is provided with at least one convex part, the evaporation area of the second heat pipe is provided with a corresponding matching groove, and the convex part is inserted into the matching groove.
7. The electronic device of claim 6,
the electronic device further comprises a third heat pipe, and the third heat pipe is connected with the condensation area of the second heat pipe so as to form a net-shaped heat dissipation structure together with the first heat pipe and the second heat pipe.
8. The electronic device of claim 1,
the heat dissipation frame is a middle frame, the middle frame comprises a bottom plate and a side plate, the side plate surrounds the bottom plate to form a containing groove with the bottom plate, the circuit board is contained in the containing groove and connected with the bottom plate, and the heat source chip is arranged on one side, facing the bottom plate, of the circuit board.
9. The electronic device of claim 8,
the heat pipe is arranged on the bottom plate so as to divide the accommodating groove into a first accommodating groove and a second accommodating groove, and the circuit board is accommodated in the first accommodating groove;
the electronic device further comprises a battery, and the battery is accommodated in the second accommodating groove.
10. The electronic device of claim 9,
the electronic device is also provided with heat insulation foam, and the heat insulation foam is arranged on the side face, facing the heat pipe, of the battery so as to prevent heat of the heat pipe from being conducted to the battery.
CN201810597228.1A 2018-06-11 2018-06-11 Electronic device Active CN108617083B (en)

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Application Number Priority Date Filing Date Title
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CN108617083B true CN108617083B (en) 2020-01-17

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Publication number Priority date Publication date Assignee Title
CN101765352A (en) * 2008-12-23 2010-06-30 富瑞精密组件(昆山)有限公司 Flat type heat conducting pipe and heat radiating module using same
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CN105828572A (en) * 2015-11-30 2016-08-03 维沃移动通信有限公司 Heat radiation device and electronic apparatus
CN205726842U (en) * 2015-09-16 2016-11-23 宏碁股份有限公司 Radiating module
CN106231863A (en) * 2016-07-28 2016-12-14 广东欧珀移动通信有限公司 Pcb board assembly and there is its mobile terminal

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105378916B (en) * 2013-12-13 2018-09-28 华为终端(东莞)有限公司 Radiator structure and electronic device with the radiator structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101765352A (en) * 2008-12-23 2010-06-30 富瑞精密组件(昆山)有限公司 Flat type heat conducting pipe and heat radiating module using same
CN105472940A (en) * 2014-08-20 2016-04-06 中兴通讯股份有限公司 Terminal cooling device and mobile terminal
CN205726842U (en) * 2015-09-16 2016-11-23 宏碁股份有限公司 Radiating module
CN105828572A (en) * 2015-11-30 2016-08-03 维沃移动通信有限公司 Heat radiation device and electronic apparatus
CN106231863A (en) * 2016-07-28 2016-12-14 广东欧珀移动通信有限公司 Pcb board assembly and there is its mobile terminal

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