CN108617083A - A kind of electronic device - Google Patents
A kind of electronic device Download PDFInfo
- Publication number
- CN108617083A CN108617083A CN201810597228.1A CN201810597228A CN108617083A CN 108617083 A CN108617083 A CN 108617083A CN 201810597228 A CN201810597228 A CN 201810597228A CN 108617083 A CN108617083 A CN 108617083A
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- China
- Prior art keywords
- heat
- heat pipe
- electronic device
- source chip
- heat source
- Prior art date
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- 238000001704 evaporation Methods 0.000 claims abstract description 28
- 238000003860 storage Methods 0.000 claims description 24
- 239000004519 grease Substances 0.000 claims description 13
- 230000013011 mating Effects 0.000 claims description 10
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000006260 foam Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 16
- 238000005452 bending Methods 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002199 base oil Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This application provides a kind of electronic devices.The electronic device includes circuit board, heat source chip, heat pipe and heat-dissipating frame, heat source chip welds on circuit boards to be electrically connected with circuit board, the evaporating area of heat pipe is located on heat source chip, to carry out electrostatic screen to heat source chip and absorb the heat of heat source chip, heat-dissipating frame is connect with heat pipe to absorb the heat of heat pipe.The application heat pipe can carry out electrostatic screen to heat source chip or absorb the heat of heat source chip.
Description
Technical field
This application involves the technical field of heat dissipation of electronic device, more particularly to a kind of electronic device.
Background technology
As smart mobile phone is universal, for smart mobile phone during long-time use, user can be clearly felt that the hair of mobile phone
Heat, by detection, when operating handset, wherein mobile phone CPU fevers to be main the reason is that.Mobile phone CPU is a highly integrated SOC
Chip, its inside are not merely integrated with CPU central dies and GPU graph processing chips, and also bluetooth, GPS, radio frequency etc. is a series of
Key chip module, is the highest chip of integrated level in smart mobile phone chips, and module can all radiate largely in working at high speed
Heat.It is directed to the heat dissipation problem of mobile phone at present, there are many solutions, but heat dissipation effect is all undesirable.
Apply for content
This application provides a kind of electronic device, which includes circuit board, heat source chip, heat pipe and heat sink
Frame, heat source chip weld on circuit boards to be electrically connected with circuit board, and the evaporating area of heat pipe is located on heat source chip, with right
Heat source chip carries out electrostatic screen and absorbs the heat of heat source chip, and heat-dissipating frame is connect with heat pipe to absorb the heat of heat pipe.
The application heat pipe can carry out electrostatic screen to heat source chip or absorb the heat of heat source chip.
The electronic device of the application includes circuit board, heat source chip, heat pipe and heat-dissipating frame, and heat source chip is electric with circuit board
Property connection, heat source chip generates a large amount of heat in working condition, and to generate electromagnetism to surrounding components dry for heat source chip
It disturbs or surrounding components generates it electromagnetic interference, heat pipe has the function of electrostatic screen and heat conduction function, the evaporating area cover of heat pipe
When being located on heat source chip, can electrostatic screen be carried out to heat source chip simultaneously and absorb the heat of heat source chip, so as to
A shielding case being arranged between heat pipe and heat source chip is saved, heat pipe and heat source chip is made to be in direct contact, improves heat dissipation effect
Fruit.
Description of the drawings
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present application, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the structural schematic diagram of an embodiment of electronic device provided by the present application；
Fig. 2 is the structural schematic diagram of an embodiment of heat pipe provided by the present application；
Fig. 3 is the structural schematic diagram of another embodiment of heat pipe provided by the present application；
Fig. 4 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Fig. 5 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Fig. 6 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Fig. 7 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Fig. 8 is the structural schematic diagram of another embodiment of electronic device provided by the present application.
Specific implementation mode
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation describes.It is understood that specific embodiment described herein is only used for explaining the application, rather than the limit to the application
It is fixed.It also should be noted that illustrating only for ease of description, in attached drawing and the relevant part of the application and not all knot
Structure.Based on the embodiment in the application, those of ordinary skill in the art are obtained without creative efforts
All other embodiment, shall fall in the protection scope of this application.
The electronic device that the embodiment of the present application is provided, including smart mobile phone, tablet computer, intelligent wearable device, number
The electronic equipments such as audio/video player, electronic reader, handheld game machine and vehicle electronic device.
Term " first " in the application, " second " are used for description purposes only, and are not understood to indicate or imply opposite
Importance or the quantity for implicitly indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be bright
Show or implicitly include at least one this feature.In the description of the present application, the meaning of " plurality " is at least two, such as two
It is a, three etc., unless otherwise specifically defined.The directional instruction of institute in the embodiment of the present application (such as upper and lower, left,
It is right, forward and backward ...) be only used for explaining relative position relation under a certain particular pose (as shown in the picture) between each component,
Motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes correspondingly.In addition, term
" comprising " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as contain series of steps
Or process, method, system, product or the equipment of component, the step of being not limited to list or component, but optionally also wrap
The step of not listing or component are included, or further includes optionally for the intrinsic other steps of these processes, method, product or equipment
Rapid or component.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Referring to Fig. 1, Fig. 1 is the structural schematic diagram of an embodiment of electronic device provided by the present application.
In the present embodiment, electronic device includes circuit board 10, heat source chip 20, heat pipe 30 and heat-dissipating frame 40.
Heat source chip 20 welding on the circuit board 10 with circuit board 10 be electrically connected, heat source chip 20 include CUP, GPU,
Radio frequency chip or GPS chip etc., these chips will produce a large amount of heat in working condition, near heat source chip 20
Temperature can influence its working efficiency and service life when rising to 55 degrees Celsius or more.
Heat pipe 30 is made of copper shell, liquid-sucking core and end cap.It is to be pumped into negative pressure state inside copper shell, is filled with suitable
When liquid, this boiling point of liquid is low, readily volatilized.The inner wall of shell has liquid-sucking core, is made of capillary-porous material.Heat pipe
30 one end is evaporating area 301, and opposite one end is condensing zone 302, when one end of heat pipe 30 is heated, the liquid in heat pipe 30
Rapid vaporization, steam flows to other end under the power of thermal diffusion, and releases heat in cold end condensation, and liquid is again along porous
Material flows back to evaporating area 301 by capillarity, and so cycle is more than, until 30 both ends temperature of heat pipe is equal.
In the present embodiment, the evaporating area 301 of heat pipe 30 is located on heat source chip 20 and is connect with heat-dissipating frame 40, heat
The material of pipe 30 is metal material, such as copper, aluminium etc..Heat pipe 30, which is located on heat source chip 20, to play heat source chip 20
To the effect of electrostatic screen, to prevent outer bound pair heat source chip 20 or heat source chip 20 from causing electrostatic interference to the external world.Together
When, heat pipe 30 can conduct heat, and the operation principle of heat pipe 30 is to utilize medium after 301 evaporation endothermic of evaporating area in condensing zone
The phase transition process of 302 condensation heat dissipations, to make heat quickly be conducted from the high position of temperature to temperature lower position.Heat pipe 30 is provide with
The heat of heat source chip 20 can be absorbed on heat source chip 20 and conducts the heat of heat source chip 20 to heat-dissipating frame 40.
Heat-dissipating frame 40 can be that SIM card houses frame, center frame, middle frame bottom plate or rear shell etc., and Fig. 1 is shown
Be heat-dissipating frame 40 be center the case where.
Wherein, center 10 is a kind of housing unit of electronic device comprising two opposite sides, wherein on leading flank
Display screen component is set, the components such as setting circuit board, battery on trailing flank, then leading flank connect with front housing, trailing flank and
Rear shell connects to form electronic device body.General center 10 makes for metal alloy compositions, for example, steel plate, magnesium alloy etc..
It is the structural schematic diagram of an embodiment of heat pipe 30 provided by the present application please refer to Fig. 1 and Fig. 2, Fig. 2.
The evaporating area 301 of heat pipe 30 offers shielding trench 303, and shielding trench 303 is for housing heat source chip 20, with to heat source
Chip 20 carries out electrostatic screen.In addition, generated heat can be by the cell wall of shielding trench 303 when heat source 20 working condition of chip
It absorbs and reaches heat-dissipating frame 40.
Thermal grease can be filled in shielding trench 303, and either heat dissipating silicone grease thermal grease or heat dissipating silicone grease are full of in heat
Between pipe 30 and heat radiation chip, to increase the thermal conductivity between heat source chip 20 and heat pipe 30.
Above-mentioned heat dissipating silicone grease popular name is called thermal grease, is to make base oil with extraordinary silicone oil, novel metal oxide is filled out
Material, is equipped with multiple functions additive, the paste being process through specific technique, and color has different because of material difference
Appearance.It, with good heat conduction, heatproof, insulation performance, is the ideal dielectric material of heat-resisting device, and performance is stablized,
It not will produce etchant gas in use, the metal contacted will not be had an impact.The filler and organosilicon of high-purity are productions
Product are smooth, uniformly and the guarantee of high-temperature insulation.It is applied to power device and radiator fitting surface, helps the air for eliminating contact surface
Gap increases type of thermal communication, reduces thermal resistance, reduces the operating temperature of power device, improves reliability and prolongs the service life.
Referring to Fig. 3, Fig. 3 is the structural schematic diagram of another embodiment of heat pipe 30 provided by the present application.
Difference lies in heat pipe 30 offers shielding trench to the heat pipe 30 of the present embodiment with the heat pipe 30 in above-described embodiment
The width of 303 one end is more than the other end of heat pipe 30.I.e. heat pipe 30, which is not used in, is provide with the region of heat source chip 20 and can be less than
Heat pipe 30 is used to be provide with the region of heat source chip 20, reduces the inner space that heat pipe 30 occupies electronic device with this.
Referring to Fig. 4, Fig. 4 is the structural schematic diagram of another embodiment of electronic device provided by the present application.
Heat pipe 30 may include the first heat pipe 31 and the second heat pipe 32, and the position of the evaporating area 301 of the first heat pipe 31 corresponds to
In heat source chip 20, to absorb heat caused by heat source chip 20, the quantity of the first heat pipe 31 can be 1,2,3,4,8 etc.
It it is one Deng, the quantity of the first heat pipe 31 shown in Fig. 4.Second heat pipe 32 is connect with the condensing zone 302 of the first heat pipe 31, to absorb
The heat of first heat pipe 31 is simultaneously accommodating by the heat-dissipating frame 40 of the heat diffusion of the first heat pipe 31 to electronic device, such as SIM card
Frame, it is that metal material structure, excellent heat conductivity, and SIM card house frame for placing electronic device that SIM card, which houses frame,
SIM card, generated heat is few relative to heat caused by heat source chip 20 when working condition.
Optionally, the erection of SIM card accommodating box is equipped with temperature controller 41, and temperature controller 41 is accommodating for monitoring SIM card
The temperature of frame.When the numerical value of temperature controller 41 is more than that (threshold value can be 38 degrees Celsius to 50 degree Celsius ranges to certain threshold value
Interior any temperature, user go to set according to the needs of itself) when, SIM card houses frame and automatically pops up SIM card, to disconnect
The communication connection of electronic device forces the application pause being currently running in electronic device, to the live load of heat source chip 20
Also it is reduced accordingly, and then reduces the generation of heat in heat source chip 20.A part of heat can also be taken after SIM card pop-up out of
Amount is accelerated heat and is expanded at this point, the SIM card trepanning that electronic device houses frame by SIM card is contacted with outside air directly connection
It is dissipated to the outside of electronic device.
Thermal conductivity of the copper shell of heat pipe 30 in non-bending state is best, because liquid-sucking core is most complete shape at this time
State, the capillary-porous structure of liquid-sucking core because of bending without destroying.
First heat pipe 31 and the mutual cooperation of the second heat pipe 32 can make heat under the premise of avoiding flexing heat-pipe 30 too much
Pipe 30 extends at the position of any good heat dissipation effect of electronic device, and the first heat pipe 31 absorbs the heat of heat source chip 20, the
The heat of two heat pipes 32 the first heat pipe 31 of absorption is simultaneously relatively low by other temperature of the heat diffusion of the first heat pipe 31 to electronic device
Position at, to substantially increase the efficiency at the heat transfer at heat source chip 20 to the lower position of other temperature.It can
Selection of land, the first heat pipe 31, the second heat pipe 32 are non-bending structure.
The condensing zone 302 of first heat pipe 31 is provided at least one mating groove 304, and the evaporating area of the second heat pipe 32 is provided with
The protrusion 305 of corresponding number, protrusion 305 are inserted in mating groove 304 so that the first heat pipe 31 and the second heat pipe 32 link together；
Or first the condensing zone 302 of heat pipe 31 be provided at least one protrusion 305, the evaporating area of the second heat pipe 32 is provided with corresponding
The mating groove 304 of quantity, protrusion 305 are inserted in mating groove 304 so that the first heat pipe 31 and the second heat pipe 32 link together.Value
It is to be noted that the end of the first heat pipe 31 and the end of the second heat pipe 32 can be a protrusion 305 uses, heat pipe 30 it is cold
Coagulation zone and evaporating area respectively include the extreme ends of respective corresponding heat pipe peripheral wall and heat pipe.
It is filled out in mating groove 304 and sets thermal grease or heat dissipating silicone grease, to increase leading for the first heat pipe 31 and the second heat pipe 32
It is hot.Fig. 4 shows that the condensing zone 302 of the first heat pipe 31 is provided at least one mating groove 304, the steaming of the second heat pipe 32
Send out the case where corresponding number of protrusion 305 are arranged in area.
Optionally, electronic device further includes third heat pipe 33, and third heat pipe 33 is connect with the condensing zone of the second heat pipe 32.The
Multiple second heat pipes 32 can be connected together by three heat pipes 33, and heat is in the first heat pipe 31, the second heat pipe 32, third heat pipe 33
Middle circulation, heat diffusion more uniformly, the phenomenon that being not in hot-spot.When especially heat-dissipating frame 40 is rear shell, after
The uneven decline that user can be caused to touch experience of shell heat.
In addition, multiple second heat pipes 32 are connected together by third heat pipe 33, third heat pipe 33 and the first heat pipe 31, second
Heat pipe 32 collectively constitutes netted radiator structure, and the first heat pipe 31, the second heat pipe 32 are laid with third heat pipe 33 into electronic device
Greatly strengthen the integral strength of electronic device.Optionally, third heat pipe 33 is non-bending structure.
Optionally, the contact position between the first heat pipe 31 and the second heat pipe 32, the second heat pipe 32 and third heat pipe 33 can be with
It is arranged casing 70, heat dissipating silicone grease is coated in casing 70, to make heat be transmitted in casing 70, heat is avoided uncontrollably to expand
Other positions in electronic device, such as camera are dissipated to, calorific value is big when camera works, and temperature is excessively high to influence it normally
Work.
Referring to Fig. 5, Fig. 5 is the structural schematic diagram of another embodiment of electronic device provided by the present application.
Electronic device further includes battery 50, and battery 50 is electrically connected with circuit board 10.
Heat-dissipating frame 40 can be center, and center includes bottom plate 42 and side plate 43, side plate 43 around bottom plate 42 be arranged with
Bottom plate 42 forms storage tank 44, and circuit board 10, battery 50 are accommodated in storage tank 44 and are connect with center, and heat source chip 20 is arranged
In circuit board 10 towards the side of bottom plate 42.
Heat-dissipating frame 40 is provided with buckle 45, and heat pipe 30 can be arranged in buckle 45 to be assemblied on heat-dissipating frame 40,
The evaporating area 301 of heat pipe 30 is located on heat source chip 20 to absorb the heat of heat source chip 20, the heat dissipation area of center it is big and
Have with air and adequately contact and can promptly open the heat diffusion of the condensing zone 302 of heat pipe 30, to prevent heat source chip
20 local temperatures are excessively high.
Buckle 45 can be an integral molding structure with heat-dissipating frame 40, and buckle 45 includes main part 451 and clamping portion 452,
Main part 451 is connect with heat-dissipating frame 40, and clamping portion 452 is extended perpendicular to main part 451, and heat pipe 30 is connected to main part
451, clamping portion 452 and heat-dissipating frame 40 enclose in the space set.Buckle 45 can also be an individual component assembly in heat sink
On frame 40.Optionally, thermal grease, heat dissipating silicone grease or copper foil are set between heat pipe 30 and heat source chip 20 to increase heat biography
Pass efficiency.
Heat pipe 30 can be fastened on the bottom plate 42 of center, and storage tank 44 is divided into the first storage tank 441 and second
Storage tank 442, circuit board 10 are accommodated in the first storage tank 441, and battery 50 is accommodated in the second storage tank 442.To save
The baffle for separating storage tank 44 is set in bottom plate 42, the spatial position of baffle is left for heat pipe 30, to improve electronics
The space utilization rate of device.
Heat pipe 30 can both realize in the form of bending and connect with heat source chip 20, be also fastened on the bottom plate 42 of center with
Storage tank 44 is divided into the first storage tank 441 and the second storage tank 442.Heat pipe 30 can also split into the first heat pipe 31,
The form of two heat pipes 32 splicing realizes above-mentioned technical proposal.
Optionally, the bottom plate 42 of the first storage tank 441 offers through-hole, and heat source chip 20 etc. is sunk down into through-hole, to subtract
Thickness of the small electronic device on perpendicular circuit board direction.
Optionally, electronic device further includes heat-insulated foam 60, and heat-insulated foam 60 is arranged in battery 50 towards heat pipe 30
On side, to prevent the heat of heat pipe 30 from conducting to battery 50.
It is the structural schematic diagram of another embodiment of electronic device provided by the present application refering to Fig. 6, Fig. 6.
The radiating subassembly includes circuit board 10, heat source chip 20, heat pipe 30 and heat-dissipating frame 40.
Wherein, heat-dissipating frame 40 is center, and center includes opposite first area and second area, and circuit board 10 is set to
First area, heat source chip 20 are welded on circuit board 10, and between circuit board 10 and center, and battery 50 is placed in second
In second storage tank 442 in region.Heat pipe 30 includes evaporating area 301 and condensing zone 302, wherein evaporating area 301 is provide with heat source core
Piece 20, condensing zone 302 are connected to the second area of center, and the heat of heat source chip 20 is conducted to the second area of center.
The bottom of second storage tank 442 of second area is provided with first and is embedded slot (not indicating), the condensing zone of heat pipe 30
302, which are set to first, is embedded in slot；The position that first area corresponds to heat source chip 20 is provided with second and is embedded slot (not indicating), heat
The evaporating area 301 of pipe 30 is set to second and is embedded in slot.
Optionally, center is provided with third and is embedded slot (not indicating), third be embedded slot for be connected to first be embedded slot and the
Two are embedded slot, and heat pipe 30 is embedded slot first and third is embedded the first bending part of junction formation of slot, and heat pipe 30 is embedding in third
If slot and second be embedded slot junction formed the second bending part.
It is the structural schematic diagram of another embodiment of electronic device provided by the present application refering to Fig. 7, Fig. 7.
Wherein, heat-dissipating frame 40 is center, and center includes opposite first area and second area, and second area forms the
Two storage tanks 442 (referring specifically to Fig. 6) are used for set battery 50, and circuit board 10 is set to first area, and heat source chip 20 welds
It is connected on circuit board 10, and between circuit board 10 and center.Heat pipe 30 includes evaporating area 301 and condensing zone 302, wherein
Evaporating area 301 is provide with heat source chip 20, and condensing zone 302 is connected to the second area of center, and the heat of heat source chip 20 is passed
It is directed at the second area of center.
Condensing zone 302 includes at least multiple sub- condensing zones 302 being sequentially connected, one of them sub- condensing zone 302 and evaporation
Area 301 connects, and the extending direction difference of each two adjacent sub- condensing zone 302 is to form bending structure, so that multiple sub- condensations
Area 302 is uniformly distributed in first and is embedded on slot.Optionally, the extending direction of each two adjacent sub- condensing zone 302 is mutually perpendicular to,
Multiple sub- condensing zones 302 form a rectangular uniform and are distributed in the first bottom for being embedded slot.
It is the structural schematic diagram of another embodiment of electronic device provided by the present application referring again to Fig. 8, Fig. 8, is different from upper
Embodiment is stated, in the present embodiment, condensing zone 302 is arcuate structure, and one end of arcuate structure is connect with evaporating area 301, arc
Structure is uniformly distributed in first and is embedded on slot.
In the embodiment of above-mentioned Fig. 7 and Fig. 8, the condensing zone 302 of heat pipe 30 is distributed in a manner of bending (complications), is increased
The contact area of the evaporating area 301 and heat source chip 20 of heat pipe 30, and increase the condensing zone 302 and second of heat pipe 30 and hold
The contact area of slot 442 is set, can preferably be absorbed heat in this way and heat release, radiating rate is accelerated.
Optionally, in one embodiment, since the area of the second storage tank 442 is more than heat source chip 20, the second storage tank
There is a large amount of position to can be used for radiating on 442, it is possible to which the shape of opposite heat tube 30 is changed, and makes the width of condensing zone 302
Degree can also accelerate the exothermal efficiency of condensing zone 302 in this way more than the width of evaporating area 301.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the claims of the application, every to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content is applied directly or indirectly in other relevant
Technical field includes similarly in the scope of patent protection of the application.
Claims (11)
1. a kind of electronic device, which is characterized in that including：
Circuit board；
Heat source chip is welded on the circuit board to be electrically connected with the circuit board；
The evaporating area of heat pipe, the heat pipe is located on the heat source chip, to carry out electrostatic screen simultaneously to the heat source chip
Absorb the heat of the heat source chip；And
Heat-dissipating frame is connect with the heat pipe to absorb the heat of the heat pipe.
2. electronic device according to claim 1, which is characterized in that
The material of the heat pipe is copper, and the evaporating area of the heat pipe offers shielding trench, and the heat source chip is placed in the screen
It covers in slot, to carry out electrostatic screen to the heat source chip.
3. electronic device according to claim 2, which is characterized in that
Thermal grease or heat dissipating silicone grease are filled in the shielding trench, to increase between the heat source chip and the heat pipe
Thermal conductivity.
4. electronic device according to claim 2, which is characterized in that
The heat pipe offers the other end of the width more than the heat pipe of one end of the shielding trench.
5. electronic device according to claim 1, which is characterized in that
The heat pipe includes the first heat pipe and the second heat pipe, and the position of the evaporating area of first heat pipe corresponds to the heat source core
Piece, second heat pipe are connect with the condensing zone of first heat pipe, to spread the heat of first heat pipe.
6. electronic device according to claim 5, which is characterized in that
The condensing zone of first heat pipe is provided at least one mating groove, and the evaporating area of second heat pipe is provided with corresponding
Protrusion, the protrusion is inserted in the mating groove；Or
The condensing zone of first heat pipe is provided at least one protrusion, and the evaporating area of second heat pipe is provided with corresponding
Mating groove, the protrusion are inserted in the mating groove.
7. electronic device according to claim 6, which is characterized in that
The electronic device further includes third heat pipe, and the third heat pipe is connect with the condensing zone of second heat pipe, with institute
State the first heat pipe, second heat pipe collectively constitutes netted radiator structure.
8. electronic device according to claim 1, which is characterized in that
The heat-dissipating frame is center, and the center includes bottom plate and side plate, the side plate around the bottom plate be arranged with institute
It states bottom plate and forms storage tank, the circuit board is accommodated in the storage tank and is connect with the bottom plate, and the heat source chip is set
It sets in the circuit board towards the side of the bottom plate.
9. electronic device according to claim 8, which is characterized in that
The heat pipe is arranged on the bottom plate so that the storage tank is divided into the first storage tank and the second storage tank, the electricity
Road plate is accommodated in first storage tank；
The electronic device further includes battery, and the battery containing is in second storage tank.
10. electronic device according to claim 9, which is characterized in that
The also heat-insulated foam of the electronic device, the heat-insulated foam are arranged on the side of the direction heat pipe of the battery,
To prevent the heat of the heat pipe from conducting to the battery.
11. electronic device according to claim 1, which is characterized in that
The electronic device further includes temperature controller, and the heat-dissipating frame is that SIM card houses frame, and the temperature controller is set
It sets and houses frame in the SIM card, the temperature controller is used to monitor the temperature that SIM card houses frame；
Wherein, when the numerical value of the temperature controller is more than certain threshold value, the SIM card houses frame automatically by SIM card bullet
Go out.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810597228.1A CN108617083B (en) | 2018-06-11 | 2018-06-11 | Electronic device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810597228.1A CN108617083B (en) | 2018-06-11 | 2018-06-11 | Electronic device |
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| CN108617083A true CN108617083A (en) | 2018-10-02 |
| CN108617083B CN108617083B (en) | 2020-01-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN101765352A (en) * | 2008-12-23 | 2010-06-30 | 富瑞精密组件（昆山）有限公司 | Flat type heat conducting pipe and heat radiating module using same |
| WO2015085569A1 (en) * | 2013-12-13 | 2015-06-18 | 华为终端有限公司 | Heat radiation structure and electronic device having the heat radiation structure |
| CN105472940A (en) * | 2014-08-20 | 2016-04-06 | 中兴通讯股份有限公司 | Terminal cooling device and mobile terminal |
| CN105828572A (en) * | 2015-11-30 | 2016-08-03 | 维沃移动通信有限公司 | Heat radiation device and electronic apparatus |
| CN205726842U (en) * | 2015-09-16 | 2016-11-23 | 宏碁股份有限公司 | Heat radiation module |
| CN106231863A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | Pcb board assembly and there is its mobile terminal |
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2018
- 2018-06-11 CN CN201810597228.1A patent/CN108617083B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101765352A (en) * | 2008-12-23 | 2010-06-30 | 富瑞精密组件（昆山）有限公司 | Flat type heat conducting pipe and heat radiating module using same |
| WO2015085569A1 (en) * | 2013-12-13 | 2015-06-18 | 华为终端有限公司 | Heat radiation structure and electronic device having the heat radiation structure |
| CN105472940A (en) * | 2014-08-20 | 2016-04-06 | 中兴通讯股份有限公司 | Terminal cooling device and mobile terminal |
| CN205726842U (en) * | 2015-09-16 | 2016-11-23 | 宏碁股份有限公司 | Heat radiation module |
| CN105828572A (en) * | 2015-11-30 | 2016-08-03 | 维沃移动通信有限公司 | Heat radiation device and electronic apparatus |
| CN106231863A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | Pcb board assembly and there is its mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108617083B (en) | 2020-01-17 |
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